Abstract: An apparatus for testing a semiconductor package, in which a second test circuit board, which is disposed on an upper socket assembly to form a vacuum line in the related art, is removed, and a vacuum guide including two components disposed between an upper socket and an upper package. The vacuum guide including a conductive guide member made of an inelastic insulating material disposed on a conductive region part to prevent an electrical short circuit, and a peripheral guide member made of a metallic material having rigidity and disposed on a peripheral region portion to prevent deformation of a vacuum line, such that a length of a signal path is significantly decreased, high-speed signal transmission is possible. The stable vacuum line is ensured in the upper socket assembly, and vacuum pressure from a vacuum generation device is smoothly applied to a vacuum picker.

Abstract: In an apparatus for testing a package-on-package (POP) type semiconductor package according to the present disclosure, a vacuum picker has vacuum holes that communicate with an insulation pad hole, the vacuum picker includes a body part made of silicone or rubber, and a socket contact part and a package contact part made of any one of polyimide film, engineering plastic, and synthetic resin, and the socket contact part is attached to a mounting groove by means of an adhesive tape, such that the vacuum picker is coupled to an upper socket.

Abstract: According to various example embodiment of the present disclosure, a method of sharing item information by an electronic apparatus includes acquiring a request for link information related to at least one item from a user, acquiring first selection information related to an attribute of the link information, and providing link information on a first page including information related to the at least one item based on the request for the link information and the first selection information, in which the link information may include information related to the attribute.

Abstract: The present invention relates to a novel antibacterial peptide and a composition comprising the same as an active ingredient. The novel antibacterial peptide of the present invention exhibits excellent antibacterial activity against antibiotic-resistant bacteria as well as Gram-positive bacteria and Gram-negative bacteria and is low in cytotoxicity and, as such, can be advantageously utilized as an active ingredient in an antibiotic, a cosmetic composition, a food additive, a feed additive, a biotic pesticide, a quasi-drug product, and the like.

Abstract: The present application provides a heterocyclic compound capable of significantly enhancing lifetime, efficiency, electrochemical stability and thermal stability of an organic light emitting device, an organic light emitting device comprising the heterocyclic compound in an organic material layer, and a composition for an organic material layer.

Abstract: A method for producing black ginseng concentrate is characterized by including steps of adding red ginseng to a continuous steaming-dryer followed by steaming, cooling, and drying to prepare black ginseng, carrying out extraction by adding alcohol to crushed black ginseng obtained by crushing the black ginseng prepared above followed by filtration to prepare black ginseng extract, and concentrating the black ginseng extract prepared above by using a plate type evaporative concentrator followed by heat treatment, and the present invention also relates to black ginseng concentrate prepared by the aforementioned method.

Abstract: A test apparatus for testing a mobile AP provided with an AP package and a memory package according to the disclosure is configured to include: a lower test socket mounted on a tester and connected to the AP package put on an upper side thereof; an upper test socket mounted with the memory package and connected to the AP package put on a lower side thereof; an upper mechanism configured to accommodate the memory package and mounted with the upper test socket; and a heat dissipation device disposed on the upper mechanism. Since heat generated in the AP package can be dissipated through forming of a frame of the upper test socket as an inelastic conductive housing of a metal material having high thermal conductivity, a test can be performed in a step before stacking the AP package and the memory package on each other.

Abstract: Provided are a novel boron-containing compound and an electrolyte solution additive for a secondary battery including the same. The electrolyte solution for a secondary battery provided in one embodiment includes the novel boron-containing compound, thereby suppressing the decomposition of an electrolyte solution to improve the capacity and the life characteristics of a battery.

Abstract: Provided are a novel boron-containing compound and an electrolyte solution additive for a secondary battery including the same. The electrolyte solution for a secondary battery provided in one embodiment includes the novel boron-containing compound, thereby suppressing the decomposition of an electrolyte solution to improve the capacity and the life characteristics of a battery.

Abstract: The present disclosure relates to a novel boron-containing compound and an electrolyte additive for a secondary battery containing the same. An electrolyte for a secondary battery provided in one embodiment contains the novel boron-containing compound, such that decomposition of the electrolyte may be suppressed, thereby improving a capacity and a lifespan of the battery.

Abstract: According to an embodiment of the present invention, an electronic device cover includes: a first plate that can be attached/detached to/from one surface of the electronic device; a second plate overlappingly coupled to the first plate; and a third plate which is connected to the second plate by a hinge and of which the angle formed with the first plate changes according to rotation with respect to the second plate, wherein the second plate and/or the third plate includes a composite material sheet, and at least a portion of the hinge can be positioned inside the composite material sheet. Other various embodiments are possible.

Abstract: Disclosed herein are a microbubble-extracellular vesicle complex, a production method therefor, and a system for driving the same. In one aspect, preferred microbubble-extracellular vesicle complexes may comprise an ultrasound contrast agent-based microbubble, an extracellular cell derived from a natural killer cell (NK cell), a human glial cell, or a human mesenchymal stem cell, and a coupling medium and can be derive in a 3D mode using ultrasonic waves and deliver a drug loaded in the extracellular vesicle to a target site.

Abstract: The present specification provides a heterocyclic compound represented by Chemical Formula 1, an organic light emitting device including the same, and a composition for an organic material layer of the organic light emitting device.

Abstract: According to one aspect of the present invention, there is provided a method for managing a medical information platform using a blockchain, the method comprising the steps of: dynamically calculating an exchange ratio between tokens and points, with reference to at least one of an amount of points that a user intends to exchange for tokens on a medical information platform, an amount of tokens that the user intends to exchange for points on the medical information platform, an amount of tokens present in a token pool managed by the medical information platform, and an amount of points previously exchanged for tokens on the medical information platform; and providing the user with the tokens or points exchanged with reference to the calculated exchange ratio.

Abstract: The present disclosure relates to a test apparatus for a package-on-package type semiconductor package including a lower test socket mounted on a tester, and connected to a lower package to electrically connect the lower package to the tester; a pusher configured to be able to be moved vertically by receiving a driving force from a driving unit; an upper test socket mounted on the pusher, and having an electro-conductive part installed below the upper package to be electrically connected to the upper package; a vacuum picker mounted on the upper test socket to be able to vacuum-adsorb the lower package; and an inelastic insulating sheet installed between the upper test socket and the upper package, having a through hole formed at a position thereof corresponding to the terminal of the upper package and the electro-conductive part.

Abstract: An apparatus for testing a package-on-package type semiconductor package includes an upper test socket on which an upper package is mounted, the upper test socket being mounted on a pusher and connected to the lower package; a lower test socket mounted on a tester and connected to the lower package; and an adsorption pad coupled to the pusher and configured to adsorb and pressurize the lower package using a vacuum pressure, wherein the adsorption pad comprises a body part having a vacuum pressure passage formed therein; and an adsorption part having an adsorption hole corresponding to the vacuum pressure passage, and the body part is attached on a central portion of an upper surface of the adsorption part and an outer oil overflow-preventing part configured to trap silicon oil eluted from the body part is formed at an outer periphery the adsorption part.