Patents by Inventor Song Ping

Song Ping has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230035082
    Abstract: A multifunctional base includes a flexible member and a base connected to an end of the flexible member. The base includes a rigid shell, a connecting edge extends along a periphery of the rigid shell, the flexible member is connected to the base via the connecting edge, and the connecting edge is made of flexible material. A connecting structure and an electronic device are also provided.
    Type: Application
    Filed: June 28, 2022
    Publication date: February 2, 2023
    Inventor: SONG PING CHEN
  • Publication number: 20220368275
    Abstract: Provided is a multifunctional base, which includes a first cover, having a first connecting edge made of flexible material and extended along a periphery of the first cover, the first connecting edge is configured to sealingly connect the multifunctional base with an object; and a second cover, the second cover is connected with first cover to define a receiving space. A bag is also provided.
    Type: Application
    Filed: July 20, 2022
    Publication date: November 17, 2022
    Inventor: Song Ping Chen
  • Patent number: 11425978
    Abstract: A roll top backpack with a waterproof speaker device comprises a speaker device and a roll top backpack, wherein the roll top backpack is provided with a speaker device placement hole, the speaker device is arranged in the speaker device placement hole, and the speaker device is sealed with the speaker device placement hole; due to the fact that the roll top backpack is made of waterproof materials and the speaker device is sealed with the speaker device placement hole, the inner part and the outer part can be waterproof when the whole roll top backpack is rolled up, moisture cannot permeate into the roll top backpack through the speaker device, and cannot permeate out through the speaker device from inside of the backpack, so that the roll top backpack can be used in various environments of outdoor hiking, camping or water sports.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: August 30, 2022
    Assignee: ZTARX CORPORATION LIMITED
    Inventors: Song Ping Chen, Benjamin Goh Swee Hock
  • Publication number: 20200383444
    Abstract: A roll top backpack with a waterproof speaker device comprises a speaker device and a roll top backpack, wherein the roll top backpack is provided with a speaker device placement hole, the speaker device is arranged in the speaker device placement hole, and the speaker device is sealed with the speaker device placement hole; due to the fact that the roll top backpack is made of waterproof materials and the speaker device is sealed with the speaker device placement hole, the inner part and the outer part can be waterproof when the whole roll top backpack is rolled up, moisture cannot permeate into the roll top backpack through the speaker device, and cannot permeate out through the speaker device from inside of the backpack, so that the roll top backpack can be used in various environments of outdoor hiking, camping or water sports.
    Type: Application
    Filed: June 10, 2019
    Publication date: December 10, 2020
    Inventors: Song Ping Chen, Benjamin Goh Swee Hock
  • Patent number: 10364567
    Abstract: A connector for framing material comprises: a limiting member, a connecting member and a first screw. The hexagon portion of the first screw is received between the first stopping plate and the second stopping plate of the limiting member. The through hole of the connecting member is passed by the first screw to form a pre-lock assembly of the limiting member and the connecting member. The first stopping plate and the second stopping plate parallel to the accepting slot direction to place the limiting member in the U-shaped frame, and then the connecting member is rotated and to make a cross with the U-shaped frame, such that the first screw drives the limiting member to rotate to perpendicular to the U-shaped frame.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: July 30, 2019
    Inventor: Song-Ping Shang
  • Publication number: 20180266729
    Abstract: The present invention discloses a high-strength support assembly structure, which utilizes a fastening cover part that can be slidably sleeved onto a C-type steel and an opening side thereof and a flexible internal stand; the flexible internal stand is placed inside of the C-type steel, and the internal stand and the fastening cover part are correspondingly fastened at the opening side of the C-type steel, such that the opening side of the C-type steel can serve as a connecting end or a bearing side. The present invention also discloses using or stacking a single or a plurality of connecting plates, so as to allow one C-type steel to be correspondingly joined to another C-type steel in order to expand a length thereof, or to adapt the C-type steel for serving as a corner.
    Type: Application
    Filed: May 26, 2017
    Publication date: September 20, 2018
    Inventor: Song-Ping SHANG
  • Publication number: 20180187411
    Abstract: A connector for framing material comprises: a limiting member, a connecting member and a first screw. The hexagon portion of the first screw is received between the first stopping plate and the second stopping plate of the limiting member. The through hole of the connecting member is passed by the first screw to form a pre-lock assembly of the limiting member and the connecting member. The first stopping plate and the second stopping plate parallel to the accepting slot direction to place the limiting member in the U-shaped frame, and then the connecting member is rotated and to make a cross with the U-shaped frame, such that the first screw drives the limiting member to rotate to perpendicular to the U-shaped frame.
    Type: Application
    Filed: December 26, 2017
    Publication date: July 5, 2018
    Inventor: Song-Ping Shang
  • Patent number: 8536077
    Abstract: Disclosed herein is a flooring underlayment membrane, and associated methods of manufacturing and installing such a membrane, comprising upper and lower nonwoven fiber layers. In one embodiment, the flooring underlayment membrane constructed as disclosed herein may comprise a first nonwoven fiber material, and a second nonwoven fiber material and at least one layer of extrudable thermoplastic resin disposed between and bonding the first and second nonwoven fiber materials.
    Type: Grant
    Filed: December 29, 2008
    Date of Patent: September 17, 2013
    Assignee: Building Materials Investment Corporation
    Inventors: Daniel LaVietes, David Gladden, Song-Ping Dai
  • Publication number: 20120298167
    Abstract: It is an invention of the structure and manufacturing process of a kind of solar panel, which particularly is for a kind of solar shingle. Junction box is designed at the central area of the solar panel. The bus-bars connecting the electrodes of the solar cell array and the junction box are laid to go over the backside of solar cell array. In order to avoid shorting the circuitry by bus-bars located between solar cells and to prevent delaminating of the layers of the solar cells around the area covered by the bus-bars, an isolating component is in interposed contact between the bus-bar and the solar cells.
    Type: Application
    Filed: May 31, 2011
    Publication date: November 29, 2012
    Inventors: Song Ping Zhou, Lihui Guo
  • Patent number: 7967146
    Abstract: A portion of a container includes a plurality of first resilient support members having a first height. The first resilient support members are configured to contact an edge of a component placed in the container. A plurality of second support members each have a second, smaller height. The second support members are arranged relative to the first resilient support members such that the second support members contact the edge of the component if corresponding ones of the first resilient support members deflect a sufficient amount.
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: June 28, 2011
    Assignee: e.PAK International, Inc.
    Inventors: Song Ping Chen, Ru Zheng Liu
  • Publication number: 20090218030
    Abstract: Disclosed herein is a flooring underlayment membrane, and associated methods of manufacturing and installing such a membrane, comprising upper and lower nonwoven fiber layers. In one embodiment, the flooring underlayment membrane constructed as disclosed herein may comprise a first nonwoven fiber material, and a second nonwoven fiber material and at least one layer of extrudable thermoplastic resin disposed between and bonding the first and second nonwoven fiber materials.
    Type: Application
    Filed: December 29, 2008
    Publication date: September 3, 2009
    Applicant: Building Materials Investment Corporation
    Inventors: Daniel LaVietes, David Gladden, Song-Ping Dai
  • Publication number: 20090064193
    Abstract: Systems for selective logging events in a network. In particular implementations, a method includes receiving indications of events associated with a network application; selectively flagging one or more of the events for logging; and applying the events to a processing stream comprising a plurality of process modules. The process modules are operative to receive events from another process module; apply one or more operations in response to the received events; and conditionally transmit one or more log messages identifying flagged events to a log data store.
    Type: Application
    Filed: September 5, 2007
    Publication date: March 5, 2009
    Applicant: Yahoo! Inc.
    Inventors: Ryo Chijiiwa, Felix Zodak Lee, Brent Douglas Miller, Albert Song-Ping Wang
  • Publication number: 20090038963
    Abstract: A portion of a container includes a plurality of first resilient support members having a first height. The first resilient support members are configured to contact an edge of a component placed in the container. A plurality of second support members each have a second, smaller height. The second support members are arranged relative to the first resilient support members such that the second support members contact the edge of the component if corresponding ones of the first resilient support members deflect a sufficient amount.
    Type: Application
    Filed: July 11, 2008
    Publication date: February 12, 2009
    Inventors: Song Ping Chen, Ru Zheng Liu
  • Publication number: 20080268632
    Abstract: A pad manufacturing process applied in LED epiwafer and a new construction thereof comprising of a means to increase interfacial bonding strength being provided first to the surface of the epiwafer; followed with a metal deposition means provided to the surface of the epiwafer by having the surface processed with plasma to improve adhesion between pad and epiwafer; and plating conditions being controlled to obtain finer and more uniform grains to correct the problem of pad surface roughness in order to improve the bonding strength between pad and bonding wire. Furthermore, a new construction of epiwafer and a pad is comprised of an epiwafer containing a substrate, an epitaxial layer, and a first metal layer covering the top of the epitaxial layer; an adhesion layer covering the top of the first metal layer; and a pad covering the top of the adhesion layer in sequence.
    Type: Application
    Filed: April 30, 2007
    Publication date: October 30, 2008
    Inventors: Song- Ping Luh, Chiang Jung Hwa, Ming- Shun Lee
  • Patent number: 7425362
    Abstract: A plastic cushion pad (40) includes at least one plastic spring portion (46) between oppositely facing contact surfaces (42, 44). In one example, the pad (40) is vacuum formed using a film of carbon-impregnated polystyrene material. The plastic spring portion (46) is configured to provide the desired amount of resiliency or cushion provided by the pad responsive to a compressive force. In one example, the plastic spring portion is designed to prevent any lateral deformation of the pad when a compressive force is applied.
    Type: Grant
    Filed: March 11, 2003
    Date of Patent: September 16, 2008
    Assignee: e.Pak International, Inc.
    Inventors: James R. Thomas, Clifton C. Haggard, Jason D. Brown, Song Ping Chen, Ru Zheng Liu, Michael L. Hayden
  • Patent number: 7147107
    Abstract: A platform (40) has a rigid body with an adjustable thickness (t) to selectively occupy any remaining space within a container (20) used for packaging items such as semiconductor wafers (22). The platform (40) in one example has a first portion (42) and a second portion (44). Adjusting the positions of the first and second portions (42, 44) relative to each other selectively varies the thickness (t) of the platform (40) to achieve the desired thickness.
    Type: Grant
    Filed: March 11, 2003
    Date of Patent: December 12, 2006
    Assignee: e.PAK International, Inc.
    Inventors: Clifton C. Haggard, James R. Thomas, Song Ping Chen, Ru Zheng Liu
  • Patent number: 6988620
    Abstract: A container for packaging items such as semiconductor wafers has a restraining portion with a changeable dimension at an open end that facilitates using conventional loading techniques while also more securely containing the items to avoid undesirable movement of the items in the container. In one example embodiment, the restraining portion includes a sidewall portion that has a first, nominal inside dimension at one end. A second end of the sidewall portion has a second, greater inside dimension at an open end. Another member of the container cooperates with the sidewall portion to change the inside dimension at the open end from the second, greater dimension to the first, nominal dimension. The nominal dimension is selected to correspond to an exterior dimension of the items to be contained within the package so that the container maintains the items in a secure alignment that eliminates lateral movement of the items once the container is secured.
    Type: Grant
    Filed: March 11, 2003
    Date of Patent: January 24, 2006
    Assignee: e.PAK International, Inc.
    Inventors: Clifton C. Haggard, James R. Thomas, Song Ping Chen, Ru Zheng Liu
  • Publication number: 20050275422
    Abstract: A testing method for testing an integrated circuit device includes the steps of forming compliant bumps on bonding pads on a substrate of the device such that each of the compliant bumps has a polymeric body formed on a corresponding one of the bonding pads and a metal layer formed on the polymeric body, and such that the metal layer has a probe-contacting surface formed with a plurality of recesses, and testing electrical continuity between the metal layer of each of the compliant bumps and a corresponding circuit of the device by contacting a probe of a testing apparatus with the recessed probe-contacting surface of the metal layer.
    Type: Application
    Filed: October 12, 2004
    Publication date: December 15, 2005
    Inventors: Song-Ping Luh, Kun-Yung Huang, Chung-Hung Wang
  • Patent number: D639154
    Type: Grant
    Filed: November 21, 2007
    Date of Patent: June 7, 2011
    Assignee: E.Pak International, Inc.
    Inventors: Song Ping Chen, Ru Zheng Liu
  • Patent number: D915352
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: April 6, 2021
    Inventors: Song Ping Chen, Benjamin Goh Swee Hock