Abstract: A carrier for handling integrated circuit components during storage and shipping includes a plurality of pocket portions each for supporting an individual component. The pocket portions include a base surface and a plurality of sidewalls defining the pocket generally. The sidewalls include support surfaces arranged at a first, oblique angle relative to the base surface. A plurality of retainer surfaces are associated with at least some of the support surfaces. The retainer surfaces extend at a second angle relative to the base surface. The retainer surfaces cooperate with the support surfaces to maintain the integrated circuit components within the pockets in a desired alignment throughout handling. One example includes guide surfaces that facilitate inserting the components into the pockets.

Abstract: A platform (40) has a rigid body with an adjustable thickness (t) to selectively occupy any remaining space within a container (20) used for packaging items such as semiconductor wafers (22). The platform (40) in one example has a first portion (42) and a second portion (44). Adjusting the positions of the first and second portions (42, 44) relative to each other selectively varies the thickness (t) of the platform (40) to achieve the desired thickness.

Abstract: A container for packaging items such as semiconductor wafers has a restraining portion with a changeable dimension at an open end that facilitates using conventional loading techniques while also more securely containing the items to avoid undesirable movement of the items in the container. In one example embodiment, the restraining portion includes a sidewall portion that has a first, nominal inside dimension at one end. A second end of the sidewall portion has a second, greater inside dimension at an open end. Another member of the container cooperates with the sidewall portion to change the inside dimension at the open end from the second, greater dimension to the first, nominal dimension. The nominal dimension is selected to correspond to an exterior dimension of the items to be contained within the package so that the container maintains the items in a secure alignment that eliminates lateral movement of the items once the container is secured.

Abstract: A plastic cushion pad (40) includes at least one plastic spring portion (46) between oppositely facing contact surfaces (42, 44). In one example, the pad (40) is vacuum formed using a film of carbon-impregnated polystyrene material. The plastic spring portion (46) is configured to provide the desired amount of resiliency or cushion provided by the pad responsive to a compressive force. In one example, the plastic spring portion is designed to prevent any lateral deformation of the pad when a compressive force is applied.

Abstract: Disclosed is a analgesic composition containing the purified HWAP-I polypeptide of the Chinese bird spider, Selenocosmia Huwena.

Abstract: A carrier for handling integrated circuit components during storage and shipping includes a plurality of pocket portions each for supporting an individual component. The pocket portions include a base surface and a plurality of sidewalls defining the pocket generally. The sidewalls include support surfaces arranged at a first, oblique angle relative to the base surface. A plurality of retainer surfaces are associated with at least some of the support surfaces. The retainer surfaces extend at a second angle relative to the base surface. The retainer surfaces cooperate with the support surfaces to maintain the integrated circuit components within the pockets in a desired alignment throughout handling. One example includes guide surfaces that facilitate inserting the components into the pockets.

Abstract: Disclosed is a analgesic composition containing the purified HWAP-I polypeptide of the Chinese bird spider, Selenocosmia Huwena.

Abstract: A method for cleaning a polymer in a trench produced by a dry anisotropic etching process is disclosed. The method includes steps of introducing a gas into a trench for reacting with the polymer to form a volatile substance and removing the remaining polymer in the trench by a wet etching process. The gas is preferably a gaseous hydrofluoric acid to clean the polymer. Because the gas can enter the small hole of the deep trench easily, this method can completely remove the polymer in the trench.

Abstract: Novel plant promoters isolated from cotton fiber tissues are provided. The plant promoters are located upstream cotton plant genes KC03, KC18, KC22, and Gh3, all of which are expressed in cotton fibers, and contain (a) DNA having the nucleotide sequence of SEQ ID NO:1, 6, 11, or 16. Also provided are plant expression vectors prepared by introducing the plant promoters into appropriate vectors; transformed plant cells prepared by introducing the plant expression vectors into host plant cells; transformed plants regenerated from the transformed plant cells; transformed plant seeds obtained from the transformed plants; and processes for producing transformed plants from the plant seeds.

Abstract: A component carrier, for holding for purposes of automated visual inspection an electrical component having a lead with a free end, includes a carrier substrate and a pocket recessed in the substrate for holding the component in the interior of the pocket. The pocket includes a wall, depending from the carrier substrate and defining a lateral boundary of the pocket, and a bottom. There is a lead-tip horizontal plane and a lead-tip vertical plane when a correctly constructed component of the type the carrier is intended to hold is properly oriented in the pocket. The lead-tip vertical plane is perpendicular to a longitudinal axis of the pocket. The wall slopes down and inwardly at a first angle relative to the substrate through the lead-tip horizontal plane and at a second angle relative to the substrate through the lead-tip vertical plane. The first angle is greater than or equal to approximately 75.degree. and less than or equal to 90.degree., and the second angle is less than 90.degree.