Abstract: A method of forming a pre-molded lead frame having increased stand-offs includes the steps of attaching a first tape to a first side of the lead frame and a second tape to a second side of the lead frame. The taped lead frame is placed in a mold and a first flow of mold compound is initiated. The first flow of the mold compound fills a space between the first tape and an upper mold chase of the mold. A second flow of the mold compound then is initiated. The second flow of the mold compound fills the spaces between a die pad and leads of the lead frame. The first and second tapes then are removed from the lead frame. Improved stand-offs are provided because the first tape was depressed by the first flow of the mold compound.

Abstract: A heat dissipation device adapted for cooling an electronic device mounted on a printed circuited board includes a heat spreader thermally contacting the electronic device, a fin assembly comprising a plurality of fins, a first heat pipe interconnecting the fin assembly and the heat spreader and a plurality of supporting posts inserted in the fin assembly.

Abstract: A heat dissipation device assembly includes a heat dissipation device for dissipating heat from an electronic element and a protective device assembly. The heat dissipation device includes a base with fasteners extending therethrough, a plurality of fins arranged on a top of the base, and a heat conducting plate attached on a bottom of the base. A thermal interface material is spread on a bottom surface of the heat conducting plate. The protective device assembly includes a first cover attached to a bottom of the heat conducting plate and a second cover separated from the first cover and attached to a lateral side of the base. The first cover protects the thermal interface material from being contaminated and the second cover protects the fasteners from dropping from the base, when the heat dissipation device is transported.

Abstract: A method of forming a pre-molded lead frame having increased stand-offs includes the steps of attaching a first tape to a first side of the lead frame and a second tape to a second side of the lead frame. The taped lead frame is placed in a mold and a first flow of mold compound is initiated. The first flow of the mold compound fills a space between the first tape and an upper mold chase of the mold. A second flow of the mold compound then is initiated. The second flow of the mold compound fills the spaces between a die pad and leads of the lead frame. The first and second tapes then are removed from the lead frame. Improved stand-offs are provided because the first tape was depressed by the first flow of the mold compound.

Abstract: Systems and methods are disclosed herein to provide software clock boosting techniques. For example in one embodiment, a method of configuring a programmable logic device includes receiving routed data; performing a software clock boost operation on the routed data to determine and include one or more desired clock delays for circuit elements. The software clock boost operation may include performing a static timing analysis on the routed data; determining a list of the desired clock delays; and modifying the routed data to insert the desired clock delays.

Abstract: The invention relates to an analog of human interleukin-11 (IL-11) polypeptide which has increased potency and stability relative to wild-type IL-11 and which is therapeutically effective at low doses.

Abstract: The present invention relates to novel coumarin derivatives, their carboxamides, pharmaceutical compositions containing them and their uses as drugs for kidney protection, treating drugs of hypertension, cardio-cerebrovascular diseases, non-insulin dependent diabetes, tumor, pre-cancerous lesion, and edemas.

Abstract: A method for fabricating thin film nanostructures is provided. A layer of material on a substrate is mechanically displaced using an atomic force microscopy tip. The displacement is carried out in a fluid containing molecules which rapidly enter the void created by the AFM tip and bind to the clean substrate surface. These molecules are spatially confined in the void created by the displacement and form inlaid structures within the surrounding material. The surrounding material can be removed to create islands of the new material. The method is particularly adapted for use in fabricating nanometer-scale microelectronic devices.