Abstract: A method of manufacturing a waterproof board switch according to the first embodiment comprises the following steps: (A) arranging a plurality of print circuit boards on a board plate, each of the print circuit board having a top pattern on a front surface and a bottom pattern on a rear surface; (B) insulating the rear surface of the print circuit board; (C) forming a board ass'y by thermo-compression bonding an insulation adhesive film having a dome hole to the front surface of the print circuit board; (D) forming a plurality of board holes near both edges of the dome hole on the board ass'y; (E) resting a metal dome on the dome hole such that the metal dome is able to be in contact with the top pattern; (F) arranging a top coverlay having bigger width than the insulation adhesive film on the board ass'y such that the top coverlay covers the dome hole; (G) arranging a thermoplastic resin above the top coverlay, arranging a top jig above the thermoplastic resin, arranging a bottom jig below the board ass'y an

Abstract: Disclosed herein are a pump tower installation structure of a liquefied natural gas (LNG) storage tank and a manufacturing method thereof. The pump tower installation structure of the LNG storage tank includes an adaptor disposed at a predetermined area of an opening portion formed at an inner hull disposed on an upper side of the LNG storage tank, and a cover having through-holes corresponding to pipes of the pump tower installed at the storage tank, and disposed at a remaining area of the opening portion to be connected with the adaptor.

Abstract: The invention relates to a PCB tact switch, and more particularly, to a PCB tact switch having excellent water resistance because same does not have holes on the top and bottom which are open to the outside, capable of preventing erroneous operation through improved contact point safety, and capable of preventing product disengagement through improved fixing strength by being soldered to a substrate.

Abstract: The present invention relates to a stent for intraluminal expansion. The stent for intraluminal expansion comprises an inner stent A, an outer stent B and fixing threads C for fixing these stents as one unit. The outer stent B is inserted over the inner stent A in such a way that the space portions of the inner stent A and the space portions of the outer stent B are alternated with each other, so the outer surface of the inner stent and the inner surface of the outer stent are in close contact with each other, and both ends of the outer stent and inner stent are fixed as one unit by fixing threads C.

Abstract: The present invention relates to a test socket for a semiconductor device, which may correspond to a narrow pitch of terminal interval and high speed test in a simplified structure, thereby reducing manufacturing cost thereof. The test socket for a semiconductor device includes conductive substrates having contact point parts exposed at upper and lower surfaces for contacting the terminals of the semiconductor device and the lead terminals of the test board, and slant parts connecting the contact point parts and facing each other in repetitive arrangement, and an insulating elastic element filled in positions where the slant parts are formed as the contact point parts of the conductive substrate are exposed to the outside so as to fix the conductive substrates.

Abstract: The present invention relates to a test socket for a semiconductor device, which may correspond to a narrow pitch of terminal interval and high speed test in a simplified structure, thereby reducing manufacturing cost thereof. The test socket for a semiconductor device includes conductive substrates having contact point parts exposed at upper and lower surfaces for contacting the terminals of the semiconductor device and the lead terminals of the test board, and slant parts connecting the contact point parts and facing each other in repetitive arrangement, and an insulating elastic element filled in positions where the slant parts are formed as the contact point parts of the conductive substrate are exposed to the outside so as to fix the conductive substrates.

Abstract: The present invention relates to a PCB-type tactile switch, which improves clicking operation and prevents operational errors, thus improving functionality and reliability of products including the tactile switch. The tactile switch of the present invention comprises an insulating member (100), an interval maintaining member (200), a lower pattern (300), a solder mask (400), a groove (500), a upper conducting coat (600), a lower conducting coat (610), a short circuit part of electricity (700), a metal dome (800), and a cover layer (900).