Abstract: The present invention relates to a multi-conjugate of small interfering RNA (siRNA) and a preparing method of the same, more precisely a multi-conjugate of siRNA prepared by direct binding of double stranded sense/antisense siRNA monomers or indirect covalent bonding mediated by a cross-linking agent or a polymer, and a preparing method of the same. The preparing method of a siRNA multi-conjugate of the present invention is characterized by simple and efficient reaction and thereby the prepared siRNA multi-conjugate of the present invention has high molecular weight multiple times the conventional siRNA, so that it has high negative charge density, suggesting that it has excellent ionic interaction with a cationic gene carrier and high gene delivery efficiency.

Abstract: Provided is a peptide composition for preventing or treating Alzheimer's dementia. A peptide or a salt substituent thereof according to the presently claimed subject matter exhibits effects such as suppression of LPS-mediated cytokine production, suppression of LPS-induced neuroinflammation, amelioration of cognitive impairment, suppression of beta amyloid or tau protein aggregation, and suppression of neuronal loss. The polypeptide or the salt substituent thereof can permeate the blood-brain barrier, and thus, is expected to be usefully used for preventing or treating Alzheimer's dementia.

Abstract: Proposed is a rubber composition for a tire tread, which includes: a solution-polymerized elastomer having a conjugated diene-based monomer unit, a solution-polymerized elastomer having an aromatic vinyl monomer unit and a conjugated diene-based monomer unit, or a combination thereof, at 100 parts by weight; and a plasticizer containing an aromatic petroleum resin and an aliphatic olefin polymer, at 10 to 50 parts by weight. Further, a manufacturing method of the rubber composition for a tire tread is proposed.

Abstract: Proposed is a rubber composition for a tire tread, which includes: a solution-polymerized elastomer having a conjugated diene-based monomer unit, a solution-polymerized elastomer having an aromatic vinyl monomer unit and a conjugated diene-based monomer unit, or a combination thereof, at 100 parts by weight; and a plasticizer containing an aromatic petroleum resin and an aliphatic olefin polymer, at 10 to 50 parts by weight. Further, a manufacturing method of the rubber composition for a tire tread is proposed.

Abstract: Provided is a composition for detecting a protein, containing a tyrosine oxide-coupled biomaterial. Various diseases may be easily and rapidly diagnosed by easily detecting the composition containing a tyrosine oxide-coupled biomaterial according to the present invention, by identifying a color of the protein bound with a tyrosine oxide-coupled biomaterial prepared by binding tyrosine oxide, which is a natural pigment present in a living body, with the biomaterial. Accordingly, the composition of the present invention may be used to easily and rapidly diagnose various diseases in real time in an operating room, and may usefully replace conventional histological analysis without a secondary antibody reaction and a final operation of color expression.

Abstract: A stacked integrated circuit package-in-package system is provided including forming a first external interconnect; mounting a first integrated circuit die below the first external interconnect; stacking a second integrated circuit die over the first integrated circuit die in an offset configuration not over the first external interconnect; connecting the first integrated circuit die with the first external interconnect; and encapsulating the second integrated circuit die with the first external interconnect and the first integrated circuit die partially exposed.

Abstract: Provided is a composition for detecting a protein, containing a tyrosine oxide-coupled biomaterial. Various diseases may be easily and rapidly diagnosed by easily detecting the composition containing a tyrosine oxide-coupled biomaterial according to the present invention, by identifying a color of the protein bound with a tyrosine oxide-coupled biomaterial prepared by binding tyrosine oxide, which is a natural pigment present in a living body, with the biomaterial. Accordingly, the composition of the present invention may be used to easily and rapidly diagnose various diseases in real time in an operating room, and may usefully replace conventional histological analysis without a secondary antibody reaction and a final operation of color expression.

Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a first terminal; connecting an integrated circuit to the first terminal; forming a second terminal connected over the first terminal and the integrated circuit by a vertical conductive post integral with the first terminal or the second terminal; and encapsulating the integrated circuit and the vertical conductive post leaving portions of the first terminal and the second terminal exposed.

Abstract: A stacked integrated circuit package-in-package system is provided including forming a first external interconnect; mounting a first integrated circuit die below the first external interconnect; stacking a second integrated circuit die over the first integrated circuit die in an offset configuration not over the first external interconnect; connecting the first integrated circuit die with the first external interconnect; and encapsulating the second integrated circuit die with the first external interconnect and the first integrated circuit die partially exposed.

Abstract: A stacked integrated circuit package-in-package system is provided including forming a first external interconnect; mounting a first integrated circuit die below the first external interconnect; stacking a second integrated circuit die over the first integrated circuit die in an offset configuration not over the first external interconnect; connecting the first integrated circuit die with the first external interconnect; and encapsulating the second integrated circuit die with the first external interconnect and the first integrated circuit die partially exposed.

Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a substrate having a bond pad; a B-stage polymer, having a dispersion of conductive particles therein, on the bond pad; and a bond ball inserted into the B-stage polymer for forming intermetallic structures between the bond ball and the bond pad.

Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a first terminal; connecting an integrated circuit to the first terminal; forming a second terminal connected over the first terminal and the integrated circuit by a vertical conductive post integral with the first terminal or the second terminal; and encapsulating the integrated circuit and the vertical conductive post leaving portions of the first terminal and the second terminal exposed.

Abstract: A method of manufacture an integrated circuit packaging system includes: providing a substrate; attaching a first integrated circuit to the substrate by interconnects only along opposite sides of the first integrated circuit; and attaching a heat spreader to the substrate, the heat spreader extending over the first integrated circuit and between the opposite sides of the first integrated circuit.

Abstract: A method of manufacture an integrated circuit packaging system includes: providing a substrate; attaching a first integrated circuit to the substrate by interconnects only along opposite sides of the first integrated circuit; and attaching a heat spreader to the substrate, the heat spreader extending over the first integrated circuit and between the opposite sides of the first integrated circuit.

Abstract: An integrated circuit package system that includes: providing an electrical interconnect system including a first lead-finger system and a second lead-finger system; stacking a second device over a first device between the first lead-finger system and the second lead-finger system; connecting the second device to the second lead-finger system with a bump bond; stacking a dummy device over the second device; and connecting the first device to the first lead-finger system with a wire bond.

Abstract: An integrated circuit package system that includes: providing an electrical interconnect system including a first lead-finger system and a second lead-finger system; stacking a second device over a first device between the first lead-finger system and the second lead-finger system; connecting the second device to the second lead-finger system with a bump bond; stacking a dummy device over the second device; and connecting the first device to the first lead-finger system with a wire bond.

Abstract: A stacked integrated circuit package-in-package system is provided including forming a first external interconnect; mounting a first integrated circuit die below the first external interconnect; stacking a second integrated circuit die over the first integrated circuit die in an offset configuration not over the first external interconnect; connecting the first integrated circuit die with the first external interconnect; and encapsulating the second integrated circuit die with the first external interconnect and the first integrated circuit die partially exposed.

Abstract: The present invention relates to a photosensitive resin composition for use as a photoresist, and more particularly, to a photosensitive resin composition for a photoresist comprising an acrylate copolymer obtained by selectively using specific compounds or controlling the ratio of unreacted monomers, and a 1,2-quinonediazide compound, which is excellent in several performance factors such as dielectric characteristics, flatness, transparency, developing performance, residual film rate, chemical resistance, and heat resistance, as well as sensitivity and resolution, and in particular it facilitates easy pattern formation into interlayer dielectrics, and it can be used as a photoresist in an LCD manufacturing process due to its excellent transmissivity even when prepared as a thick film.

Abstract: The present invention relates to a positive photosensitive resin composition for use in an LCD manufacturing process, and more particularly, to a composition comprising an alkali-soluble resin and novel quinonediazide sulfonic ester compound that has excellent development properties, leaves little residue, and has good chemical resistance, etc, and is also easily patterned and has high transmissivity, and thus is suitable for forming inter-insulating layers in LCDs and in integrated circuit devices.

Abstract: The present invention relates to a photosensitive resin composition for use as a photoresist, and more particularly, to a photosensitive resin composition for a photoresist comprising an acrylate copolymer obtained by selectively using specific compounds or controlling the ratio of unreacted monomers, and a 1,2-quinonediazide compound, which is excellent in several performance factors such as dielectric characteristics, flatness, transparency, developing performance, residual film rate, chemical resistance, and heat resistance, as well as sensitivity and resolution, and in particular it facilitates easy pattern formation into interlayer dielectrics, and it can be used as a photoresist in an LCD manufacturing process due to its excellent transmissivity even when prepared as a thick film.