Abstract: A clamp and heat block assembly for wire bonding a semiconductor package assembly. The package assembly has a semiconductor chip having a plurality of bond pads on an upper surface the chip, a chip paddle secured to a bottom surface of the chip by an adhesive, a plurality of tie bars being connected to corners of the chip paddle and externally extending from the chip paddle, a plurality of leads radially formed at regular intervals along and spaced apart from the chip paddle and extending towards the chip paddle. The package assembly further includes a plurality of conductive wires electrically connected to the leads and the chip. The heat block assembly includes a heat block, a guide block, and a clamp. The guide block has a raised portion for receiving the heat block, which has a groove mating with the raised portion of the guide block. The guide block and heat block are secured to the package assembly by the clamp, which engages the package assembly on an upper surface of the leads.

Abstract: A method for shell program interface of a computer system is described. A shell program is activated by using a wheel button of a wheel mouse and a defined hotkey or only the wheel button. A wheel is moved back and forth to select and execute one of a plurality of application programs registered in the shell program. The input of the hotkey and the wheel button is determined by using a dynamic link library (DLL). As a result, it is suppressed that hotkeys of a plurality of application programs are collided.