Patents by Inventor Soo Ryu

Soo Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9495730
    Abstract: A display device to change an image displayed in a display area when the display area is changed includes a memory, a location output unit and a screen display unit. The memory stores size information of a display area displayed on a screen and the image data of the displayed image. The location computing unit computes a start point of the changed display area when the display area is changed. The display unit decodes data corresponding to the size of the display area based on the computed new start point from the image data to display the decoded data in the display area. Since the start point is obtained with center point of the changed display area and its size information and then a display area to be displayed is determined based on the start point, a current search location is maintained even when the screen is swung.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: November 15, 2016
    Assignee: Pantech Co., Ltd.
    Inventors: Ho Yeon Chae, Chang Soo Ryu
  • Patent number: 9454369
    Abstract: Embodiments provide a device and method for processing messages according to a priority order and for reducing a message processing time when a response event occurs, in a PLC communication module.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: September 27, 2016
    Assignee: LSIS CO., LTD.
    Inventor: Hwa Soo Ryu
  • Patent number: 9425550
    Abstract: A lever type connector includes a housing capable of accommodating a terminal in an outlet; and levers connected onto both sides of the housing, respectively so as to pivot in a detachable direction of the terminal. In the housing, fixation protrusions, connected with the levers, are formed on both sides of the housing, respectively, and the respective fixation protrusions have different shapes.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: August 23, 2016
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Hyun Yong Cho, Jin Soo Ryu, Bong Hun Choi
  • Publication number: 20160225692
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Application
    Filed: April 23, 2015
    Publication date: August 4, 2016
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • Patent number: 9405554
    Abstract: A method for initializing expended modules in PLC (Programmable Logic Controller) system is provided in which an initialization request signal is generated and transmitted to a plurality of expended modules, when one basic unit initializes a plurality of expended modules, and an initialization completion signal is sequentially transmitted by the plurality of expended modules, when the initialization is completed, whereby the initialization time can be optimized, the method including performing an initialization operation after generating, by a basic unit, an initialization request signal and transmitting the initialization request signal to a plurality of expended modules, and determining that the initialization operation is completed, when an initialization completion signal is received from the expended modules connected to the basic unit.
    Type: Grant
    Filed: February 3, 2014
    Date of Patent: August 2, 2016
    Assignee: LSIS CO., LTD.
    Inventor: Hwa Soo Ryu
  • Publication number: 20160191629
    Abstract: Disclosed is a message processing unit provided in a PLC system including a master and a plurality of slaves. The message processing unit is provided to each of the slaves and includes a first filter configured to receive a message transmitted from the master and to determine whether the message is a broadcast message, a second filter configured to receive the message delivered from the first filter and to determine whether the message is a message-to-be-processed, and a processor configured to process the message he delivered from the first filter or the second filter.
    Type: Application
    Filed: December 29, 2015
    Publication date: June 30, 2016
    Inventor: Hwa-Soo RYU
  • Publication number: 20160134052
    Abstract: A lever type connector includes a housing capable of accommodating a terminal in an outlet; and levers connected onto both sides of the housing, respectively so as to pivot in a detachable direction of the terminal. In the housing, fixation protrusions, connected with the levers, are formed on both sides of the housing, respectively, and the respective fixation protrusions have different shapes.
    Type: Application
    Filed: May 22, 2015
    Publication date: May 12, 2016
    Inventors: Hyun Yong CHO, Jin Soo RYU, Bong Hun CHOI
  • Patent number: 9112128
    Abstract: Disclosed herein is a semiconductor light emitting device module comprising: a substrate; at least one support disposed on a surface of the substrate; a heat transfer member disposed on the substrate and the support, the heating transfer member having a cavity formed in at least a portion of the heat transfer member; first conductive layer and second conductive layer contacting the heat transfer member via an insulating layer, the first conductive layer and the second conductive layer being electrically isolated from each other in accordance with exposure of the insulating layer or exposure of the heat transfer member; and at least one semiconductor light emitting device electrically connected to the first conductive layer and the second conductive layer, the at least one semiconductor light emitting device is thermally contacted an exposed portion of the heat transfer member.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: August 18, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Gun Kyo Lee, Byung Soo Ryu
  • Patent number: 9082686
    Abstract: A semiconductor package includes a first substrate, a plurality of memory chips horizontally disposed on the first substrate, and having one surfaces which face the first substrate, other surfaces which face away from the one surfaces, and first bumps formed on the other surfaces, a second substrate disposed on the plurality of memory chips and electrically connected, a sub-substrate horizontally disposed on the first substrate together with the plurality of memory chips and electrically connecting the first substrate and the second substrate, and a driving chip having second bumps on one surface thereof and mounted to the second substrate such that the second bumps are electrically connected with the second substrate.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: July 14, 2015
    Assignee: SK Hynix Inc.
    Inventors: Sang Eun Lee, Sung Soo Ryu, Chang Il Kim, Seon Kwang Jeon
  • Publication number: 20150191805
    Abstract: There are provided a steel wire rod for ultra-high-strength parts such as automobile engine bolts or structural mechanical parts, and a method for producing the steel wire rod. The steel wire rod having high strength and ductility includes, by wt %, carbon (C): 0.7% to 0.9%, manganese (Mn): 13% to 17%, copper (Cu): 1% to 3%, and the balance of iron (Fe) and inevitable impurities.
    Type: Application
    Filed: December 28, 2012
    Publication date: July 9, 2015
    Inventors: You-Hwan Lee, Chul-Min Bae, Geun-Soo Ryu
  • Publication number: 20150168763
    Abstract: A liquid crystal display apparatus includes a first substrate, a second substrate, a thin-film transistor (“TFT”), a color filter, a pixel electrode, a planarizing layer and a first column spacer. The second substrate faces the first substrate. The TFT is on the first substrate. The color filter is on the TFT. The pixel electrode is on the color filter. The planarizing layer covers the color filter and the pixel electrode, and includes a hybride resin including silane. The first column spacer protrudes from an upper surface of the planarizing layer and maintains a cell gap between the first substrate and the second substrate. The first column spacer is on the TFT. The first column spacer includes the hybride resin including silane.
    Type: Application
    Filed: December 8, 2014
    Publication date: June 18, 2015
    Inventors: Gwan-Soo KIM, Hyun-Soo RYU, Jung-Hyun AHN, Hyung-Guen YOON, Hye-Won JANG, Hye-Young HAN
  • Patent number: 9041178
    Abstract: A semiconductor device including a chip stack structure having a plurality of semiconductor chips, the semiconductor chips being stacked such that they are electrically connected using through-electrodes, and a support frame attached to a side surface of the chip stack structure.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: May 26, 2015
    Assignee: SK Hynix Inc.
    Inventors: Seon Kwang Jeon, Sung Soo Ryu, Chang Il Kim
  • Publication number: 20150121015
    Abstract: Embodiments provide a device and method for processing messages according to a priority order and for reducing a message processing time when a response event occurs, in a PLC communication module.
    Type: Application
    Filed: September 23, 2014
    Publication date: April 30, 2015
    Applicant: LSIS CO., LTD.
    Inventor: HWA SOO RYU
  • Patent number: 8982599
    Abstract: A chip die including a first input/output (I/O) pad configured to transmit/receive an I/O signal of a memory cell array included in the chip die; a second I/O pad configured to, if a stacked chip die exists on the chip die, transmit/receive a via I/O signal of the stacked chip die, and configured to, if the stacked chip die does not exist on the chip die, transmit/receive a differential I/O signal of the chip die; and an I/O driver configured to receive an operation mode signal including information as to whether the stacked chip die exists on the chip die in such a manner that the second I/O pad is configured to transmit/receive the via I/O signal or the differential I/O signal.
    Type: Grant
    Filed: July 23, 2013
    Date of Patent: March 17, 2015
    Assignee: SK Hynix Inc.
    Inventors: Seon Kwang Jeon, Sung Soo Ryu, Chang Il Kim
  • Patent number: 8964441
    Abstract: A semiconductor memory device includes a plurality of first regions formed in a line-type and extending in a first direction, and a plurality of second regions and a plurality of third regions arranged between adjacent first regions in a zigzag manner.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: February 24, 2015
    Assignee: SK Hynix, Inc.
    Inventors: Seon Kwang Jeon, Sung Soo Ryu, Chang il Kim
  • Patent number: 8953394
    Abstract: A logic chip and memory chip stacked over the logic chip, the logic chip having a first surface facing the memory chip and a second surface opposite to the first surface and including: first and second internal input/output circuit units for exchanging signals; first external input/output circuit unit for exchanging signals through first external input/output pads formed according to an external interface standard of a first memory over the second surface; and second external input/output circuit unit for exchanging signals through second external input/output pads formed according to an external interface standard of a second memory over the second surface, wherein semiconductor device operates in one of a first mode in which the first internal input/output circuit unit and the first external input/output circuit unit are enabled and a second mode in which the first and second internal input/output circuit units and the second external input/output circuit unit are enabled.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: February 10, 2015
    Assignee: SK Hynix Inc.
    Inventors: Seon Kwang Jeon, Sung Soo Ryu, Chang Il Kim, Jang Ryul Kim
  • Publication number: 20150029805
    Abstract: A semiconductor memory device includes a plurality of first regions formed in a line-type and extending in a first direction, and a plurality of second regions and a plurality of third regions arranged between adjacent first regions in a zigzag manner.
    Type: Application
    Filed: February 7, 2014
    Publication date: January 29, 2015
    Applicant: SK HYNIX INC.
    Inventors: Seon Kwang JEON, Sung Soo RYU, Chang il KIM
  • Publication number: 20140366431
    Abstract: Provided is a method of economically modifying low rank coal (LRC) to be high grade coal having minimized water re-absorption and minimized spontaneous ignition possibility while saving energy by coating heavy oil directly on coal without using solvent oil. Provides is a method of modifying coal using palm oil residue, including milling the coal, homogenously mixing the palm oil residue with the milled coal, melting the palm oil residue mixed with the coal so as to be coated on a surface of the coal, and simultaneously drying moisture in the coal, cooling the dried coal, and briquetting the cooled coal.
    Type: Application
    Filed: September 28, 2012
    Publication date: December 18, 2014
    Applicant: Korea Institute of Energy Research
    Inventors: Si-Hyun Lee, Nam-Sun Nho, Seung-Hyun Moon, Sang-Do Kim, Dong-Hyuk Chun, Young-Jun Rhim, Jeong-Hwan Lim, Ho-Kyung Choi, Ji-Ho Yoo, Young-Chan Choi, Dong-Wook Lee, In-Soo Ryu, Seung-Jae Lee, Je Kyoung Woo
  • Patent number: 8899770
    Abstract: Disclosed is a luminance enhancement film which is suitable for use in a display and includes a multilayered thin film and a uniaxially drawn film formed on one surface of the multilayered thin film.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: December 2, 2014
    Assignee: Kolon Industries, Inc.
    Inventors: A Reum Han, Dae Shik Kim, Deug Soo Ryu, Jeong Yeol Moon
  • Publication number: 20140328104
    Abstract: A logic chip and memory chip stacked over the logic chip, the logic chip having a first surface facing the memory chip and a second surface opposite to the first surface and including: first and second internal input/output circuit units for exchanging signals; first external input/output circuit unit for exchanging signals through first external input/output pads formed according to an external interface standard of a first memory over the second surface; and second external input/output circuit unit for exchanging signals through second external input/output pads formed according to an external interface standard of a second memory over the second surface, wherein semiconductor device operates in one of a first mode in which the first internal input/output circuit unit and the first external input/output circuit unit are enabled and a second mode in which the first and second internal input/output circuit units and the second external input/output circuit unit are enabled.
    Type: Application
    Filed: November 4, 2013
    Publication date: November 6, 2014
    Applicant: SK hynix Inc.
    Inventors: Seon Kwang JEON, Sung Soo RYU, Chang Il KIM, Jang Ryul KIM