Abstract: A semiconductor device includes: an active pattern extending in a first direction across an underlying substrate, a gate structure extending in a second direction, on the active pattern, a first source/drain contact electrically connected to a source/drain region within the active pattern, on one side of the gate structure, and a first via pattern electrically connected to an upper surface of the first source/drain contact. A rail pattern is provided, which extends in the first direction, and is spaced apart from the first via pattern in the second direction. A wiring pattern extends in the first direction, and is electrically connected to an upper surface of the rail pattern. The first source/drain contact includes a first recess therein, which is more recessed downwardly relative to the upper surface of the first source/drain contact, and at least a portion of the first recess extends adjacent to the rail pattern.

Abstract: The present disclosure relates to a method and apparatus for representing dynamic neural radiance fields from unsynchronized videos. A method of acquiring a video at an arbitrary viewpoint based on a dynamic neural radiance fields model according to an embodiment of the present disclosure may comprise: inputting one or more videos acquired from one or more views for one scene into the dynamic neural radiance fields model; inputting a time embedding for the one or more videos into the dynamic neural radiance fields model; and rendering the video at the arbitrary viewpoint based on color information and density information output by the dynamic neural radiance fields model. Herein, time synchronization related to the time embedding may be performed by applying an individual time offset learned for each view, for the one or more views.

Abstract: A semiconductor nanoparticle, a method of manufacturing the semiconductor nanoparticle, and an electronic device including the nanoparticle are provided. The semiconductor nanoparticle includes silver, indium, gallium, and sulfur, wherein the semiconductor nanoparticle is configured to emit a green light, wherein the semiconductor nanoparticle has a relative mole value of zinc as defined by Equation 1 that is greater than or equal to about 0.25 and less than or equal to about 0.9: Relative ? mole ? value ? of ? zinc = [ Zn ] / ( [ Ag ] + [ In ] + [ Ga ] + [ Zn ] ) Equation ? 1 wherein, in Equation 1, [Ag], [In], [Ga], and [Zn] are molar amounts of the silver, the indium, the gallium, and the zinc in the semiconductor nanoparticle, respectively, and wherein a mole ratio of gallium to indium is greater than about 2.5:1 and less than about 5.6:1.

Abstract: An apparatus for creating a virtual world includes a processor and a memory connected to the processor, in which the memory stores program instructions executed by the processor so as to receive an image of a real space through a device having a stereo camera, collect mesh data for the real space and an object existing in the real space through the image, determine coordinates for first edges of the real space from the mesh data for the real space, select one of a plurality of second edges based on an area of a virtual space defined by each of the plurality of second edges facing a predetermined direction, when there are more first edges of the real space than edges of a polygon preset for the real space, and output a virtual space defined by some of the first edges and the selected one second edge and a virtual object corresponding to the real object recognized in the real space.

Abstract: Disclosed herein are an image encoding/decoding method and apparatus. The image decoding method includes acquiring a partitioning index of a current block from a bitstream, and generating a prediction sample of the current block by weighted-summing a prediction sample of a first subblock of the current block and a prediction sample of a second subblock of the current block based on the partitioning index. The partitioning index indicates a partitioning distance and a partitioning direction included in a predefined table.

Abstract: The present invention relates to a video decoding method, according to embodiment of the invention, image decoding method comprises, acquiring a reconstructed luma block of a current block, determining whether a cross-component adaptive loop filter is applied to the current block, acquiring a reconstructed chroma block of the current block, to which an adaptive loop filter is applied, when the cross-component adaptive loop filter is applied to the current block and acquiring a final reconstructed chroma block of the current block, to which the cross-component loop filter is applied, using the reconstructed luma block and the reconstructed chroma block, to which the adaptive loop filter is applied.

Abstract: The present disclosure provides a package structure and a related manufacturing method thereof, wherein a heat dissipation structure surrounding a chip is arranged, and an electrical connection structure is arranged on the outer side of the heat dissipation structure, so that other laminated package components can be electrically connected through a second electrical connection surface of the electrical connection structure to achieve lamination; the heat dissipation structure, the molding layer and the electrical connection structure are fastened through molding the electrical connection structure and the heat dissipation structure by the molding layer, and the molding layer and the electrical connection structure are prevented from warpage by the heat dissipation structure; finally, the package structure has the functions of heat dissipation, lamination and warpage prevention.

Abstract: A sensor package structure includes: a substrate; a sensor chip, displayed on the substrate and electrically connected to the substrate, where a light-receiving region is displayed on a surface, facing away from the substrate, of the sensor chip; a first package body, covering the substrate and having a chamber therein, where the light-receiving region of the sensor chip is exposed in the first chamber, and the first package body has a first opening, the first opening being in communication with the first chamber and corresponding to the light-receiving region of the sensor chip; a transparent cover plate, displayed within the first opening, where the transparent cover plate includes a first surface facing towards the first chamber and a second surface facing away from the first surface; and a second package body, displayed on the first package body.

Abstract: A semiconductor package structure and a forming method therefor are disclosed. The package structure includes: an encapsulant including a first and a second surfaces that are opposite and peripheral side surfaces, wherein the first surface is provided with protruding connection terminals, and junction between the first surface and the peripheral side surfaces are provided with four top corners; a substrate including a flip-chip area, wherein the flip-chip area is provided with four corner areas corresponding to four top corners of the encapsulant; trenches positioned in the substrate in the corner areas or around the corner areas or in the four corner areas and around the four corner areas at the same time; a high-modulus first underfill layer filling four trenches and spaces between the four trenches and the first surface of the encapsulant; and a low-modulus second underfill layer filling a remaining space between the encapsulant and the substrate.

Abstract: The present disclosure discloses a chip package structure and a preparation method thereof. The chip package structure includes: a metal wiring layer; a first chip, wherein a front surface of the first chip is flip-chipped on a first surface of the metal wiring layer; a first molding layer coating the first chip; a second chip, wherein a front surface of the second chip is flip-chipped on a second surface of the metal wiring layer; a first metal pillar formed on the second surface of the metal wiring layer; a second molding layer coating the second chip and the first metal pillar; and a second metal pillar formed on one side that is of the second molding layer and that is far away from the metal wiring layer, wherein the second metal pillar is at least partially connected to the corresponding first metal pillar.

Abstract: A method and a server for extracting a topic and evaluating suitability of the extracted topic are disclosed. The topic extraction server includes a text preprocessing unit configured to extract noun from a document group and remove stopword from the extracted noun, a keyword extraction unit configured to calculate a weight of a noun and extracting a keyword representing the document group, a seed selection unit configured to calculate a weight of the extracted keyword and select a seed, an initial clustering unit configured to generate one cluster including the selected seed and a keyword shown by several times in a sentence including the selected seed, and a cluster combination unit configured to extract a topic group.

Abstract: Provided are a method and a system for predicting stock fluctuation prediction. A system for predicting stock fluctuation according to an embodiment of the present invention includes: a data collector and a preprocessor collecting news and KOSPI data and extracting words from the collected news through stopword removal and morphologic analysis, a sentiment dictionary constructor selecting sentiment words and calculating sentiment values of the sentiment words to construct a sentiment dictionary of a stock domain required for stock prediction, and a stock fluctuation prediction model constructor predicting fluctuation of a closing price of a next day to a closing price of a current day by combining a prediction model using the constructed sentiment dictionary and an ARIMA prediction model using the KOSPI data.

Abstract: An integrated circuit packaging system, and a method of manufacture thereof, including: a substrate including: a first trace layer, an encapsulation on the first trace layer, the first trace layer having a surface exposed from the encapsulation with a rough texture characteristic of removal of a conductive carrier coating, a second trace layer on the encapsulation and over the first trace layer, the second trace layer connected to the first trace layer; and an integrated circuit die attached to the substrate.

Abstract: A semiconductor device has a substrate. A conductive layer is formed over the substrate. A duplex plated bump on lead pad is formed over the substrate. An insulating layer is formed over the conductive layer and the substrate. A portion of the insulating over the duplex plated bump on lead pad is removed using a laser direct ablation process. The insulating layer is a lamination layer. The duplex plated bump on lead pad has a wide bump on lead pad. A semiconductor die is mounted over the substrate. The semiconductor die has a composite conductive interconnect structure. The semiconductor die has a first bump and a second bump with a pitch ranging from 90-150 micrometers between the first bump and the second bump. A duplex plated contact pad is formed on a surface of the substrate opposite the duplex plated bump-on-lead pad.

Abstract: A method and a server for extracting a topic and evaluating suitability of the extracted topic are disclosed. The topic extraction server includes a text preprocessing unit configured to extract noun from a document group and remove stopword from the extracted noun, a keyword extraction unit configured to calculate a weight of a noun and extracting a keyword representing the document group, a seed selection unit configured to calculate a weight of the extracted keyword and select a seed, an initial clustering unit configured to generate one cluster including the selected seed and a keyword shown by several times in a sentence including the selected seed, and a cluster combination unit configured to extract a topic group.

Abstract: A method of predicting personality traits using a personal life log and an apparatus for performing the same are disclosed. The method of predicting personality traits comprises collecting personal life log in a social network, generating a user behavior matrix by defining an object about user's behavior through analysis of the collected personal life log in a triple structure and extracting a user behavior parameter through the generated user behavior matrix, obtaining interaction between a user and a friend by analyzing the personal life log and obtaining a friend relation characteristic parameter by using the obtained interaction, obtaining a moving path characteristic parameter by using location information made in a feed by the user through analysis of the personal life log, and predicting personality traits by applying the user behavior parameter, the friend relation characteristic parameter and the moving path characteristic parameter to four learned personality traits models.

Abstract: Provided are a method and a system for predicting stock fluctuation prediction. A system for predicting stock fluctuation according to an embodiment of the present invention includes: a data collector and a preprocessor collecting news and KOSPI data and extracting words from the collected news through stopword removal and morphologic analysis, a sentiment dictionary constructor selecting sentiment words and calculating sentiment values of the sentiment words to construct a sentiment dictionary of a stock domain required for stock prediction, and a stock fluctuation prediction model constructor predicting fluctuation of a closing price of a next day to a closing price of a current day by combining a prediction model using the constructed sentiment dictionary and an ARIMA prediction model using the KOSPI data.

Abstract: An integrated circuit packaging system, and a method of manufacture thereof, including: a substrate including: a first trace layer, an encapsulation on the first trace layer, the first trace layer having a surface exposed from the encapsulation with a rough texture characteristic of removal of a conductive carrier coating, a second trace layer on the encapsulation and over the first trace layer, the second trace layer connected to the first trace layer; and an integrated circuit die attached to the substrate.

Abstract: An apparatus and a method for predicting the pleasantness-unpleasantness index of words are disclosed. The disclosed apparatus includes: a computing unit configured to compute an emotion correlation between a word and one or more comparison word, compute emotion correlations between multiple reference words included in a reference word set and the one or more comparison word, compute multiple first absolute emotion similarity values between the word and the multiple reference words, and compute at least one second absolute emotion similarity value between a reference word and another reference word for all of the reference words included in the reference word set; and a prediction unit configured to predict the pleasantness-unpleasantness index of the word by using the multiple number of first absolute emotion similarity values, the at least one second absolute emotion similarity value, and a preset pleasantness-unpleasantness index of the multiple number of reference words.

Abstract: An apparatus and a method for predicting the pleasantness-unpleasantness index of words are disclosed. The disclosed apparatus includes: a computing unit configured to compute an emotion correlation between a word and one or more comparison word, compute emotion correlations between multiple reference words included in a reference word set and the one or more comparison word, compute multiple first absolute emotion similarity values between the word and the multiple reference words, and compute at least one second absolute emotion similarity value between a reference word and another reference word for all of the reference words included in the reference word set; and a prediction unit configured to predict the pleasantness-unpleasantness index of the word by using the multiple number of first absolute emotion similarity values, the at least one second absolute emotion similarity value, and a preset pleasantness-unpleasantness index of the multiple number of reference words.