Abstract: A method and a server for extracting a topic and evaluating suitability of the extracted topic are disclosed. The topic extraction server includes a text preprocessing unit configured to extract noun from a document group and remove stopword from the extracted noun, a keyword extraction unit configured to calculate a weight of a noun and extracting a keyword representing the document group, a seed selection unit configured to calculate a weight of the extracted keyword and select a seed, an initial clustering unit configured to generate one cluster including the selected seed and a keyword shown by several times in a sentence including the selected seed, and a cluster combination unit configured to extract a topic group.

Abstract: A method of predicting personality traits using a personal life log and an apparatus for performing the same are disclosed. The method of predicting personality traits comprises collecting personal life log in a social network, generating a user behavior matrix by defining an object about user's behavior through analysis of the collected personal life log in a triple structure and extracting a user behavior parameter through the generated user behavior matrix, obtaining interaction between a user and a friend by analyzing the personal life log and obtaining a friend relation characteristic parameter by using the obtained interaction, obtaining a moving path characteristic parameter by using location information made in a feed by the user through analysis of the personal life log, and predicting personality traits by applying the user behavior parameter, the friend relation characteristic parameter and the moving path characteristic parameter to four learned personality traits models.

Abstract: Provided are a method and a system for predicting stock fluctuation prediction. A system for predicting stock fluctuation according to an embodiment of the present invention includes: a data collector and a preprocessor collecting news and KOSPI data and extracting words from the collected news through stopword removal and morphologic analysis, a sentiment dictionary constructor selecting sentiment words and calculating sentiment values of the sentiment words to construct a sentiment dictionary of a stock domain required for stock prediction, and a stock fluctuation prediction model constructor predicting fluctuation of a closing price of a next day to a closing price of a current day by combining a prediction model using the constructed sentiment dictionary and an ARIMA prediction model using the KOSPI data.

Abstract: An integrated circuit packaging system, and a method of manufacture thereof, including: a substrate including: a first trace layer, an encapsulation on the first trace layer, the first trace layer having a surface exposed from the encapsulation with a rough texture characteristic of removal of a conductive carrier coating, a second trace layer on the encapsulation and over the first trace layer, the second trace layer connected to the first trace layer; and an integrated circuit die attached to the substrate.

Abstract: An apparatus and a method for predicting the pleasantness-unpleasantness index of words are disclosed. The disclosed apparatus includes: a computing unit configured to compute an emotion correlation between a word and one or more comparison word, compute emotion correlations between multiple reference words included in a reference word set and the one or more comparison word, compute multiple first absolute emotion similarity values between the word and the multiple reference words, and compute at least one second absolute emotion similarity value between a reference word and another reference word for all of the reference words included in the reference word set; and a prediction unit configured to predict the pleasantness-unpleasantness index of the word by using the multiple number of first absolute emotion similarity values, the at least one second absolute emotion similarity value, and a preset pleasantness-unpleasantness index of the multiple number of reference words.

Abstract: An apparatus and a method for predicting the pleasantness-unpleasantness index of words are disclosed. The disclosed apparatus includes: a computing unit configured to compute an emotion correlation between a word and one or more comparison word, compute emotion correlations between multiple reference words included in a reference word set and the one or more comparison word, compute multiple first absolute emotion similarity values between the word and the multiple reference words, and compute at least one second absolute emotion similarity value between a reference word and another reference word for all of the reference words included in the reference word set; and a prediction unit configured to predict the pleasantness-unpleasantness index of the word by using the multiple number of first absolute emotion similarity values, the at least one second absolute emotion similarity value, and a preset pleasantness-unpleasantness index of the multiple number of reference words.

Abstract: Disclosed are a cutting wheel composition, and a cutting wheel using the cutting wheel composition. The disclosed composition includes 50 to 85 wt % of abrasive particles, 10 to 25 wt % of binder resin, and balance filler, wherein the binder resin includes a phenolic resin as a first binder resin; and at least one of a (bis)maleimide resin and a cyanate ester resin as a second binder resin. The composition includes at least one of the (bis)maleimide resin and the cyanate ester resin, as well the phenolic resin, as the binder resin, and thereby makes it possible to fabricate a cutting wheel having improved life characteristics through the improvement of heat-resistance and scratch-resistance.

Abstract: A semiconductor device has a substrate. A conductive layer is formed over the substrate. A duplex plated bump on lead pad is formed over the substrate. An insulating layer is formed over the conductive layer and the substrate. A portion of the insulating over the duplex plated bump on lead pad is removed using a laser direct ablation process. The insulating layer is a lamination layer. The duplex plated bump on lead pad has a wide bump on lead pad. A semiconductor die is mounted over the substrate. The semiconductor die has a composite conductive interconnect structure. The semiconductor die has a first bump and a second bump with a pitch ranging from 90-150 micrometers between the first bump and the second bump. A duplex plated contact pad is formed on a surface of the substrate opposite the duplex plated bump-on-lead pad.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a carrier having a contact pad; forming a first resist layer, having a first resist opening, over the carrier and the contact pad, the first resist opening partially exposing the first contact pad; forming a second resist layer, having a second resist opening over the first resist opening, the second resist opening partially exposing the first resist layer; mounting an integrated circuit over the carrier; and forming an internal interconnect between the integrated circuit and the carrier, the internal interconnect filling the second resist opening with no space between the second resist layer in the second resist opening.

Abstract: A semiconductor device has a substrate. A first conductive layer is formed over the substrate. A duplex plated bump on lead pad is formed over the substrate. An insulating layer is formed over the first conductive layer and the substrate. A portion of the insulating over the duplex plated bump on lead pad is removed using a laser direct ablation process. The insulating layer is a lamination layer. The duplex plated bump on lead pad has a wide bump on lead pad. A semiconductor die is mounted over the substrate. The semiconductor die has a composite conductive interconnect structure. The semiconductor die has a first bump and a second bump with a pitch ranging from 90-150 micrometers between the first bump and the second bump. A duplex plated contact pad is formed on a surface of the substrate opposite the duplex plated bump-on-lead pad.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a carrier having a contact pad; forming a first resist layer, having a first resist opening, over the carrier and the contact pad, the first resist opening partially exposing the first contact pad; forming a second resist layer, having a second resist opening over the first resist opening, the second resist opening partially exposing the first resist layer; mounting an integrated circuit over the carrier; and forming an internal interconnect between the integrated circuit and the carrier, the internal interconnect filling the second resist opening with no space between the second resist layer in the second resist opening.

Abstract: Disclosed are a cutting wheel composition, and a cutting wheel using the cutting wheel composition. The disclosed composition includes 50 to 85 wt % of abrasive particles, 10 to 25 wt % of binder resin, and balance filler, wherein the binder resin includes a phenolic resin as a first binder resin; and at least one of a (bis)maleimide resin and a cyanate ester resin as a second binder resin. The composition includes at least one of the (bis)maleimide resin and the cyanate ester resin, as well the phenolic resin, as the binder resin, and thereby makes it possible to fabricate a cutting wheel having improved life characteristics through the improvement of heat-resistance and scratch-resistance.

Abstract: An integrated circuit packaging system including: forming a base structure, having an opening; mounting a base structure device in the opening; attaching an integrated circuit device over the base structure device; and molding an encapsulant on the base structure, the base structure device, and the integrated circuit device.

Abstract: An integrated circuit packaging system including: forming a base structure, having an opening; mounting a base structure device in the opening; attaching an integrated circuit device over the base structure device; and molding an encapsulant on the base structure, the base structure device, and the integrated circuit device.

Abstract: An etching system and method. In the method, layers are etched on a plurality of substrates using a single amount of etchant to form a predetermined pattern on each of the layers, wherein an etching period varies according to an accumulated process number of substrates. The system includes an etching equipment including an etching processor for etching layers on a plurality of substrates using a single amount of etchant to form a predetermined pattern on each of the layers, and a loader for temporarily holding cassettes in which the substrates are stored; and a controller for controlling operations of the etching equipment. The etching equipment changes an etching period according to an accumulated process number of the substrates.

Abstract: The present invention relates to a method for recycling an alignment layer material. The recycled alignment layer material shows the same characteristics as an original alignment layer material. The waste solution of the alignment layer material produced during the liquid crystal display manufacturing processes is recycled by solidifying polyamic acids and soluble polyimides by putting a waste solution of the alignment layer material into an organic solution or ultra purified water in which the alignment layer material constituents of polyamic acids and soluble polyimides are insoluble, separating polyamic acids and soluble polyimides from the organic solvent or ultra purified water, and dissolving the separated solid polyamic acids and soluble polyimides into a solvent. Recycling the alignment layer material in this method can significantly reduce the manufacturing costs.

Abstract: An etching system and method. In the method, layers are etched on a plurality of substrates using a single amount of etchant to form a predetermined pattern on each of the layers, wherein an etching period varies according to an accumulated process number of substrates. The system includes an etching equipment including an etching processor for etching layers on a plurality of substrates using a single amount of etchant to form a predetermined pattern on each of the layers, and a loader for temporarily holding cassettes in which the substrates are stored; and a controller for controlling operations of the etching equipment. The etching equipment changes an etching period according to an accumulated process number of the substrates.

Abstract: The present invention relates to a method for fabricating a semiconductor laser diode in optical communication system, and the present invention uses both an oxide and a nitride pattern as an etch mask instead of the single oxide pattern in order to decrease the under cut of the edge of the oxide pattern.

Abstract: The present invention relates to a method for fabricating a semiconductor laser diode in optical communication system, having the steps for forming current blocking layers on the resulting structure of the mesa structure and then forming an opening through the current blocking layer on the mesa structure.