Abstract: Electrical components which substantially dissipate the power provided them in the form of heat will change temperature in response to self heating, heat transfer to their surroundings, and heat transferred from one component to another. A method is disclosed for calculating the temperature of a component(s) using a thermal model. In one embodiment the power dissipation of each component is controlled to limit the temperature of the component. In one embodiment the temperature of a component is modified by changing the power dissipation of another component. In some embodiments the power dissipation of a component is modified by modifying its performance. In another embodiment power dissipation is modified by selecting one or more programs for modified execution.

Abstract: Methods and devices are disclosed for performing analog to digital signal conversion in shorter time and/or with less power consumption than that of a comparable analog to digital conversion that uses a conventional sequential approximation method based on a binary search. In one embodiment, a predictive guess is supplied as a digital first signal. The digital first signal is converted (D/A) to a counterpart, analog guess signal. A comparison is made between the analog guess signal and a received, analog input sample signal. The result of the comparison is used to improve on the initially supplied guess in a next cycle. Fewer cycles and less power is consumed if the initial guess is within a certain range of the actual magnitude of the analog input sample signal. In one embodiment, a digital modeler is used to model a process underlying the analog input sample signal and to thereby provide fairly good guesses.

Abstract: The voltage applied to an integrated circuit is controlled by a temporal process monitor formed as part of the integrated circuit. The temporal process monitor includes a voltage controlled oscillator for producing a first output signal having a first period. A comparator compares the first period to one or more reference values. Should the first period be greater than a first selected reference value the comparator sends a signal to increase the voltage being supplied to the integrated circuit. Should the first period be less than a second selected reference value, the comparator sends a signal to decrease the voltage applied to the integrated circuit. In some embodiments a scaling circuit is provided for producing a second output signal having a second period different from (typically but not necessarily longer than) the first period.

Abstract: The transient response of a switching power supply is improved by providing one or more supplemental power sources connected to the output terminal of the power supply. In one embodiment additional current is provided when a sudden increase in load current causes a corresponding decrease in output voltage. In one embodiment current is discharged when a sudden decrease in load current causes a corresponding increase in output voltage. The supplemental power sources provide a fixed current for a fixed duration. In one embodiment the current provided from the power sources is variable according to the increase or decrease in load current. In some embodiments the supplemental current is provided for a time period approximating the time required for the switching power converter coil current to equal the new load current.

Abstract: Methods and devices perform analog to digital signal conversion in shorter time and/or with less power consumption than that of a comparable analog to digital conversion that uses a conventional sequential approximation method based on a binary search. A predictive guess is supplied as a digital first signal. The digital first signal is converted (D/A) to a counterpart, analog guess signal. Fewer cycles and less power is consumed if the initial guess is within a certain range of the actual magnitude of the analog input sample signal. In one embodiment, a digital modeler is used to model a process underlying the analog input sample signal to thereby provide fairly good guesses.

Abstract: The voltage applied to an integrated circuit is controlled by a temporal process monitor formed as part of the integrated circuit. The temporal process monitor includes a voltage controlled oscillator for producing a first output signal having a first period. A comparator compares the first period to one or more reference values. Should the first period be greater than a first selected reference value the comparator sends a signal to increase the voltage being supplied to the integrated circuit. Should the first period be less than a second selected reference value, the comparator sends a signal to decrease the voltage applied to the integrated circuit. In some embodiments a scaling circuit is provided for producing a second output signal having a second period different from (typically but not necessarily longer than) the first period.

Abstract: The voltage applied to an integrated circuit is controlled by a temporal process monitor formed as part of the integrated circuit. The temporal process monitor includes a voltage controlled oscillator for producing a first output signal having a first period. A comparator compares the first period to one or more reference values. Should the first period be greater than a first selected reference value the comparator sends a signal to increase the voltage being supplied to the integrated circuit. Should the first period be less than a second selected reference value, the comparator sends a signal to decrease the voltage applied to the integrated circuit. In some embodiments a scaling circuit is provided for producing a second output signal having a second period different from (typically but not necessarily longer than) the first period.

Abstract: A capacitor includes a semiconductor substrate, a bottom conductive pattern, first to third insulating layers, first to third metal plates and a connecting pattern. The bottom conductive pattern is formed on the semiconductor substrate. The first to third insulating layers are formed on the bottom conductive pattern, the first and second metal plates, respectively. The first metal plate is formed on the first insulating layer within a first area. The first metal plate is electrically connected to the bottom conductive pattern. The second metal plate is formed on the second insulating layer within the first area. The second metal plate has an opening in the center thereof. The third metal plate is formed on the third insulating layer. The connecting pattern is formed through the second and third insulating layers and the opening of the second metal plate. The connecting pattern electrically connects the first and the third metal plate.

Abstract: A capacitor includes a semiconductor substrate, a bottom conductive pattern, first to third insulating layers, first to third metal plates and a connecting pattern. The bottom conductive pattern is formed on the semiconductor substrate. The first to third insulating layers are formed on the bottom conductive pattern, the first and second metal plates, respectively. The first metal plate is formed on the first insulating layer within a first area. The first metal plate is electrically connected to the bottom conductive pattern. The second metal plate is formed on the second insulating layer within the first area. The second metal plate has an opening in the center thereof. The third metal plate is formed on the third insulating layer. The connecting pattern is formed through the second and third insulating layers and the opening of the second metal plate. The connecting pattern electrically connects the first and the third metal plate.

Abstract: A switched capacitor circuit includes an operational transconductance amplifier, a feedback stage having a first switched capacitor and a first time constant, and a load stage having a second switched capacitor and a second time constant. The first time constant and the second time constant are equal to each other to improve settling of the circuit. The first and second switched capacitors are coupled to an output of the operational transconductance amplifier via transistors. The transistors are sized so that the time constants of the feedback and load section are equal. In a further embodiment, the time constant of the feedback section is made greater than the load section, to further improve settling. On-state resistance of the transistors are controlled with respect to transconductance of the operational transconductance amplifier to maintain smaller error.