Patents by Inventor Sorin Stefanescu

Sorin Stefanescu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210048363
    Abstract: The disclosed technology includes an oil-filled pressure transducer assembly and an oil-filled compensating sensing element disposed near one another and attached to a common housing. The oil-filled pressure transducer assembly may receive and measure pressure media via a first oil-filled cavity and a protective diagram in communication with the pressure media. The compensating sensing element may be isolated from the pressure media. In certain example implementations, the compensating sensing element is configured to measure certain common error phenomena that are also measured by the oil-filled pressure transducer assembly, for example, due to acceleration, temperature, and/or vibration. In certain implementations, the signal measured by the compensating sensing element may be subtracted from the signal measured by the oil-filled pressure transducer assembly to provide a compensated output signal.
    Type: Application
    Filed: August 12, 2019
    Publication date: February 18, 2021
    Inventors: Alexander A. Ned, Sorin Stefanescu, Andrew Bemis, Scott Goodman
  • Publication number: 20210041318
    Abstract: Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.
    Type: Application
    Filed: October 26, 2020
    Publication date: February 11, 2021
    Inventors: Alexander A. Ned, Leo Geras, Sorin Stefanescu
  • Patent number: 10871415
    Abstract: Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: December 22, 2020
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Alexander A. Ned, Leo Geras, Sorin Stefanescu
  • Patent number: 10825719
    Abstract: A method for fabricating silicon-on-insulator (SOI) semiconductor devices, wherein the piezoresistive pattern is defined within a blanket doped layer after fusion bonding. This new method of fabricating SOI semiconductor devices is more suitable for simpler large scale fabrication as it provides the flexibility to select the device pattern/type at the latest stages of fabrication.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: November 3, 2020
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Alexander A. Ned, Sorin Stefanescu, Joseph R. VanDeWeert
  • Patent number: 10605685
    Abstract: Certain implementations of the disclosed technology include systems and methods for providing header assemblies for use with pressure sensors in high-temperature environments. Certain example implementations include a header assembly. The header assembly can include a header portion having a first side and a second side, the header portion including one or more bores extending through the header portion from the first side to the second side. In certain example implementations, one or more platinum header pins are disposed within and extending through the one or more bores of the header portion. In certain example implementations, the header assembly can include one or more brazing portions corresponding to the one or more platinum header pins. In certain example implementations, the platinum header pins are configured for electrical communication with corresponding electrodes of a leadless transducer element.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: March 31, 2020
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Alexander Ned, Sorin Stefanescu, Scott Goodman
  • Publication number: 20200011757
    Abstract: Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.
    Type: Application
    Filed: August 27, 2019
    Publication date: January 9, 2020
    Inventors: Alexander A. Ned, Leo Geras, Sorin Stefanescu
  • Patent number: 10436662
    Abstract: Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: October 8, 2019
    Assignee: KULITE SEMICONDUCTOR PRODUCTS, INC.
    Inventors: Alexander A. Ned, Leo Geras, Sorin Stefanescu
  • Publication number: 20190237358
    Abstract: A method for fabricating silicon-on-insulator (SOI) semiconductor devices, wherein the piezoresistive pattern is defined within a blanket doped layer after fusion bonding. This new method of fabricating SOI semiconductor devices is more suitable for simpler large scale fabrication as it provides the flexibility to select the device pattern/type at the latest stages of fabrication.
    Type: Application
    Filed: April 8, 2019
    Publication date: August 1, 2019
    Inventors: Alexander A. Ned, Sorin Stefanescu, Joseph R. VanDeweert
  • Patent number: 10256138
    Abstract: A method for fabricating silicon-on-insulator (SOI) semiconductor devices, wherein the piezoresistive pattern is defined within a blanket doped layer after fusion bonding. This new method of fabricating SOI semiconductor devices is more suitable for simpler large scale fabrication as it provides the flexibility to select the device pattern/type at the latest stages of fabrication.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: April 9, 2019
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Alexander A. Ned, Sorin Stefanescu, Joseph R. VanDeWeert
  • Publication number: 20190041288
    Abstract: Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.
    Type: Application
    Filed: August 2, 2017
    Publication date: February 7, 2019
    Inventors: Alexander A. Ned, Leo Geras, Sorin Stefanescu
  • Publication number: 20190033155
    Abstract: Certain implementations of the disclosed technology include systems and methods for providing header assemblies for use with pressure sensors in high-temperature environments. Certain example implementations include a header assembly. The header assembly can include a header portion having a first side and a second side, the header portion including one or more bores extending through the header portion from the first side to the second side. In certain example implementations, one or more platinum header pins are disposed within and extending through the one or more bores of the header portion. In certain example implementations, the header assembly can include one or more brazing portions corresponding to the one or more platinum header pins. In certain example implementations, the platinum header pins are configured for electrical communication with corresponding electrodes of a leadless transducer element.
    Type: Application
    Filed: October 3, 2018
    Publication date: January 31, 2019
    Inventors: Alexander Ned, Sorin Stefanescu, Scott Goodman
  • Patent number: 10153242
    Abstract: Systems and methods are disclosed for providing an interconnection for extending high-temperature use in sensors and other electronic devices. The interconnection includes a semiconductor layer; an ohmic contact layer disposed on a first region of the semiconductor layer; an insulating layer disposed on a second region of the semiconductor layer, where the second region differs from the first region; a metal layer disposed above at least the insulating layer and the ohmic contact layer; and a connecting conductive region disposed on the metal layer and in vertical alignment with a third region of the semiconductor layer. The third region differs from the first region and is offset from the ohmic contact layer at the first region. The offset is configured to extend an operational lifetime of the interconnection apparatus, particularly when the interconnection apparatus is exposed to high temperature environments.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: December 11, 2018
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: Sorin Stefanescu
  • Patent number: 10132705
    Abstract: Systems and methods are disclosed for a pressure sensor device. The pressure sensor device includes a header that defines an interior cavity including one or more tether connecting regions. The header further defines an outer portion in communication with the interior cavity; the outer portion includes a plurality of through bores in communication with an exterior portion of the header for insertion of header pins through the header. The pressure sensor device includes a pressure sensor chip disposed within the interior cavity of the header. One or more anchoring tethers are attached to the corresponding one or more tether connecting regions. The pressure sensor chip is free to move within the interior cavity of the header, and the one or more anchoring tethers are in communication with the pressure sensor chip and are configured to limit movement of the pressure sensor chip within the header.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: November 20, 2018
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Sorin Stefanescu, Alexander A. Ned, Joseph R. VanDeWeert, Andrew Bemis
  • Patent number: 10126195
    Abstract: Aspects of the present disclosure relate to a pressure sensor header for use with a pressure-sensing device. The pressure sensor header can be used in high-temperature environments. A pressure sensor header of the present disclosure can include a header shell, a sealing header glass that is sealed to the header shell, one or more electrical connections electrically isolated from the header shell by the sealing header glass, and a plate for sealing to a pressure-sensing device to be incorporated onto the pressure sensor header. The plate may include one or more ribs that allow for sealing of the plate to the header shell. The pressure sensor header may include a ribbed insert for sealing to the header shell and plate.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: November 13, 2018
    Inventors: Alexander A. Ned, Sorin Stefanescu
  • Patent number: 10119877
    Abstract: Certain implementations of the disclosed technology include systems and methods for providing header assemblies for use with pressure sensors in high-temperature environments. Certain example implementations include a header assembly. The header assembly can include a header portion having a first side and a second side, the header portion including one or more bores extending through the header portion from the first side to the second side. In certain example implementations, one or more platinum header pins are disposed within and extending through the one or more bores of the header portion. In certain example implementations, the header assembly can include one or more brazing portions corresponding to the one or more platinum header pins. In certain example implementations, the platinum header pins are configured for electrical communication with corresponding electrodes of a leadless transducer element.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: November 6, 2018
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Alexander Ned, Sorin Stefanescu, Scott Goodman
  • Publication number: 20180218988
    Abstract: Systems and methods are disclosed for providing an interconnection for extending high-temperature use in sensors and other electronic devices. The interconnection includes a semiconductor layer; an ohmic contact layer disposed on a first region of the semiconductor layer; an insulating layer disposed on a second region of the semiconductor layer, where the second region differs from the first region; a metal layer disposed above at least the insulating layer and the ohmic contact layer; and a connecting conductive region disposed on the metal layer and in vertical alignment with a third region of the semiconductor layer. The third region differs from the first region and is offset from the ohmic contact layer at the first region. The offset is configured to extend an operational lifetime of the interconnection apparatus, particularly when the interconnection apparatus is exposed to high temperature environments.
    Type: Application
    Filed: January 29, 2018
    Publication date: August 2, 2018
    Inventor: Sorin Stefanescu
  • Patent number: 9917067
    Abstract: Systems and methods are disclosed for providing an interconnection for extending high-temperature use in sensors and other electronic devices. The interconnection includes a semiconductor layer; an ohmic contact layer disposed on a first region of the semiconductor layer; an insulating layer disposed on a second region of the semiconductor layer, where the second region differs from the first region; a metal layer disposed above at least the insulating layer and the ohmic contact layer; and a connecting conductive region disposed on the metal layer and in vertical alignment with a third region of the semiconductor layer. The third region differs from the first region and is offset from the ohmic contact layer at the first region. The offset is configured to extend an operational lifetime of the interconnection apparatus, particularly when the interconnection apparatus is exposed to high temperature environments.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: March 13, 2018
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: Sorin Stefanescu
  • Publication number: 20180024020
    Abstract: Systems and methods are disclosed for a pressure sensor device. The pressure sensor device includes a header that defines an interior cavity including one or more tether connecting regions. The header further defines an outer portion in communication with the interior cavity; the outer portion includes a plurality of through bores in communication with an exterior portion of the header for insertion of header pins through the header. The pressure sensor device includes a pressure sensor chip disposed within the interior cavity of the header. One or more anchoring tethers are attached to the corresponding one or more tether connecting regions. The pressure sensor chip is free to move within the interior cavity of the header, and the one or more anchoring tethers are in communication with the pressure sensor chip and are configured to limit movement of the pressure sensor chip within the header.
    Type: Application
    Filed: July 19, 2016
    Publication date: January 25, 2018
    Inventors: Sorin Stefanescu, Alexander A. Ned, Joseph R. VanDeWeert, Andrew Bemis
  • Publication number: 20170330792
    Abstract: A method for fabricating silicon-on-insulator (SOI) semiconductor devices, wherein the piezoresistive pattern is defined within a blanket doped layer after fusion bonding. This new method of fabricating SOI semiconductor devices is more suitable for simpler large scale fabrication as it provides the flexibility to select the device pattern/type at the latest stages of fabrication.
    Type: Application
    Filed: July 28, 2017
    Publication date: November 16, 2017
    Inventors: Alexander A. Ned, Sorin Stefanescu, Joseph R. VanDeWeert
  • Patent number: 9721832
    Abstract: A method for fabricating silicon-on-insulator (SOI) semiconductor devices, wherein the piezoresistive pattern is defined within a blanket doped layer after fusion bonding. This new method of fabricating SOI semiconductor devices is more suitable for simpler large scale fabrication as it provides the flexibility to select the device pattern/type at the latest stages of fabrication.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: August 1, 2017
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Alexander A. Ned, Sorin Stefanescu, Joseph R. Vandeweert