Patents by Inventor Srabanti Chowdhury
Srabanti Chowdhury has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9093366Abstract: An N-polar III-N transistor includes a III-N buffer layer, a first III-N barrier layer, and a III-N channel layer, the III-N channel layer having a gate region and a plurality of access regions on opposite sides of the gate region. The compositional difference between the first III-N barrier layer and the III-N channel layer causes a conductive channel to be induced in the access regions of the III-N channel layer. The transistor also includes a source, a gate, a drain, and a second III-N barrier layer between the gate and the III-N channel layer. The second III-N barrier layer has an N-face proximal to the gate and a group-III face opposite the N-face, and has a larger bandgap than the III-N channel layer. The lattice constant of the first III-N barrier layer is within 0.5% of the lattice constant of the buffer layer.Type: GrantFiled: April 9, 2013Date of Patent: July 28, 2015Assignee: Transphorm Inc.Inventors: Umesh Mishra, Srabanti Chowdhury, Carl Joseph Neufeld
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Publication number: 20150137137Abstract: A current aperture vertical electron transistor (CAVET) with ammonia (NH3) based molecular beam epitaxy (MBE) grown p-type Gallium Nitride (p-GaN) as a current blocking layer (CBL). Specifically, the CAVET features an active buried Magnesium (Mg) doped GaN layer for current blocking purposes. This structure is very advantageous for high power switching applications and for any device that requires a buried active p-GaN layer for its functionality.Type: ApplicationFiled: December 10, 2014Publication date: May 21, 2015Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Srabanti Chowdhury, Ramya Yeluri, Christophe Hurni, Umesh K. Mishra, Ilan Ben-Yaacov
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Publication number: 20150054117Abstract: Semiconductor devices with guard rings are described. The semiconductor devices may be, e.g., transistors and diodes designed for high-voltage applications. A guard ring is a floating electrode formed of electrically conducting material above a semiconductor material layer. A portion of an insulating layer is between at least a portion of the guard ring and the semiconductor material layer. A guard ring may be located, for example, on a transistor between a gate and a drain electrode. A semiconductor device may have one or more guard rings.Type: ApplicationFiled: October 31, 2014Publication date: February 26, 2015Inventors: Umesh Mishra, Srabanti Chowdhury, Yuvaraj Dora
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Publication number: 20150021552Abstract: A transistor includes a III-N layer structure comprising a III-N channel layer between a III-N barrier layer and a p-type III-N layer. The transistor further includes a source, a drain, and a gate between the source and the drain, the gate being over the III-N layer structure. The p-type III-N layer includes a first portion that is at least partially in a device access region between the gate and the drain, and the first portion of the p-type III-N layer is electrically connected to the source and electrically isolated from the drain. When the transistor is biased in the off state, the p-type layer can cause channel charge in the device access region to deplete as the drain voltage increases, thereby leading to higher breakdown voltages.Type: ApplicationFiled: July 9, 2014Publication date: January 22, 2015Inventors: Umesh Mishra, Rakesh K. Lal, Stacia Keller, Srabanti Chowdhury
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Patent number: 8937338Abstract: A current aperture vertical electron transistor (CAVET) with ammonia (NH3) based molecular beam epitaxy (MBE) grown p-type Gallium Nitride (p-GaN) as a current blocking layer (CBL). Specifically, the CAVET features an active buried Magnesium (Mg) doped GaN layer for current blocking purposes. This structure is very advantageous for high power switching applications and for any device that requires a buried active p-GaN layer for its functionality.Type: GrantFiled: June 20, 2012Date of Patent: January 20, 2015Assignee: The Regents of the University of CaliforniaInventors: Srabanti Chowdhury, Ramya Yeluri, Christophe Hurni, Umesh K. Mishra, Ilan Ben-Yaacov
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Publication number: 20140377930Abstract: An electronic component includes a depletion-mode transistor, an enhancement-mode transistor, and a resistor. The depletion-mode transistor has a higher breakdown voltage than the enhancement-mode transistor. A first terminal of the resistor is electrically connected to a source of the enhancement-mode transistor, and a second terminal of the resistor and a source of the depletion-mode transistor are each electrically connected to a drain of the enhancement-mode transistor. A gate of the depletion-mode transistor can be electrically connected to a source of the enhancement-mode transistor.Type: ApplicationFiled: September 5, 2014Publication date: December 25, 2014Inventors: Rakesh K. Lal, Robert Coffie, Yifeng Wu, Primit Parikh, Yuvaraj Dora, Umesh Mishra, Srabanti Chowdhury, Nicholas Fichtenbaum
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Patent number: 8901604Abstract: Semiconductor devices with guard rings are described. The semiconductor devices may be, e.g., transistors and diodes designed for high-voltage applications. A guard ring is a floating electrode formed of electrically conducting material above a semiconductor material layer. A portion of an insulating layer is between at least a portion of the guard ring and the semiconductor material layer. A guard ring may be located, for example, on a transistor between a gate and a drain electrode. A semiconductor device may have one or more guard rings.Type: GrantFiled: September 6, 2011Date of Patent: December 2, 2014Assignee: Transphorm Inc.Inventors: Umesh Mishra, Srabanti Chowdhury, Yuvaraj Dora
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Patent number: 8860495Abstract: An electronic component includes a depletion-mode transistor, an enhancement-mode transistor, and a resistor. The depletion-mode transistor has a higher breakdown voltage than the enhancement-mode transistor. A first terminal of the resistor is electrically connected to a source of the enhancement-mode transistor, and a second terminal of the resistor and a source of the depletion-mode transistor are each electrically connected to a drain of the enhancement-mode transistor. A gate of the depletion-mode transistor can be electrically connected to a source of the enhancement-mode transistor.Type: GrantFiled: October 31, 2013Date of Patent: October 14, 2014Assignee: Transphorm Inc.Inventors: Rakesh K. Lal, Robert Coffie, Yifeng Wu, Primit Parikh, Yuvaraj Dora, Umesh Mishra, Srabanti Chowdhury, Nicholas Fichtenbaum
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Publication number: 20140299940Abstract: An electronic component includes a high-voltage depletion-mode transistor and a low-voltage enhancement-mode transistor. A source electrode of the high-voltage depletion-mode transistor is electrically connected to a drain electrode of the low-voltage enhancement-mode transistor, and a gate electrode of the high-voltage depletion-mode transistor is electrically coupled to the source electrode of the low-voltage enhancement-mode transistor. The on-resistance of the enhancement-mode transistor is less than the on-resistance of the depletion-mode transistor, and the maximum current level of the enhancement-mode transistor is smaller than the maximum current level of the depletion-mode transistor.Type: ApplicationFiled: June 23, 2014Publication date: October 9, 2014Inventors: Yifeng Wu, Umesh Mishra, Srabanti Chowdhury
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Publication number: 20140231929Abstract: A transistor device is described that includes a source, a gate, a drain, a semiconductor material which includes a gate region between the source and the drain, a plurality of channel access regions in the semiconductor material on either side of the gate, a channel in the semiconductor material having an effective width in the gate region and in the channel access regions, and an isolation region in the gate region. The isolation region serves to reduce the effective width of the channel in the gate region without substantially reducing the effective width of the channel in the access regions. Alternatively, the isolation region can be configured to collect holes that are generated in the transistor device. The isolation region may simultaneously achieve both of these functions.Type: ApplicationFiled: April 24, 2014Publication date: August 21, 2014Applicant: Transphorm Inc.Inventors: Umesh Mishra, Srabanti Chowdhury
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Publication number: 20140231823Abstract: A III-N semiconductor HEMT device includes an electrode-defining layer on a III-N material structure. The electrode-defining layer has a recess with a first sidewall proximal to the drain and a second sidewall proximal to the source, each sidewall comprising a plurality of steps. A portion of the recess distal from the III-N material structure has a larger width than a portion of the recess proximal to the III-N material structure. An electrode is in the recess, the electrode including an extending portion over the first sidewall. A portion of the electrode-defining layer is between the extending portion and the III-N material structure. The first sidewall forms a first effective angle relative to the surface of the III-N material structure and the second sidewall forms a second effective angle relative to the surface of the III-N material structure, the second effective angle being larger than the first effective angle.Type: ApplicationFiled: February 13, 2014Publication date: August 21, 2014Applicant: Transphorm Inc.Inventors: Srabanti Chowdhury, Umesh Mishra, Yuvaraj Dora
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Patent number: 8803246Abstract: An electronic component includes a high-voltage depletion-mode transistor and a low-voltage enhancement-mode transistor. A source electrode of the high-voltage depletion-mode transistor is electrically connected to a drain electrode of the low-voltage enhancement-mode transistor, and a gate electrode of the high-voltage depletion-mode transistor is electrically coupled to the source electrode of the low-voltage enhancement-mode transistor. The on-resistance of the enhancement-mode transistor is less than the on-resistance of the depletion-mode transistor, and the maximum current level of the enhancement-mode transistor is smaller than the maximum current level of the depletion-mode transistor.Type: GrantFiled: July 16, 2012Date of Patent: August 12, 2014Assignee: Transphorm Inc.Inventors: Yifeng Wu, Umesh Mishra, Srabanti Chowdhury
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Patent number: 8742460Abstract: A transistor device is described that includes a source, a gate, a drain, a semiconductor material which includes a gate region between the source and the drain, a plurality of channel access regions in the semiconductor material on either side of the gate, a channel in the semiconductor material having an effective width in the gate region and in the channel access regions, and an isolation region in the gate region. The isolation region serves to reduce the effective width of the channel in the gate region without substantially reducing the effective width of the channel in the access regions. Alternatively, the isolation region can be configured to collect holes that are generated in the transistor device. The isolation region may simultaneously achieve both of these functions.Type: GrantFiled: December 15, 2010Date of Patent: June 3, 2014Assignee: Transphorm Inc.Inventors: Umesh Mishra, Srabanti Chowdhury
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Publication number: 20140094010Abstract: An electronic component includes a depletion-mode transistor, an enhancement-mode transistor, and a resistor. The depletion-mode transistor has a higher breakdown voltage than the enhancement-mode transistor. A first terminal of the resistor is electrically connected to a source of the enhancement-mode transistor, and a second terminal of the resistor and a source of the depletion-mode transistor are each electrically connected to a drain of the enhancement-mode transistor. A gate of the depletion-mode transistor can be electrically connected to a source of the enhancement-mode transistor.Type: ApplicationFiled: October 31, 2013Publication date: April 3, 2014Applicant: Transphorm Inc.Inventors: Rakesh L. Lal, Robert Coffie, Yifeng Wu, Primit Parikh, Yuvaraj Dora, Umesh Mishra, Srabanti Chowdhury, Nicholas Fichtenbaum
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Publication number: 20140015066Abstract: An electronic component includes a high-voltage depletion-mode transistor and a low-voltage enhancement-mode transistor. A source electrode of the high-voltage depletion-mode transistor is electrically connected to a drain electrode of the low-voltage enhancement-mode transistor, and a gate electrode of the high-voltage depletion-mode transistor is electrically coupled to the source electrode of the low-voltage enhancement-mode transistor. The on-resistance of the enhancement-mode transistor is less than the on-resistance of the depletion-mode transistor, and the maximum current level of the enhancement-mode transistor is smaller than the maximum current level of the depletion-mode transistor.Type: ApplicationFiled: July 16, 2012Publication date: January 16, 2014Applicant: TRANSPHORM INC.Inventors: Yifeng Wu, Umesh Mishra, Srabanti Chowdhury
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Publication number: 20140001557Abstract: Transistor devices which include semiconductor layers with integrated hole collector regions are described. The hole collector regions are configured to collect holes generated in the transistor device during operation and transport them away from the active regions of the device. The hole collector regions can be electrically connected or coupled to the source, the drain, or a field plate of the device. The hole collector regions can be doped, for example p-type or nominally p-type, and can be capable of conducting holes but not electrons.Type: ApplicationFiled: June 27, 2012Publication date: January 2, 2014Applicant: TRANSPHORM INC.Inventors: Umesh Mishra, Srabanti Chowdhury, Ilan Ben-Yaacov
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Patent number: 8598937Abstract: An electronic component includes a depletion-mode transistor, an enhancement-mode transistor, and a resistor. The depletion-mode transistor has a higher breakdown voltage than the enhancement-mode transistor. A first terminal of the resistor is electrically connected to a source of the enhancement-mode transistor, and a second terminal of the resistor and a source of the depletion-mode transistor are each electrically connected to a drain of the enhancement-mode transistor. A gate of the depletion-mode transistor can be electrically connected to a source of the enhancement-mode transistor.Type: GrantFiled: October 7, 2011Date of Patent: December 3, 2013Assignee: Transphorm Inc.Inventors: Rakesh K. Lal, Robert Coffie, Yifeng Wu, Primit Parikh, Yuvaraj Dora, Umesh Mishra, Srabanti Chowdhury, Nicholas Fichtenbaum
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Publication number: 20130264578Abstract: An N-polar III-N transistor includes a III-N buffer layer, a first III-N barrier layer, and a III-N channel layer, the III-N channel layer having a gate region and a plurality of access regions on opposite sides of the gate region. The compositional difference between the first III-N barrier layer and the III-N channel layer causes a conductive channel to be induced in the access regions of the III-N channel layer. The transistor also includes a source, a gate, a drain, and a second III-N barrier layer between the gate and the III-N channel layer. The second III-N barrier layer has an N-face proximal to the gate and a group-III face opposite the N-face, and has a larger bandgap than the III-N channel layer. The lattice constant of the first III-N barrier layer is within 0.5% of the lattice constant of the buffer layer.Type: ApplicationFiled: April 9, 2013Publication date: October 10, 2013Applicant: TRANSPHORM INC.Inventors: Umesh Mishra, Srabanti Chowdhury, Carl Joseph Neufeld
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Publication number: 20130088280Abstract: An electronic component includes a depletion-mode transistor, an enhancement-mode transistor, and a resistor. The depletion-mode transistor has a higher breakdown voltage than the enhancement-mode transistor. A first terminal of the resistor is electrically connected to a source of the enhancement-mode transistor, and a second terminal of the resistor and a source of the depletion-mode transistor are each electrically connected to a drain of the enhancement-mode transistor. A gate of the depletion-mode transistor can be electrically connected to a source of the enhancement-mode transistor.Type: ApplicationFiled: October 7, 2011Publication date: April 11, 2013Applicant: TRANSPHORM INC.Inventors: Rakesh K. Lal, Robert Coffie, Yifeng Wu, Primit Parikh, Yuvaraj Dora, Umesh Mishra, Srabanti Chowdhury, Nicholas Fichtenbaum
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Publication number: 20130056744Abstract: Semiconductor devices with guard rings are described. The semiconductor devices may be, e.g., transistors and diodes designed for high-voltage applications. A guard ring is a floating electrode formed of electrically conducting material above a semiconductor material layer. A portion of an insulating layer is between at least a portion of the guard ring and the semiconductor material layer. A guard ring may be located, for example, on a transistor between a gate and a drain electrode. A semiconductor device may have one or more guard rings.Type: ApplicationFiled: September 6, 2011Publication date: March 7, 2013Applicant: TRANSPHORM INC.Inventors: Umesh Mishra, Srabanti Chowdhury, Yuvaraj Dora