Patents by Inventor Sridharan Venk
Sridharan Venk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10907782Abstract: A luminous fiber may include a flexible printed circuit board extending in a length direction of the fiber, at least one electrically conductive trace being formed on the flexible printed circuit board, at least one light emitting component being arranged on the flexible printed circuit board and being electrically connected to the trace, and a lateral strengthening structure for strengthening the luminous fiber in lateral direction perpendicular to the length direction. The lateral strengthening structure may include two frame bars, which are formed on the flexible printed circuit board and which extend in the length direction of the fiber. The lateral strengthening structure may include several lateral support elements, which are formed on the flexible printed circuit board between the frame bars and which are coupled to the frame bars.Type: GrantFiled: March 12, 2018Date of Patent: February 2, 2021Assignee: OSRAM GmbHInventors: Guido Angenendt, Sridharan Venk
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Publication number: 20200278093Abstract: A luminous fiber may include a flexible printed circuit board extending in a length direction of the fiber, at least one electrically conductive trace being formed on the flexible printed circuit board, at least one light emitting component being arranged on the flexible printed circuit board and being electrically connected to the trace, and a lateral strengthening structure for strengthening the luminous fiber in lateral direction perpendicular to the length direction. The lateral strengthening structure may include two frame bars, which are formed on the flexible printed circuit board and which extend in the length direction of the fiber. The lateral strengthening structure may include several lateral support elements, which are formed on the flexible printed circuit board between the frame bars and which are coupled to the frame bars.Type: ApplicationFiled: March 12, 2018Publication date: September 3, 2020Inventors: Guido Angenendt, Sridharan Venk
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Publication number: 20190306976Abstract: A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. The body portion includes a perimeter edge having at least a first convex segment and a second convex with a first non-convex segment disposed between the first convex segment and the second convex segment. A method of constructing a flexible circuit to facilitate roll-to-roll manufacturing of the flexible circuit is also provided.Type: ApplicationFiled: June 17, 2019Publication date: October 3, 2019Applicant: OSRAM SYLVANIA Inc.Inventors: Sridharan Venk, Earl Alfred Picard, JR., Qi Dai, Richard Garner
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Patent number: 10368436Abstract: A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. The body portion includes a perimeter edge having at least a first convex segment and a second convex with a first non-convex segment disposed between the first convex segment and the second convex segment. A method of constructing a flexible circuit to facilitate roll-to-roll manufacturing of the flexible circuit is also provided.Type: GrantFiled: March 15, 2017Date of Patent: July 30, 2019Assignee: OSRAM SYLVANIA Inc.Inventors: Sridharan Venk, Earl Alfred Picard, Jr., Qi Dai, Richard Garner
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Publication number: 20180340675Abstract: A lighting device and corresponding method are described herein. In various aspects, a lighting device may include a stacked arrangement of layers. The stacked arrangement of layers may include a light-emitting layer containing a distribution of electrically powered light radiation sources. The stacked arrangement of layers may further include at least one light-diffusive layer laminated over the light-emitting layer. The at least one light-diffusive layer may be configured to diffuse light radiation from the light radiation sources.Type: ApplicationFiled: May 17, 2018Publication date: November 29, 2018Inventor: Sridharan Venk
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Publication number: 20180342491Abstract: A light-emitting device and corresponding method for providing a light-emitting device are described herein. In some aspects, a light-emitting device may include a flexible, light-permeable laminar substrate. The laminar substrate may include a plastic material, such as polyethylene naphtalate (PEN). The light-emitting device may also include a distribution of laminar, electrically powered light radiation sources. The electrically powered light radiation sources may include light-emitting diodes (LEDs) of a chip scale package (CSP) type on the laminar substrate. The light-emitting device may further include a layout of laminar (e.g., ink-printed), electrically conductive traces on the laminar substrate. The electrically conductive traces may be configured to serve the electrically powered light radiation sources.Type: ApplicationFiled: February 28, 2018Publication date: November 29, 2018Inventors: Sridharan Venk, Enrico Ganzer, Federico Poggi
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Patent number: 10088116Abstract: A lighting device includes a laminar support member bendable at bending lines extending in a common direction, the bending lines partitioning the laminar support member in a plurality of stripes. The plurality of stripes includes at least one first stripe with electrically-powered light radiation sources therealong and at least one second stripe free from light radiation sources forming a side wing for the at least one first stripe.Type: GrantFiled: May 6, 2016Date of Patent: October 2, 2018Assignee: OSRAM GmbHInventors: Sridharan Venk, Dina Pasqualini, Alessandro Scordino
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Publication number: 20180119902Abstract: Lighting devices, and methods of manufacturing the same, are provided. A lighting device includes a cover through which emitted light passes and a formed flexible light engine. The formed flexible light engine is placed within a housing, or serves as the housing itself. An interface couples to cover to the housing or the formed flexible light engine. The formed flexible light engine includes a flexible substrate and a plurality of solid state light sources located thereon. The plurality of solid state light sources are configured to emit light through the cover. The formed light engine has a defined shape created during the forming process. This enables placement on the housing within the lighting device, or contributes to the overall shape of the lighting device.Type: ApplicationFiled: September 23, 2015Publication date: May 3, 2018Applicants: OSRAM SYLVANIA Inc., OSRAM GmbH, OSRAM S.P.A. - SOCIETA' RIUNITE OSRAM EDISON CLERICIInventors: Qi Dai, Bruce Radl, Richard Speer, Qiong Huang, Rodrigo Pereyra, Maxim Tchoul, Alessandro Scordino, Lorenzo Baldo, Simon Bobbo, Dina Pasqualini, Geert van der Meer, Sridharan Venk
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Publication number: 20170188454Abstract: A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. The body portion includes a perimeter edge having at least a first convex segment and a second convex with a first non-convex segment disposed between the first convex segment and the second convex segment. A method of constructing a flexible circuit to facilitate roll-to-roll manufacturing of the flexible circuit is also provided.Type: ApplicationFiled: March 15, 2017Publication date: June 29, 2017Applicant: OSRAM SYLVANIA Inc.Inventors: Sridharan Venk, Earl Alfred Picard, Qi Dai, Richard Garner
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Patent number: 9635759Abstract: A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. The body portion includes a perimeter edge having at least a first convex segment and a second convex with a first non-convex segment disposed between the first convex segment and the second convex segment. A method of constructing a flexible circuit to facilitate roll-to-roll manufacturing of the flexible circuit is also provided.Type: GrantFiled: May 31, 2014Date of Patent: April 25, 2017Assignee: OSRAM SYLVANIA Inc.Inventors: Sridharan Venk, Earl Alfred Picard, Jr., Qi Dai, Richard Garner
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Publication number: 20160327223Abstract: A lighting device includes a laminar support member bendable at bending lines extending in a common direction, said bending lines partitioning said laminar support member in a plurality of stripes. Said plurality of stripes includes at least one first stripe with electrically-powered light radiation sources therealong and at least one second stripe free from light radiation sources forming a side wing for said at least one first stripe.Type: ApplicationFiled: May 6, 2016Publication date: November 10, 2016Inventors: Sridharan Venk, Dina Pasqualini, Alessandro Scordino
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Patent number: 9335034Abstract: A flexible circuit board is described that includes a flexible substrate, at least one ridge defining a flexion zone and a component mounting area. The flexion zone acting to dissipate at least a portion of a force applied to the substrate, so as to insulate the component mounting area from the force. Light sources using such flexible circuit boards and methods for making such circuit boards are also described.Type: GrantFiled: September 27, 2013Date of Patent: May 10, 2016Assignee: OSRAM SYLVANIA INCInventors: Richard Speer, Adam Scotch, Jeffery Serre, Sridharan Venk
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Patent number: 9000598Abstract: The present disclosure is directed to orientation-independent device configuration and assembly. An electronic device may comprise conductive pads arranged concentrically on a surface of the device. The conductive pads on the device may mate with conductive pads in a device location in circuitry. Example conductive pads may include at least a first circular conductive pad and a second ring-shaped conductive pad arranged to concentrically surround the first conductive pad. The concentric arrangement of the conductive pads allows for orientation-independent placement of the device in the circuitry. In particular, the conductive pads of the device will mate correctly with the conductive pads of the circuitry regardless of variability in device orientation. In one embodiment, the device may also be configured for use with fluidic self-assembly (FSA). For example, a device housing may be manufactured with pockets that cause the device to attain neutral buoyancy during manufacture.Type: GrantFiled: September 27, 2013Date of Patent: April 7, 2015Assignee: OSRAM Sylvania Inc.Inventors: David W. Hamby, Adam M. Scotch, Sridharan Venk, Alan Lenef
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Publication number: 20150092429Abstract: A flexible circuit board is described that includes a flexible substrate, at least one ridge defining a flexion zone and a component mounting area. The flexion zone acting to dissipate at least a portion of a force applied to the substrate, so as to insulate the component mounting area from the force. Light sources using such flexible circuit boards and methods for making such circuit boards are also described.Type: ApplicationFiled: September 27, 2013Publication date: April 2, 2015Applicant: OSRAM SYLVANIA INC.Inventors: Richard Speer, Adam Scotch, Jeffery Serre, Sridharan Venk
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Publication number: 20150093860Abstract: The present disclosure is directed to orientation-independent device configuration and assembly. An electronic device may comprise conductive pads arranged concentrically on a surface of the device. The conductive pads on the device may mate with conductive pads in a device location in circuitry. Example conductive pads may include at least a first circular conductive pad and a second ring-shaped conductive pad arranged to concentrically surround the first conductive pad. The concentric arrangement of the conductive pads allows for orientation-independent placement of the device in the circuitry. In particular, the conductive pads of the device will mate correctly with the conductive pads of the circuitry regardless of variability in device orientation. In one embodiment, the device may also be configured for use with fluidic self-assembly (FSA). For example, a device housing may be manufactured with pockets that cause the device to attain neutral buoyancy during manufacture.Type: ApplicationFiled: September 27, 2013Publication date: April 2, 2015Applicant: OSRAM SYLVANIA INC.Inventors: David W. Hamby, Adam M. Scotch, Sridharan Venk, Alan Lenef
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Publication number: 20150049444Abstract: A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. The body portion includes a perimeter edge having at least a first convex segment and a second convex with a first non-convex segment disposed between the first convex segment and the second convex segment. A method of constructing a flexible circuit to facilitate roll-to-roll manufacturing of the flexible circuit is also provided.Type: ApplicationFiled: May 31, 2014Publication date: February 19, 2015Applicant: OSRAM SYLVANIA INC.Inventors: Sridharan Venk, Earl Alfred Picard, JR., Qi Dai, Richard Garner
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Publication number: 20140335635Abstract: Described herein are electronic assemblies including a subassembly film and methods for making the same. In some embodiments, a first subassembly is formed by placing an electronic die at a die placement location on a subassembly film. A second subassembly may be formed by placing the first subassembly at a subassembly placement position on a base layer, such that electrical contacts/traces on the first film overlap with electrical contacts/traces at a subassembly connection point on the base layer. Placement of the die on the subassembly film may be performed with automatic placement machinery that has a placement accuracy that is greater than that required to place the first subassembly on the base layer. As a result, the costly and time consuming manual inspection of die placement may be avoided.Type: ApplicationFiled: May 10, 2013Publication date: November 13, 2014Applicant: OSRAM SYLVANIA INC.Inventors: Sridharan Venk, Adam Scotch, David Hamby
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Patent number: D774477Type: GrantFiled: March 28, 2014Date of Patent: December 20, 2016Assignee: OSRAM SYLVANIA Inc.Inventors: Sridharan Venk, Earl Alfred Picard, Jr., Qi Dai, Richard Garner
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Patent number: D844577Type: GrantFiled: November 12, 2016Date of Patent: April 2, 2019Assignee: OSRAM SYLVANIA Inc.Inventors: Sridharan Venk, Earl Alfred Picard, Jr., Qi Dai, Richard Garner
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Patent number: D877103Type: GrantFiled: February 13, 2019Date of Patent: March 3, 2020Assignee: OSRAM SYLVANIA Inc.Inventors: Sridharan Venk, Earl Alfred Picard, Jr., Qi Dai, Richard Garner