Conductor pad

- OSRAM SYLVANIA Inc.
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a top plan view of a first embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 2 is a top plan view of a second embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 3 is a top plan view of a third embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 4 is a top plan view of a fourth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 5 is a top plan view of a fifth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 6 is a top plan view of a sixth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 7 is a top plan view of a seventh embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 8 is a top plan view of an eighth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 9 is a top plan view of a ninth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 10 is a top plan view of a tenth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 11 is a top plan view of an eleventh embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof; and,

FIG. 12 is a top plan view of a twelfth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

The broken-line disclosure in the views is understood to represent portions of the article in which the claimed design is embodied, but which form no part of the claimed design.

All surfaces not shown form no part of the claimed design.

Claims

The ornamental design for a conductor pad, as shown and described.

Referenced Cited
U.S. Patent Documents
D327883 July 14, 1992 Gloton
D328599 August 11, 1992 Gloton
6803582 October 12, 2004 Berglund
D503691 April 5, 2005 Standing
D598380 August 18, 2009 Kuriki
D613690 April 13, 2010 Kuriki
D615927 May 18, 2010 Kuriki
8791560 July 29, 2014 Hu
9082626 July 14, 2015 Gatterbauer
D774477 December 20, 2016 Venk
Patent History
Patent number: D877103
Type: Grant
Filed: Feb 13, 2019
Date of Patent: Mar 3, 2020
Assignee: OSRAM SYLVANIA Inc. (Wilmington, MA)
Inventors: Sridharan Venk (Treviso), Earl Alfred Picard, Jr. (Portsmouth, NH), Qi Dai (Shanghai), Richard Garner (Arlington, MA)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/680,129