Abstract: A method of forming a plurality of sealed packages comprises providing a base including a base surface; providing a lid including a lid surface; positioning a plurality of spaced apart seal members along the base surface, the seal members being formed from a seal material including a fusible metal alloy; positioning the lid on the base with a plurality of spaced apart spacers positioned and extending between the base surface and the lid surface, the spacers maintaining the lid surface spaced apart from the seal members by a fluid gap, the spacers being made from a spacer material including a fusible metal alloy; creating a controlled environment around the base and the lid; and heating to melt the spacers and the seal material so that the seal members form a plurality of seal rings between the base surface and the lid surface.

Abstract: A method for manufacturing a plurality of die pairs includes providing a first wafer including a plurality of spaced apart first dies arranged in a first array including a first, first die row and a second, first die row spaced apart by a first portion of a first row channel; providing a second wafer including a plurality of spaced apart second dies arranged in a second array including a first, second die row and a second, second die row spaced apart by a second portion of the first row channel; connecting the first wafer to the second wafer with a connector assembly to form a wafer pair such that the first dies and the second dies cooperate to form the plurality of die pairs; positioning a first support assembly between the first wafer and the second wafer to rigidly support the first wafer relative to the second wafer; and cutting along the first row channel with a blade to separate the plurality of die pairs from one another.

Abstract: Semiconductor devices are described that employ techniques configured to control adhesive application between a substrate and a die. In an implementation, a sacrificial layer is provided on a top surface of the die to protect the surface, and bonds pads thereon, from spill-over of the adhesive. The sacrificial layer and spill-over adhesive are subsequently removed from the die and/or chip carrier. In an implementation, the die includes a die attach film (DAF) on a bottom surface of the die for adhering the die to the cavity of the substrate. The die is applied to the cavity with heat and pressure to cause a portion of the die attach film (DAF) to flow from the bottom surface of the die to a sloped surface of the substrate cavity.

Abstract: A process is described for production of a chlorinated sucrose from a process stream containing a 6-O-protected chlorinated sucrose derived from chlorination of 6-O-protected sucrose wherein the process stream is treated under conditions which prevent or reverse deacylation of 6-O-protected chlorinated sucrose, extracting the same in a solvent, washing most of the dimethylformamide free from the solvent extract by repeated washing with saturated sodium chloride solution, isolating the 6-O-protected sucrose as a pure fraction and obtaining a chlorinated sucrose by deacylating the same.