Abstract: A method for forming a solder joint for a package arrangement with a dispersed Sn microstructure provides a flip chip on a package, with a flip chip having solder bumps to be connected by eutectic solder joints to pads on the package. The eutectic solder is reflowed at a solder bump/pad interface with a eutectic reflow profile that is configured to achieve eutectic solder joints having substantially evenly distributed Sn grains. The eutectic reflow profile includes an increased cooling rate and decreased hold time with a higher peak temperature. A defined ratio of the pad openings in the solder mask to the under bump metallurgy is provided. The eutectic reflow profile and the defined ratio prolong fatigue life in the package arrangement.

Abstract: Data may be provided in a language chosen by a user. A data record may be stored in a database using symbols to represent data. These symbols may be converted into various languages. A resource file for a given language defines a correspondence between the symbols in the record and the words in that language. A user indicates a choice of language in which to receive data. The user's choice is stored in the database, and conversion information from the resource file for the user's chosen language is copied to the database. When a program connects to a database and requests data records, the user's language choice is retrieved from the data, and the conversion information stored in the database is used to convert the data records into the chosen language. The requested data is then provided to the application in the user's chosen language.

Abstract: Various methods and apparatus for semiconductor packing are disclosed. In one aspect, a method of manufacturing is provided that includes coupling first ends of plural conductor pins to a first surface of a semiconductor chip package substrate. A layer is formed on the first surface that engages and resists lateral movement of the conductor pins while leaving second ends of the conductor pins exposed.

Abstract: A method and system for configuring an instance of a business information application program based on data exported from an instance of the application program is provided. Each instance of the application program has a database storing an organizations' business data. Template providers desiring to provide a template containing configuration and instance data to organizations using the application program may use the application program to set up configuration and instance data for a particular type of organization. Once the database is populated with configuration and instance data, the template provider can use an export function to export the configuration and instance data to a template file. The template file is then provided to an organization that wants to initialize its database based on the template. The organization uses an import function to import configuration and instance data from the template into the organization's database.

Abstract: A method for association of a mobile terminal with an access point (AP) includes determining a set of available APs. The AP from among the available APs that has the coverage area that is likely to encompass the mobile terminal for the greatest period of time or distance is selected. The selected AP is associated with the mobile terminal.

Abstract: Various semiconductor chip underfills and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a substrate to leave a gap therebetween, and forming an underfill layer in the gap. The underfill layer includes a first plurality of filler particles that have a first average size and a second plurality of filler particles that have a second average size smaller than the first average size such that the first plurality of filler particles is concentrated proximate the substrate and the second plurality of filler particles is concentrated proximate the semiconductor chip so that a bulk modulus of the underfill layer is larger proximate the substrate than proximate the semiconductor chip.

Abstract: A system provides targeted advertising to customers of an application while preserving the confidentiality of the customers' application information. A marketing system provides a marketing engine that executes on a computer system of the customer of an application and provides targeted marketing to that customer. Since the marketing engine executes on the customer's own computer system, it may have access to the customer's application information. The marketing engine can analyze the application information and provide marketing information that is targeted to the customer without compromising the confidentiality of the customer's application information.

Abstract: An edge-covering based greedy method for shared filter ordering includes receiving a plurality of queries, wherein each query is a conjunction of filters, and each filter is shared across multiple queries of the plurality of queries, evaluating a unit price of each filter, evaluating, sequentially, each filter in order of a lowest to a highest unit price, to determine a value for each filter, and changing an ordering of the filters according to the values. An edge-covering based harmonic method for shared filter ordering includes receiving a plurality of queries, wherein each query is a conjunction of filters, and each filter is shared across multiple queries of the plurality of queries, evaluating a weight of each filter, evaluating, randomly, each filter having a probability inversely proportionally to its weight, to determine a value, and changing an ordering of the filters according to the values.

Abstract: A service framework wherein a markup language based software development kit that maps an object model of a service SDK to a set of markup language schemas. On the basis of the markup language schemas the service may convert any service data object into a markup language string, and vice versa. All data exchange requests and responses are in the format of markup language strings such that web services perform data exchange with the service through standard internet technologies, for example JavaScript and SOAP. The UI of the service is abstracted to a markup language structure. The definition of interaction points of web services are also standardized, such that other services may customize the service user interface through a simple markup language string, passed via custom code. In this way, deployment and enlightening of web based services in the service may be controlled from the server or web service side.

Abstract: A semantic publish-subscribe system, including: a plurality of subscribers; a plurality of publishers; and a server that receives and stores subscriptions that are described in web ontology language (OWL) graph patterns from the plurality of subscribers and that receives events that are described in semantic graphs formed by OWL assertions from the plurality of publishers, wherein when the server receives an event from a publisher, the server expands the OWL assertions of the event using a reasoner to produce an expanded event, the server matches the expanded event to a subscription, and then, the server notifies a subscriber whose interest matches the event.

Abstract: Various methods and apparatus for semiconductor packing are disclosed. In one aspect, a method of manufacturing is provided that includes coupling first ends of plural conductor pins to a first surface of a semiconductor chip package substrate. A layer is formed on the first surface that engages and resists lateral movement of the conductor pins while leaving second ends of the conductor pins exposed.

Abstract: A system for supporting version management is provided. The system includes a first application having a plurality of versions. Each of the plurality of versions is associated with a separate a version-specific assembly. A loader is configured to load one of the version-specific assemblies, the assembly then being utilized as a basis for deriving an object from a database associated with the first application. The object is provided to a second application, typically in response to a corresponding request.

Abstract: A package substrate includes die solder pads and pin solder fillets. The pin solder fillets might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die solder pads might comprise between approximately 4 wt % to approximately 8 wt % bismuth, approximately 2 wt % to approximately 4 wt % silver, approximately 0 wt % to approximately 0.7 wt % copper, and approximately 87 wt % to approximately 92 wt % tin. The die solder pads might comprise between approximately 7 wt % to approximately 20 wt % indium, between approximately 2 wt % to approximately 4.5 wt % silver, between approximately 0 wt % to approximately 0.7 wt % copper, between approximately 0 wt % to approximately 0.5 wt % antimony, and between approximately 74.3 wt % to approximately 90 wt % tin.

Abstract: A package substrate includes die solder pads and pin solder fillets. The pin solder fillets might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die solder pads might comprise between approximately 4 wt % to approximately 8 wt % bismuth, approximately 2 wt % to approximately 4 wt % silver, approximately 0 wt % to approximately 0.7 wt % copper, and approximately 87 wt % to approximately 92 wt % tin. The die solder pads might comprise between approximately 7 wt % to approximately 20 wt % indium, between approximately 2 wt % to approximately 4.5 wt % silver, between approximately 0 wt % to approximately 0.7 wt % copper, between approximately 0 wt % to approximately 0.5 wt % antimony, and between approximately 74.3 wt % to approximately 90 wt % tin.

Abstract: An application or method of populating a transaction from a document using procedures associated with document type. In the embodiments described, the application or method posts a financial transaction from a financial document, such as a sales invoice or vendor bill to a financial account, such as A/R or COGS. In embodiments described, the application or method employs posting procedures for posting types associated with the document type and document line type of the document. The posting procedures are invoked for the posting class or type attributed to the document type or the document line type to post the transaction.

Abstract: A data transaction system allows performing a transaction related to a data unit, where the data unit can be independently saved and retrieved, from an upper layer to a storage layer without causing a database deadlock related to the data unit in the storage layer. The data transaction system uses a first stage for transferring the data unit from the upper layer to the storage layer, and a second stage to save the transferred data unit independent of the upper layer. The data transaction system guarantees data consistency in applications using multiple layer architecture and at the same time avoiding cost and inefficiencies related to a database deadlock scenario.

Abstract: A program interface which provides access from a business management application to an accounting application to share account information. As described in illustrative embodiments, the system includes an interface module to instantiate and invoke an interface from the business management application to generate an accounting record from an opportunity or prospect record in the business management application. Thus, the accounting record is generated through the interface from the business management application to eliminate the need for duplicate data entry in the accounting application.