Patents by Inventor Sriram Srinivasan

Sriram Srinivasan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9659574
    Abstract: A noise attenuation apparatus receives a first signal comprising a desired and a noise signal component. Two codebooks (109, 111) comprise respectively desired signal candidates and noise signal candidates representing possible desired and noise signal components respectively. A noise attenuator (105) generates estimated signal candidates by for each pair of desired and noise signal candidates generating an estimated signal candidate as a combination of the desired signal candidate and the noise signal candidate. A signal candidate is then determined from the estimated signal candidates and the first signal is noise compensated based on this signal candidate. A sensor signal representing a measurement of the desired source or the noise in the environment is used to reduce the number of candidates searched thereby substantially reducing complexity and computational resource usage. The noise attenuation may specifically be audio noise attenuation.
    Type: Grant
    Filed: October 16, 2012
    Date of Patent: May 23, 2017
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Patrick Kechichian, Sriram Srinivasan
  • Publication number: 20170084280
    Abstract: There is provided method comprising: in response to receiving a request for providing an encoded payload; encoding a first payload using at least three different data rates; outputting the encoded first payloads to respective buffers; and transmitting at least two of the encoded first payloads in respective frames, wherein the later transmitted encoded first payload is encoded at a data rate that is equal to or less than the data rate used to encode the first transmission of the first payload.
    Type: Application
    Filed: September 22, 2015
    Publication date: March 23, 2017
    Inventors: Sriram Srinivasan, Warren Lam, Xiaoqin Sun
  • Patent number: 9601848
    Abstract: An apparatus includes a plurality of contact elements to provide electrical continuity between an integrated circuit and an electronic subassembly, wherein a contact element includes a spring element and a separate lead element, wherein the spring element is arranged to be substantially vertically slidable over at least a portion of the lead element in response to a force applied to the contact element.
    Type: Grant
    Filed: October 26, 2015
    Date of Patent: March 21, 2017
    Assignee: Intel Corporation
    Inventors: Joshua D Heppner, Sriram Srinivasan
  • Patent number: 9596549
    Abstract: An audio system that includes an ultrasound sensor array which has a plurality of ultrasound sensor elements, and an audio band array which has a plurality of audio band elements. An estimator is configured to generate a presence characteristic of a user in response to ultrasound signals received from the ultrasound sensor array. The presence characteristic may include a position estimate for the user. An audio array circuit is configured to generate a directional response for the audio band array by applying weights to individual audio band signals for the audio band elements. A weight circuit is configured to determine the weights in response to the presence characteristic.
    Type: Grant
    Filed: January 2, 2012
    Date of Patent: March 14, 2017
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Ashish Vijay Pandharipande, Sriram Srinivasan
  • Publication number: 20170052280
    Abstract: In some embodiments, an apparatus, system, and method may operate to determine the density of drilling fluid associated with photon activity in the drilling fluid using an array of nuclear detectors. Further activity may include determining acoustic impedance of the drilling fluid as a combination of the density and acoustic velocity. Additional apparatus and systems, as well as methods, are disclosed.
    Type: Application
    Filed: December 3, 2015
    Publication date: February 23, 2017
    Applicant: Halliburton Energy Services, Inc.
    Inventors: Zhijuan Zhang, Weijun Guo, Sriram Srinivasan
  • Patent number: 9572258
    Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.
    Type: Grant
    Filed: December 30, 2004
    Date of Patent: February 14, 2017
    Assignee: Intel Corporation
    Inventors: Sriram Srinivasan, John S. Guzek, Cengiz A. Palanduz, Victor Prokofiev, Joel A. Auernheimer
  • Patent number: 9542656
    Abstract: Methods and apparatus, including computer program products, implementing and using techniques for integrating and data activities in a process flow. A data transformation activity is invoked through local or remote invocation. The data transformation activity is part of a process flow defined in a standard business process execution language format and is invoked from within the process flow. A system for executing a process flow including one or more control activities and one or more data transformation activities is also described. The system includes a process control engine for executing activities included in the process flow, a data transformation subsystem for storing domain specific definitions of data transformation processes of data in one or more databases, and a control data repository for storing domain specific activity information related to the process flow.
    Type: Grant
    Filed: November 13, 2006
    Date of Patent: January 10, 2017
    Assignee: International Business Machines Corporation
    Inventors: Marion Behnen, Qi Jin, Yannick Saillet, Sriram Srinivasan, Muthukumar Thirunavukkarasu, Hoi J. Yoo
  • Patent number: 9508358
    Abstract: Noise reduction system with remote noise detector The present invention relates to a noise reduction system with at least one remote noise detector placed close to at least one noise source, which transmits relevant information to a primary device where it is used for noise reduction. Thereby, acoustic signal enhancement can be achieved via the at least one remote noise detector in that a noise estimate is transmitted to controller for noise reduction in the signal obtained from a primary source.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: November 29, 2016
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventor: Sriram Srinivasan
  • Patent number: 9461431
    Abstract: A mechanism is described for facilitating and employing a magnetic grid array according to one embodiment. A method of embodiments may include engaging, via magnetic force of a magnet, magnetic contacts of a magnetic grid array to substrate lands of a package substrate of an integrated circuit package of a computing system, and disengaging, via a removal lever, the magnetic contacts from the substrate lands.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: October 4, 2016
    Assignee: Intel Corporation
    Inventors: Gregorio R. Murtagian, Bhanu Jaiswal, Sriram Srinivasan, Michael J. Hill
  • Patent number: 9461014
    Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include attaching a device to a patch substrate, wherein the assembled device and patch substrate comprise a warpage, attaching the assembled device and patch substrate to an interposer to form a package structure, and then reflowing the package structure at a temperature below about 200 degrees Celsius to form a substantially flat package structure.
    Type: Grant
    Filed: April 14, 2015
    Date of Patent: October 4, 2016
    Assignee: Intel Corporation
    Inventors: Sriram Srinivasan, Ram S. Viswanath, Paul R. Start, Rajen S. Sidhu, Rajasekaran Swaminathan
  • Patent number: 9426155
    Abstract: A cloud deployment appliance (or other platform-as-a-service (IPAS) infrastructure software) includes a mechanism to deploy a product as a “shared service” to the cloud, as well as to enable the product to establish a trust relationship between itself and the appliance or IPAS. The mechanism further enables multiple products deployed to the cloud to form trust relationships with each other (despite the fact that each deployment and each product typically, by the nature of the cloud deployment, are intended to be isolated from one another). In addition, once deployed and provisioned into the cloud, a shared service can become part of a single sign-on (SSO) domain automatically. SSO is facilitated using a token-based exchange. Once a product registers with a token service, it can participate in SSO. This approach enables enforcement of consistent access control policy across product boundaries, and without requiring a user to perform any configuration.
    Type: Grant
    Filed: April 18, 2013
    Date of Patent: August 23, 2016
    Assignee: International Business Machines Corporation
    Inventors: Ching-Yun Chao, John Yow-Chun Chang, Paul W. Bennett, John C. Sanchez, Donald R. Woods, Yuhsuke Kaneyasu, Sriram Srinivasan, Stuart Robert Douglas Monteith, Marcos Lohmann
  • Publication number: 20160212272
    Abstract: A user device for generating a scene, the user device comprising: an object determiner configured to determine an object for the scene, the object being associated with at least one audio signal; a relative position/orientation determiner configured to determine a relative position/orientation between the user device's user and the object; an audio position processor configured to spatially audio signal process the at least one audio signal to generate at least two channel audio signal based on the relative position/orientation.
    Type: Application
    Filed: January 21, 2015
    Publication date: July 21, 2016
    Inventors: Sriram Srinivasan, Ryan S. Menezes, Shawn Crispin Wright, Hongwu Huai
  • Patent number: 9391013
    Abstract: 3D integrated circuit packages with window interposers and methods to form such semiconductor packages are described. For example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer having a window is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in the window of the interposer and interconnected to the top semiconductor die. In another example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in a same plane as the interposer and interconnected to the top semiconductor die.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: July 12, 2016
    Assignee: Intel Corporation
    Inventors: Debendra Mallik, Ram S. Viswanath, Sriram Srinivasan, Mark T. Bohr, Andrew W. Yeoh, Sairam Agraharam
  • Patent number: 9361137
    Abstract: Methods, computer program products, and system for managing a parameter of an application are provided. In one implementation, the method includes identifying a plurality of phases associated with the application, in which each phase corresponds to a time period during a lifecycle of the application. The method further includes defining a range of phases among the plurality of phases associated with the application during which a value of the parameter can be changed.
    Type: Grant
    Filed: October 11, 2006
    Date of Patent: June 7, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Marion Behnen, Sameer V. Jorapur, Sriram Srinivasan, Muthukumar Thirunavukkarasu, Cheung-Yuk Wu
  • Publication number: 20160151850
    Abstract: Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.
    Type: Application
    Filed: February 5, 2016
    Publication date: June 2, 2016
    Inventors: Deepak V. Kulkarni, Carl L. Deppisch, Leonel R. Arana, Gregory S. Constable, Sriram Srinivasan
  • Patent number: 9286223
    Abstract: A processor includes a processing unit, a cache memory, and a central request queue. The central request queue is operable to receive a prefetch load request for a cache line to be loaded into the cache memory, receive a demand load request for the cache line from the processing unit, merge the prefetch load request and the demand load request to generate a promoted load request specifying the processing unit as a requestor, receive the cache line associated with the promoted load request, and forward the cache line to the processing unit.
    Type: Grant
    Filed: April 17, 2013
    Date of Patent: March 15, 2016
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Sriram Srinivasan, Tarun Nakra
  • Publication number: 20160043488
    Abstract: An apparatus includes a plurality of contact elements to provide electrical continuity between an integrated circuit and an electronic subassembly, wherein a contact element includes a spring element and a separate lead element, wherein the spring element is arranged to be substantially vertically slidable over at least a portion of the lead element in response to a force applied to the contact element.
    Type: Application
    Filed: October 26, 2015
    Publication date: February 11, 2016
    Inventors: Joshua D Heppner, Sriram Srinivasan
  • Patent number: 9254532
    Abstract: Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.
    Type: Grant
    Filed: December 30, 2009
    Date of Patent: February 9, 2016
    Assignee: Intel Corporation
    Inventors: Deepak V. Kulkarni, Carl L. Deppisch, Leonel R. Arana, Gregory S. Constable, Sriram Srinivasan
  • Publication number: 20150380010
    Abstract: An apparatus comprises microphone receivers (101) which receive microphone signals from a plurality of microphones (103). A comparator (105) determines a speech similarity indication indicative of a similarity between the microphone signal and non-reverberant speech for each microphone signal. The determination is in response to a comparison of a property derived from the microphone signal to a reference property for non-reverberant speech. In some embodiments, the comparator (105) determines the similarity indication by comparing to reference properties for speech samples of a set of non-reverberant speech samples. A generator (107) generates a speech signal by combining the microphone signals in response to the similarity indications. In many embodiments, the apparatus may be distributed over a plurality of devices each containing a microphone, and the approach may determine the most suited microphone for generating the speech signal.
    Type: Application
    Filed: February 18, 2014
    Publication date: December 31, 2015
    Applicant: KONINKLIJKE PHILIPS N.V.
    Inventor: Sriram SRINIVASAN
  • Publication number: 20150338510
    Abstract: A sensor such as a presence sensor for use in a lighting system or other system that adapts to information from a plurality of active presence sensors. If transmissions from the active sensors are uncoordinated, the overall detection performance may be adversely impacted (e.g. due to potential cross-interference), which may make sensing over the detection coverage area defined by a single presence sensor (or the like) become unreliable. The disclosure presents protocols for coordinating transmissions in active sensing systems. The invention may be applied to various active modalities (e.g. ultrasound, RF), for example that find applications in indoor and outdoor lighting controls.
    Type: Application
    Filed: December 13, 2013
    Publication date: November 26, 2015
    Inventors: ASHISH VIJAY PANDHARIPANDE, DAVID RICARDO CAICEDO FERNANDEZ, SRIRAM SRINIVASAN