Abstract: 3D integrated circuit packages with window interposers and methods to form such semiconductor packages are described. For example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer having a window is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in the window of the interposer and interconnected to the top semiconductor die. In another example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in a same plane as the interposer and interconnected to the top semiconductor die.

Abstract: A mechanism is described for facilitating and employing a magnetic grid array according to one embodiment. A method of embodiments may include engaging, via magnetic force of a magnet, magnetic contacts of a magnetic grid array to substrate lands of a package substrate of an integrated circuit package of a computing system, and disengaging, via a removal lever, the magnetic contacts from the substrate lands.

Abstract: An apparatus includes a plurality of contact elements to provide electrical continuity between an integrated circuit and an electronic subassembly, wherein a contact element includes a spring element and a separate lead element, wherein the spring element is arranged to be substantially vertically slidable over at least a portion of the lead element in response to a force applied to the contact element.

Abstract: 3D integrated circuit packages with window interposers and methods to form such semiconductor packages are described. For example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer having a window is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in the window of the interposer and interconnected to the top semiconductor die. In another example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in a same plane as the interposer and interconnected to the top semiconductor die.

Abstract: A mechanism is described for facilitating and employing a magnetic grid array according to one embodiment. A method of embodiments may include engaging, via magnetic force of a magnet, magnetic contacts of a magnetic grid array to substrate lands of a package substrate of an integrated circuit package of a computing system, and disengaging, via a removal lever, the magnetic contacts from the substrate lands.

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include attaching a device to a patch substrate, wherein the assembled device and patch substrate comprise a warpage, attaching the assembled device and patch substrate to an interposer to form a package structure, and then reflowing the package structure at a temperature below about 200 degrees Celsius to form a substantially flat package structure.

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include attaching a device to a patch substrate, wherein the assembled device and patch substrate comprise a warpage, attaching the assembled device and patch substrate to an interposer to form a package structure, and then reflowing the package structure at a temperature below about 200 degrees Celsius to form a substantially flat package structure.

Abstract: Methods, systems, and computer program products for generating code from a data flow associated with an extract, transform, and load (ETL) process. In one implementation, the method includes identifying a data exchange requirement between a first operator and a second operator in the data flow. The first operator is a graphical object that represents a first data transformation step in the data flow and is associated with a first type of runtime engine, and the second operator is a graphical object that represents a second data transformation step in the data flow and is associated with a second type of runtime engine. The method further includes generating code to manage data staging between the first operator and the second operator in the data flow. The code exchanges data from a format associated with the first type of runtime engine to a format associated with the second type of runtime engine.

Abstract: A processor includes a processing unit, a cache memory, and a central request queue. The central request queue is operable to receive a prefetch load request for a cache line to be loaded into the cache memory, receive a demand load request for the cache line from the processing unit, merge the prefetch load request and the demand load request to generate a promoted load request specifying the processing unit as a requestor, receive the cache line associated with the promoted load request, and forward the cache line to the processing unit.

Abstract: A cloud deployment appliance (or other platform-as-a-service (IPAS) infrastructure software) includes a mechanism to deploy a product as a “shared service” to the cloud, as well as to enable the product to establish a trust relationship between itself and the appliance or IPAS. The mechanism further enables multiple products deployed to the cloud to form trust relationships with each other (despite the fact that each deployment and each product typically, by the nature of the cloud deployment, are intended to be isolated from one another). In addition, once deployed and provisioned into the cloud, a shared service can become part of a single sign-on (SSO) domain automatically. SSO is facilitated using a token-based exchange. Once a product registers with a token service, it can participate in SSO. This approach enables enforcement of consistent access control policy across product boundaries, and without requiring a user to perform any configuration.

Abstract: An apparatus includes a plurality of contact elements to provide electrical continuity between an integrated circuit and an electronic subassembly, wherein a contact element includes a spring element and a separate lead element, wherein the spring element is arranged to be substantially vertically slidable over at least a portion of the lead element in response to a force applied to the contact element.

Abstract: A noise attenuation apparatus receives an audio signal comprising a desired and a noise signal component. Two codebooks (109, 111) comprise respectively desired signal candidates representing a possible desired signal component and noise signal contribution candidates representing possible noise contributions. A segmenter (103) segments the audio signal into time segments and for each time segment a noise attenuator (105) generates estimated signal candidates by for each of the desired signal candidates generating an estimated signal candidate as a combination of a scaled version of the desired signal candidate and a weighted combination of the noise signal contribution candidates. The noise attenuator (105) minimizes a cost function indicative of a difference between the estimated signal candidate and the audio signal in the time segment. A signal candidate is then determined for the time segment from the estimated signal candidates and the audio signal is noise compensated based on this signal candidate.

Abstract: A noise attenuation apparatus receives a first signal comprising a desired and a noise signal component. Two codebooks (109, 111) comprise respectively desired signal candidates and noise signal candidates representing possible desired and noise signal components respectively. A noise attenuator (105) generates estimated signal candidates by for each pair of desired and noise signal candidates generating an estimated signal candidate as a combination of the desired signal candidate and the noise signal candidate. A signal candidate is then determined from the estimated signal candidates and the first signal is noise compensated based on this signal candidate. A sensor signal representing a measurement of the desired source or the noise in the environment is used to reduce the number of candidates searched thereby substantially reducing complexity and computational resource usage. The noise attenuation may specifically be audio noise attenuation.

Abstract: 3D integrated circuit packages with window interposers and methods to form such semiconductor packages are described. For example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer having a window is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in the window of the interposer and interconnected to the top semiconductor die. In another example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in a same plane as the interposer and interconnected to the top semiconductor die.

Abstract: A mechanism is described for facilitating and employing a magnetic grid array according to one embodiment. A method of embodiments may include engaging, via magnetic force of a magnet, magnetic contacts of a magnetic grid array to substrate lands of a package substrate of an integrated circuit package of a computing system, and disengaging, via a removal lever, the magnetic contacts from the substrate lands.

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include attaching a device to a patch substrate, wherein the assembled device and patch substrate comprise a warpage, attaching the assembled device and patch substrate to an interposer to form a package structure, and then reflowing the package structure at a temperature below about 200 degrees Celsius to form a substantially flat package structure.

Abstract: A reciprocating piston compressor for use in a refrigerant compression circuit comprises first and second intake manifolds, first and second reciprocating piston compression units, an outlet manifold and a first pulsing valve. The intake manifolds segregate inlet flow into the compressor. The first and second reciprocating piston compression units receive flow from the first and second intake manifolds, respectively. The outlet manifold collects and distributes compressed refrigerant from the compression units. The first pulsing valve is mounted externally of the first intake manifold to regulate refrigerant flow into the first intake manifold. In another embodiment, a second valve is mounted externally of the second intake manifold to regulate flow into the second intake manifold, and the first and second valves are operated by a controller. The controller activates the first valve with variable width pulses having intervals less than an operating inertia of the refrigerant compression circuit.

Abstract: An advertiser-driven single page product search and purchase process may be simplified for consumers. When a product search is performed, a single page may be rendered to the consumer that includes the necessary information to enable a consumer to avoid multiple searches and switching frequently between other tabs and pages. The single page may also provide an option to the advertiser to monitor these interactions so that the advertiser may perform an active role in the product search and purchase process.

Abstract: Methods of forming microelectronic structures are described. Embodiments of those methods include attaching a patch structure to an interposer by thermal compression bonding, forming an underfill around an array of interconnect structures disposed on a top surface of the interposer, curing the underfill, and then attaching a die to the patch structure.

Abstract: An earphone arrangement comprises a microphone (109) which generates a microphone signal and a sound transducer (101) which radiates a first sound component to a user's ear (103) in response to a drive signal. An acoustic channel (111) is further provided for channeling external sound so as to provide a second sound component to the user's ear (103). An acoustic valve (117) allows the attenuation of the acoustic channel (111) to be controlled in response to a valve control signal. A control circuit (105) generates the valve control signal in response to the microphone signal to provide a variable attenuation resulting in a mixed sound of the first sound component and the second sound component reaching the user's ear (103). The combined use of acoustic and e.g. electric signal paths allows improved performance and in particular allows a dynamic trade-off between open and closed earphone design characteristics with respect to external sounds.