Patents by Inventor Sriranga S. Boyapati

Sriranga S. Boyapati has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PROCESS OF FORMING AN ELECTRONIC DEVICE INCLUDING DEPOSITING A CONDUCTIVE LAYER OVER A SEED LAYER
    Publication number: 20090114542
    Abstract: A process of forming an electronic device can include placing a seed layer into an electroplating solution within an electroplating tool. The electroplating tool can include a first electrode and a second electrode, wherein the first electrode is electrically connected to the seed layer. The process can also include depositing a first portion of a conductive layer using a first signal of a first type (e.g., direct current) between the first electrode and a second electrode, and depositing a second portion of the conductive layer over the first portion of the conductive layer, using a second signal of a second type (e.g., alternating current) between the first electrode and the second electrode of the electroplating tool.
    Type: Application
    Filed: November 6, 2007
    Publication date: May 7, 2009
    Applicant: SPANSION LLC
    Inventors: Sriranga S. Boyapati, Frank W. Smith, Kin-Sang Lam