Abstract: A system provided with a microelectronic device includes a substrate exposed on a face of the device, the substrate having at least one electrically conductive element, and an electrical connection member in electrical continuity with the element and including at least one rod projecting over the face of the device, wherein the connection member includes an inorganic anchoring portion covering the element and in that the rod comprises a portion buried in the anchoring portion followed by a portion projecting over the face of the device.

Abstract: The invention relates to a process for collectively bending microelectronic components comprising transferring microelectronic components (10) to and bending them on curved surfaces (21) of a shaping carrier (20), an adhesive layer (6) ensuring adhesion of the microelectronic components (10), and comprising producing conductive vias (22) that extend through the shaping carrier (20) and the adhesive lower layer (6), from the lower face (20i) of the shaping carrier (20), in order to emerge onto the lower conductive pads (12) of the microelectronic components (10).

Abstract: A system provided with a microelectronic device includes a substrate exposed on a face of the device, the substrate having at least one electrically conductive element, and an electrical connection member in electrical continuity with the element and including at least one rod projecting over the face of the device, wherein the connection member includes an inorganic anchoring portion covering the element and in that the rod comprises a portion buried in the anchoring portion followed by a portion projecting over the face of the device.

Abstract: A method of manufacturing an electronic device, including: a) forming a plurality of chips, each including a plurality of connection areas and at least one first pad; b) forming a transfer substrate including, for each chip, a plurality of connection areas and at least one second pad, one of the first and second pads being a permanent magnet and the other one of the first and second pads being either a permanent magnet or made of a ferromagnetic material; and c) affixing the chips to the transfer substrate to connect the connection areas of the chips to the connection areas of the transfer substrate, by using the magnetic force between the pads to align the connection areas of the chips with the corresponding connection areas of the transfer substrate.

Abstract: The invention relates to a process for collectively bending microelectronic components comprising transferring microelectronic components (10) to and bending them on curved surfaces (21) of a shaping carrier (20), an adhesive layer (6) ensuring adhesion of the microelectronic components (10), and comprising producing conductive vias (22) that extend through the shaping carrier (20) and the adhesive lower layer (6), from the lower face (20i) of the shaping carrier (20), in order to emerge onto the lower conductive pads (12) of the microelectronic components (10).

Abstract: A tool for the collective transfer of microchips from a source substrate to a destination substrate, said tool comprising a plate having first and second opposite faces and a plurality of microchip receiving areas on the side of the first face, the plate comprising a through opening opposite each receiving area.

Abstract: A method of manufacturing an LED display device, including the successive steps of: a) transferring, onto a planar surface of a support plate made of a transparent material having its other surface structured and defining a plurality of microlenses, a plurality of semiconductor chips, each including at least one LED; and b) forming a network of conductive interconnection tracks contacting the chips by their surface opposite to the support plate.

Abstract: A device for the transfer of chips from a source substrate onto a destination substrate, including: a source substrate having a lower surface and an upper surface; and a plurality of elementary chips arranged on the upper surface of the source substrate, wherein each elementary chip is suspended above the source substrate by at least one breakable mechanical fastener, said at least one breakable mechanical fastener having a lower surface fastened to the upper surface of the source substrate and an upper surface fastened to the lower surface of the chip.

Abstract: A method of manufacturing an electronic device, including: a) forming a plurality of chips, each including a plurality of connection areas and at least one first pad; b) forming a transfer substrate including, for each chip, a plurality of connection areas and at least one second pad, one of the first and second pads being a permanent magnet and the other one of the first and second pads being either a permanent magnet or made of a ferromagnetic material; and c) affixing the chips to the transfer substrate to connect the connection areas of the chips to the connection areas of the transfer substrate, by using the magnetic force between the pads to align the connection areas of the chips with the corresponding connection areas of the transfer substrate.

Abstract: A method of manufacturing an LED display device, including the successive steps of: a) transferring, onto a planar surface of a support plate made of a transparent material having its other surface structured and defining a plurality of microlenses, a plurality of semiconductor chips, each including at least one LED; and b) forming a network of conductive interconnection tracks contacting the chips by their surface opposite to the support plate.

Abstract: A device for the transfer of chips from a source substrate onto a destination substrate, including: a source substrate having a lower surface and an upper surface; and a plurality of elementary chips arranged on the upper surface of the source substrate, wherein each elementary chip is suspended above the source substrate by at least one breakable mechanical fastener, said at least one breakable mechanical fastener having a lower surface fastened to the upper surface of the source substrate and an upper surface fastened to the lower surface of the chip.

Abstract: A method for forming a micro-optical or sub-micro-optical device is provided, including: forming a photolithographic mask on a transparent support, depositing a layer of a photosensitive material of negative polarity on the face, a so called front face, of the support which supports the mask, wherein the mask is disposed under the areas where the photosensitive material should be removed, insolating the layer of the photosensitive material through the rear face of the support, developing the photosensitive material in order to obtain walls of micron or submicron cavities, removing the mask areas located at the bottom of the cavities in order to obtain cavities without any mask material between the walls, introducing a fluid into the cavities of the device, and forming a closure layer on the walls in photosensitive material.

Abstract: A getter structure including at least one portion of getter material at least one face of which is positioned against at least one portion of gas-permeable material such that said portion of getter material is able to achieve a gaseous absorption and/or adsorption at least by said face through at least said portion of gas-permeable material, and in which the portion of gas-permeable material includes one or more channels made at the level of a face of said portion of gas-permeable material which is in contact with the portion of getter material, where the portion of getter material is able to achieve a gaseous absorption, or a gaseous adsorption, or both a gaseous absorption and a gaseous adsorption, via the channel or channels.

Abstract: A method for producing a micromechanical and/or nanomechanical device includes partial etching of at least one sacrificial layer arranged between a first layer and a substrate, forming at least one cavity in which is arranged at least one portion of the sacrificial layer in contact with the first layer and/or the substrate. The method also includes chemical transformation of at least one wall of the first layer and/or the substrate in the cavity, delimiting at least one stop in the first layer and/or the substrate at the level of the portion of the sacrificial layer. The portion of the sacrificial layer and the chemically transformed wall of the first layer and/or the substrate is also eliminated.

Abstract: A microcavity structure including: a first substrate, a cover attached to the first substrate such that a space formed between the cover and the first substrate forms the microcavity, at least one hole passing through the cover, and at least one closing flap of the hole placed inside the microcavity and including at least two portions of materials with different thermal expansion coefficients placed one against the other, at least one first end of the two portions being mechanically linked to the cover, at least a second end of the two portions being free, and at least a part of the closing flap being placed opposite the hole, the two portions being capable of closing or not the hole under the effect of a temperature variation.

Abstract: A getter structure including at least one portion of getter material at least one face of which is positioned against at least one portion of gas-permeable material such that said portion of getter material is able to achieve a gaseous absorption and/or adsorption at least by said face through at least said portion of gas-permeable material, and in which the portion of gas-permeable material includes one or more channels made at the level of a face of said portion of gas-permeable material which is in contact with the portion of getter material, where the portion of getter material is able to achieve a gaseous absorption, or a gaseous adsorption, or both a gaseous absorption and a gaseous adsorption, via the channel or channels.

Abstract: Process for making a device comprising at least the following steps: produce a getter structure comprising at least one portion of getter material permeable to gas covered by at least one protective layer hermetic to gas; hermetic encapsulation of the getter structure in a cavity; production of at least one local opening passing through the protective layer and forming an access to the portion of getter material permeable to gas.

Abstract: A handle wafer for microelectronic functional wafers, including at least one cavity through the thickness of the wafer, this cavity including a viewing window in solid or solidified material.

Abstract: A pre-released structure device comprising: at least one first stacking, comprising at least one first layer based on at least one first material, arranged against a second stacking comprising at least one second layer based on at least one second material, at least one closed cavity, formed in the first and/or the second stacking, and arranged between a portion of the first stacking forming the pre-released structure and the second stacking, at least one spacer arranged in the cavity and linking the portion of the first stacking to the second stacking.

Abstract: The invention relates to a method for forming walls of micron or submicron cavities, including: the formation of a photolithographic mask on a transparent support (10, 12, 14), the deposition of a resin layer (18) of photosensitive material on the face, a so-called front face, of the support which supports the mask, the insolation of the photosensitive material layer through the rear face (10?) of the support, the development of the photosensitive material for obtaining said walls.