Patents by Inventor Stéphane Caplet
Stéphane Caplet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120325091Abstract: A getter structure including at least one portion of getter material at least one face of which is positioned against at least one portion of gas-permeable material such that said portion of getter material is able to achieve a gaseous absorption and/or adsorption at least by said face through at least said portion of gas-permeable material, and in which the portion of gas-permeable material includes one or more channels made at the level of a face of said portion of gas-permeable material which is in contact with the portion of getter material, where the portion of getter material is able to achieve a gaseous absorption, or a gaseous adsorption, or both a gaseous absorption and a gaseous adsorption, via the channel or channels.Type: ApplicationFiled: June 22, 2012Publication date: December 27, 2012Applicant: Commissariat A L'Energie Atomique Et Aux Ene AltInventor: Stéphane CAPLET
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Publication number: 20120328779Abstract: Process for making a device comprising at least the following steps: produce a getter structure comprising at least one portion of getter material permeable to gas covered by at least one protective layer hermetic to gas; hermetic encapsulation of the getter structure in a cavity; production of at least one local opening passing through the protective layer and forming an access to the portion of getter material permeable to gas.Type: ApplicationFiled: June 22, 2012Publication date: December 27, 2012Applicant: Commissariat A L'Energie Atomique Et Aux Ene AltInventors: Stéphane Caplet, Xavier Baillin
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Patent number: 8324695Abstract: An electronic component including at least one chip and/or one support, the chip configured to be transferred onto the support and linked, at a level of at least one connection site of the chip, formed by at least one portion of a layer of the chip, to at least one connection site of the support formed by at least one portion of a layer of the support, by at least one ball, the chip and/or the support including a mechanism for mechanical decoupling of the connection site of the chip and/or of the support with respect to the chip and/or to the support, which mechanism includes at least one cavity made in the layer of the chip and/or of the support, under the connection site of the chip and/or of the support, and at least one trench, made in the layer of the chip and/or of the support, communicating with the cavity.Type: GrantFiled: November 6, 2008Date of Patent: December 4, 2012Assignee: Commissariat a l'energie atomique et aux energies alternativesInventor: Stephane Caplet
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Patent number: 8288841Abstract: A handle wafer for microelectronic functional wafers, including at least one cavity through the thickness of the wafer, this cavity including a viewing window in solid or solidified material.Type: GrantFiled: June 30, 2010Date of Patent: October 16, 2012Assignee: Commissariat à l'Énergie Atomique et aux Énergies AlternativesInventors: Jean-Charles Souriau, Stéphane Caplet
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Patent number: 8138556Abstract: A pre-released structure device comprising: at least one first stacking, comprising at least one first layer based on at least one first material, arranged against a second stacking comprising at least one second layer based on at least one second material, at least one closed cavity, formed in the first and/or the second stacking, and arranged between a portion of the first stacking forming the pre-released structure and the second stacking, at least one spacer arranged in the cavity and linking the portion of the first stacking to the second stacking.Type: GrantFiled: December 18, 2008Date of Patent: March 20, 2012Assignee: Commissariat a l'Energie AtomiqueInventor: Stéphane Caplet
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Publication number: 20110287370Abstract: The invention relates to a method for forming walls of micron or submicron cavities, including: the formation of a photolithographic mask on a transparent support (10, 12, 14), the deposition of a resin layer (18) of photosensitive material on the face, a so-called front face, of the support which supports the mask, the insolation of the photosensitive material layer through the rear face (10?) of the support, the development of the photosensitive material for obtaining said walls.Type: ApplicationFiled: May 16, 2011Publication date: November 24, 2011Applicant: COMMISS. A L'ENERGIE ATOM.ET AUX ENER. ALTERN.Inventors: Stéphane CAPLET, Claude Venin
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Publication number: 20110030989Abstract: Microcavity structure comprising: a substrate, a cover attached to the substrate such that a space formed between the cover and the substrate forms the microcavity, at least one hole passing through the cover, and at least one closing flap for the hole placed inside the microcavity and comprising at least two portions of materials with different thermal expansion coefficients placed one against the other, one first end of said two portions being mechanically linked to the cover, a second end of said two portions being free, and at least a part of the closing flap being placed opposite the hole, said two portions being suitable for closing or not the hole under the effect of a variation of temperature.Type: ApplicationFiled: August 2, 2010Publication date: February 10, 2011Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.Inventors: Xavier BAILLIN, Stéphane Caplet, Thierry Hilt
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Publication number: 20110006400Abstract: The invention relates to a method for making a handle wafer (20?) for microelectronic functional wafers, including at least one transparent window (22, 24) for viewing through the thickness of the handle wafer, this method including: a) the making of at least one cavity (21, 23) in said handle wafer, b) the formation of at least one viewing window in said cavity on an alignment or receiving surface.Type: ApplicationFiled: June 30, 2010Publication date: January 13, 2011Applicant: Comm. á I'éner. atom. et aux énergies alter.Inventors: Jean-Charles SOURIAU, Stéphane Caplet
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Publication number: 20100244246Abstract: An electronic component including at least one chip and/or one support, the chip configured to be transferred onto the support and linked, at a level of at least one connection site of the chip, formed by at least one portion of a layer of the chip, to at least one connection site of the support formed by at least one portion of a layer of the support, by at least one ball, the chip and/or the support including a mechanism for mechanical decoupling of the connection site of the chip and/or of the support with respect to the chip and/or to the support, which mechanism includes at least one cavity made in the layer of the chip and/or of the support, under the connection site of the chip and/or of the support, and at least one trench, made in the layer of the chip and/or of the support, communicating with the cavity.Type: ApplicationFiled: November 6, 2008Publication date: September 30, 2010Applicant: COMMISS. A L'ENERGIE ATOM. ET AUX ENER. ALTERN.Inventor: Stephane Caplet
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Patent number: 7700457Abstract: The invention concerns a sealing zone between two microstructure substrates. Said sealing zone comprises at least the following parts: on a first wafer level (20), a lower edging (22A) made of an adhesive material capable of causing the first substrate (20) to adhere to a sealing material, said sealing material being adapted to spontaneously diffuse jointly with the material of the second wafer level (30); on said lower edging (22A), a layer of said sealing material; and on said layer of sealing material, a protuberance (36) formed on said second wafer level (30) containing a certain amount of sealing material. The invention is applicable to microstructures comprising vacuum-operated components.Type: GrantFiled: December 17, 2002Date of Patent: April 20, 2010Assignee: Commissariat a L'Energie AtomiqueInventors: Bernard Diem, Stephane Caplet, Marie-Thérèse Delaye
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Publication number: 20100014036Abstract: A process for formation of cavities of a micro-optic device, comprising: a) formation, on the surface plane of a support, of an alignment layer of liquid crystals; and b) formation of walls of said cavities, the base of said cavities being formed by said alignment layer.Type: ApplicationFiled: July 13, 2009Publication date: January 21, 2010Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUEInventor: Stephane CAPLET
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Publication number: 20100001361Abstract: Getter structure comprising a substrate and at least one getter material-based layer mechanically connected to the substrate by means of at least one support, in which the surface of the support in contact with the substrate is smaller than the surface of a first face of the getter material layer, in which said first face is in contact with the support, and a second face of the getter material layer, opposite said first face is at least partially exposed.Type: ApplicationFiled: June 29, 2009Publication date: January 7, 2010Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUEInventors: Stephane CAPLET, Xavier BAILLIN
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Publication number: 20100003789Abstract: A method of encapsulating a microelectronic device arranged on a substrate, comprising at least the following steps: a) formation of a portion of sacrificial material covering at least one part of the microelectronic device, the volume of which occupies a space intended to form at least one part of a cavity in which the device is intended to be encapsulated; b) deposition of a layer based on at least one getter material, covering at least one part of the portion of sacrificial material; c) formation of at least one orifice through at least the layer of getter material, forming an access to the portion of sacrificial material; d) elimination of the portion of sacrificial material via the orifice, forming the cavity in which the microelectronic device is encapsulated; and e) sealing of the cavity.Type: ApplicationFiled: June 29, 2009Publication date: January 7, 2010Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUEInventors: Stephane CAPLET, Xavier Baillin, Jean-Louis Pornin
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Publication number: 20090261431Abstract: A pre-released structure device comprising: at least one first stacking, comprising at least one first layer based on at least one first material, arranged against a second stacking comprising at least one second layer based on at least one second material, at least one closed cavity, formed in the first and/or the second stacking, and arranged between a portion of the first stacking forming the pre-released structure and the second stacking, at least one spacer arranged in the cavity and linking the portion of the first stacking to the second stacking.Type: ApplicationFiled: December 18, 2008Publication date: October 22, 2009Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUEInventor: Stephane Caplet
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Publication number: 20090170312Abstract: A method for producing a micromechanical and/or nanomechanical device comprising the steps of: partial etching of at least one sacrificial layer arranged between a first layer and a substrate, forming at least one cavity in which is arranged at least one portion of the sacrificial layer in contact with the first layer and/or the substrate, chemical transformation of at least one wall of the first layer and/or the substrate in the cavity, delimiting at least one stop in the first layer and/or the substrate at the level of the portion of the sacrificial layer, elimination of said portion of the sacrificial layer and the chemically transformed wall of the first layer and/or the substrate.Type: ApplicationFiled: December 16, 2008Publication date: July 2, 2009Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUEInventor: Stephane Caplet
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Publication number: 20080000948Abstract: The inventive method for closing a vent (9) formed in a microstructure (3) wall (10) under a controlled atmosphere is carried out by an ultrasonic bonding machine comprising a welding electrode (14), a metal wire (13) crossing the electrode (14) and a working table (15). A ball (12) is formed by melting on the end part of the metal wire (13) and is deposited on the end of the vent (9) and a holding plug (11) and is subsequently exposed to compression forces (F) and ultrasonic vibration (Fus) by the electrode (14) in a controlled atmosphere chamber (17).Type: ApplicationFiled: May 3, 2005Publication date: January 3, 2008Inventors: Henri Blanc, Stephane Caplet
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Publication number: 20070122929Abstract: The invention concerns a sealing zone between two microstructure substrates. Said sealing zone comprises at least the following parts: on a first wafer level (20), a lower edging (22A) made of an adhesive material capable of causing the first substrate (20) to adhere to a sealing material, said sealing material being adapted to spontaneously diffuse jointly with the material of the second wafer level (30); on said lower edging (22A), a layer of said sealing material; and on said layer of sealing material, a protuberance (36) formed on said second wafer level (30) containing a certain amount of sealing material. The invention is applicable to microstructures comprising vacuum-operated components.Type: ApplicationFiled: December 17, 2002Publication date: May 31, 2007Inventors: Bernard Diem, Stephane Caplet, Marie-Therese Delaye
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Patent number: 6878566Abstract: A mechanical microstructure including a deformable first layer overhanging a second layer and defining a cavity set back from an external face of the deformable first layer and having an abutment stud projecting into the cavity, in which a wire is connected to a portion of an internal face of the deformable first layer. The portion of the first layer is opposite a bottom area of the cavity into which the abutment stud projects, but the abutment stud remains at a distance from the deformable first layer. A method of producing the mechanical microstructure is also disclosed.Type: GrantFiled: December 27, 2002Date of Patent: April 12, 2005Assignee: Commissariat a l'Energie AtomiqueInventor: Stéphane Caplet
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Patent number: 6861719Abstract: A device for detecting electromagnetic radiation including at least one detection circuit including a non-cooled thermal detector and an associated reading circuit, and a method for producing the device. The device includes a substrate forming a cavity under vacuum, in which are placed the thermal detector and the reading circuit. A window transparent to radiation is placed above the cavity and ensures the sealing of the cavity. A sealing mechanism hermetically attaches the window on the substrate, and an electrical connection is inserted in the window ensuring a leaktight connection between the detection circuit and processing elements outside the cavity.Type: GrantFiled: November 6, 2001Date of Patent: March 1, 2005Assignee: Commissariat a l'Energie AtomiqueInventors: Jean-Louis Ouvrier-Buffet, Sylvette Bisotto, Stéphane Caplet
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Publication number: 20040092041Abstract: A device for detecting electromagnetic radiation including at least one detection circuit including a non-cooled thermal detector and an associated reading circuit, and a method for producing the device. The device includes a substrate forming a cavity under vacuum, in which are placed the thermal detector and the reading circuit. A window transparent to radiation is placed above the cavity and ensures the sealing of the cavity. A sealing mechanism hermetically attaches the window on the substrate, and an electrical connection is inserted in the window ensuring a leaktight connection between the detection circuit and processing elements outside the cavity.Type: ApplicationFiled: April 29, 2003Publication date: May 13, 2004Inventors: Jean-Louis Ouvrier-Buffet, Sylvette Bisotto, Stephane Caplet