Patents by Inventor Stan D. Tsai
Stan D. Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20070235344Abstract: A method for electrochemical mechanical polishing (ECMP) is disclosed. The polishing rate and surface finish of the layer on the wafer are improved by controlling the surface speed of both the platen and head, controlling the current applied to the pad, and preselecting the density of the perforations on the fully conductive polishing pad. ECMP produces much higher removal rates, good surface finishes, and good planarization efficiency at a lower down force. Generally, increasing the surface speed of both the platen and the head will increase the surface smoothness. Also, increasing the current density on the wafer will increase the surface smoothness. There is virtually no difference in the smoothness of the wafer surface between the center, middle, and edge of the wafer. For copper, removal rates of 10,000 ?/min and greater can be achieved.Type: ApplicationFiled: April 6, 2006Publication date: October 11, 2007Inventors: Renhe Jia, You Wang, Gerald Alonzo, Yongqi Hu, Zhihong Wang, Jie Diao, Stan D Tsai, Alpay Yilmaz, Lakshmanan Karuppiah, Liang-Yuh Chen
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Patent number: 7278911Abstract: Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith.Type: GrantFiled: August 30, 2005Date of Patent: October 9, 2007Assignee: Applied Materials, Inc.Inventors: Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev, Stan D. Tsai, Feng Q. Liu, Ralph Wadensweiler, Lizhong Sun, Siew S. Neo, Alain Duboust
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Patent number: 7232514Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer.Type: GrantFiled: June 6, 2003Date of Patent: June 19, 2007Assignee: Applied Materials, Inc.Inventors: Feng Q. Liu, Stan D. Tsai, Yongqi Hu, Siew S. Neo, Yan Wang, Alain Duboust, Liang-Yuh Chen
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Patent number: 7210988Abstract: Embodiments of a conditioning head for in-situ conditioning and/or cleaning a processing pad of a CMP, ECMP, or other processing system are provided. In one embodiment, the conditioning head includes a brush disposed in a central cavity. A cleaning fluid is provided through the central cavity of the conditioning head to a processing pad. The brush spins and moves laterally across the surface of the processing pad. The cleaning solution dispensed through the conditioning head dissolves by-products of the processing operation while the brush gently wipes the processing pad. A lip of the conditioning head retains the cleaning fluid and cleaning waste, thereby minimizing contamination of the area outside of the conditioning head. The cleaning waste is removed from the processing pad via passages formed near the outer periphery of the conditioning head.Type: GrantFiled: August 22, 2005Date of Patent: May 1, 2007Assignee: Applied Materials, Inc.Inventors: Yan Wang, Stan D. Tsai, Yongqi Hu, Feng Q. Liu, Liang-Yuh Chen, Daxin Mao, Huyen Karen Tran, Martin S. Wohlert, Renhe Jia, Yuan A. Tian
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Patent number: 7207878Abstract: Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.Type: GrantFiled: January 8, 2005Date of Patent: April 24, 2007Assignee: Applied Materials, Inc.Inventors: Yongqi Hu, Yan Wang, Alain Duboust, Feng Q. Liu, Antoine P. Manens, Siew S. Neo, Stan D. Tsai, Liang-Yuh Chen, Paul D. Butterfield, Yuan A. Tian, Sen-Hou Ko
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Patent number: 7160432Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique. The electrochemical mechanical polishing technique may include a polishing composition comprising an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, and a solvent.Type: GrantFiled: June 26, 2003Date of Patent: January 9, 2007Assignee: Applied Materials, Inc.Inventors: Feng Q. Liu, Liang-Yuh Chen, Stan D. Tsai, Alain Duboust, Siew S. Neo, Yongqi Hu, Yan Wang, Paul D. Butterfield
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Patent number: 7153188Abstract: The carrier head has a base and a substrate backing structure for holding a substrate against a polishing surface during polishing. The substrate backing structure is connected to the base and includes an external surface that contacts a backside of the substrate during polishing. The substrate backing structure also includes a resistive heating system to distribute heat over an area of the external surface and at least one thermally conductive membrane. The external surface is a first surface of the at least one thermally conductive membrane, and the resistive heating system is integrated within one of the at least one thermally conductive membrane.Type: GrantFiled: October 7, 2005Date of Patent: December 26, 2006Assignee: Applied Materials, Inc.Inventors: Steven M. Zuniga, Hung Chih Chen, Stan D. Tsai, Kapila Wijekoon, Fred C. Redeker, Rajeev Bajaj
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Patent number: 7137879Abstract: An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.Type: GrantFiled: March 30, 2006Date of Patent: November 21, 2006Assignee: Applied Materials, Inc.Inventors: Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel A. Carl, Ralph Wadensweiler, Manoocher Birang, Paul D. Butterfield, Rashid Mavliev, Stan D. Tsai
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Patent number: 7137868Abstract: Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.Type: GrantFiled: March 6, 2006Date of Patent: November 21, 2006Assignee: Applied Materials, Inc.Inventors: Shou-Sung Chang, Stan D. Tsai, Donald J. K. Olgado, Liang-Yuh Chen, Alain Duboust, Ralph M. Wadensweiler
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Patent number: 7128825Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 3 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer.Type: GrantFiled: February 26, 2003Date of Patent: October 31, 2006Assignee: Applied Materials, Inc.Inventors: Feng Q. Liu, Stan D. Tsai, Yongqi Hu, Siew S. Neo, Yan Wang, Alain Duboust, Liang-Yuh Chen
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Patent number: 7084064Abstract: A method and apparatus for electrochemically processing metal and barrier materials is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of establishing an electrically-conductive path through an electrolyte between an exposed layer of barrier material on the substrate and an electrode, pressing the substrate against a processing pad assembly with a force less than about 2 psi, providing motion between the substrate and pad assembly in contact therewith and electrochemically removing a portion of the exposed layer during a first electrochemical processing step in a barrier processing station.Type: GrantFiled: September 14, 2004Date of Patent: August 1, 2006Assignee: Applied Materials, Inc.Inventors: Feng Q. Liu, Liang-Yuh Chen, Stan D. Tsai, Yongqi Hu
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Patent number: 7077721Abstract: Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A first set of holes is formed through the upper layer for exposing the electrode to the processing surface. At least one aperture is formed through the upper layer and the electrode.Type: GrantFiled: December 3, 2003Date of Patent: July 18, 2006Assignee: Applied Materials, Inc.Inventors: Yongqi Hu, Stan D. Tsai, Yan Wang, Feng Q. Liu, Shou-Sung Chang, Liang-Yuh Chen
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Patent number: 7066800Abstract: An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.Type: GrantFiled: December 27, 2001Date of Patent: June 27, 2006Assignee: Applied Materials Inc.Inventors: Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel A. Carl, Ralph Wadensweiler, Manoocher Birang, Paul D. Butterfield, Rashid Mavliev, Stan D. Tsai
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Patent number: 7060606Abstract: Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. In one aspect, a method is provided for processing a substrate having a conductive material and a low dielectric constant material disposed thereon including polishing a substrate at a polishing pressures of about 2 psi or less and at platen rotational speeds of about 200 cps or greater. The polishing process may use an abrasive-containing polishing composition having up to about 1 wt. % of abrasives. The polishing process may be integrated into a multi-step polishing process.Type: GrantFiled: October 22, 2004Date of Patent: June 13, 2006Assignee: Applied Materials Inc.Inventors: Stan D. Tsai, Liang-Yuh Chen, Lizhong Sun, Shijian Li, Feng Q. Liu, Rashid Mavliev, Ratson Morad, Daniel A. Carl
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Patent number: 7029365Abstract: Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.Type: GrantFiled: December 23, 2003Date of Patent: April 18, 2006Assignee: Applied Materials Inc.Inventors: Shou-Sung Chang, Stan D Tsai, Donald J. K. Olgado, Liang-Yuh Chen, Alain Duboust, Ralph M. Wadensweiler
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Patent number: 7012025Abstract: The invention relates generally to a composition and a method for selective removal of a barrier layer in chemical mechanical polishing. In one aspect, the composition for selective removal of a barrier layer includes at least one reducing agent, ions from at least one transitional metal, and water. The composition may further include at least one buffer for pH stability, at least one pH adjusting agent for providing an initial pH, a corrosion inhibitor, abrasive particles, and/or a metal chelating agent. In another embodiment, the invention relates generally to a composition and a method for removal of a conductive material layer and a barrier layer in chemical mechanical polishing.Type: GrantFiled: January 5, 2001Date of Patent: March 14, 2006Assignee: Applied Materials Inc.Inventors: Lizhong Sun, Stan D. Tsai, Shijian Li, Feng Liu
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Patent number: 7008554Abstract: Compositions and methods for removal of barrier layer materials by a chemical mechanical polishing technique are provided. In one aspect, the invention provides a composition adapted for removing a barrier layer material in a chemical mechanical polishing technique including at least one reducing agent selected from the group of bicarboxylic acids, tricarboxylic acids, and combinations thereof, at least one reducing agent selected from the group of glucose, hydroxylamine, and combinations thereof, and deionized water, wherein the composition has a pH of about 7 or less. The composition may be used in a method for removing the barrier layer material including applying the composition to a polishing pad and polishing the substrate in the presence of the composition to remove the barrier layer.Type: GrantFiled: July 11, 2002Date of Patent: March 7, 2006Assignee: Applied Materials, Inc.Inventors: Stan D. Tsai, Shijian Li, Feng Q. Liu, Lizhong Sun, Liang-Yuh Chen
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Patent number: 6991528Abstract: Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.Type: GrantFiled: June 6, 2003Date of Patent: January 31, 2006Assignee: Applied Materials, Inc.Inventors: Yongqi Hu, Yan Wang, Alain Duboust, Feng Q. Liu, Antoine P. Manens, Siew S. Neo, Stan D. Tsai, Liang-Yuh Chen, Paul D. Butterfield, Yuan A. Tian, Sen-Hou Ko
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Patent number: 6991526Abstract: Aspects of the invention generally provide a method and apparatus for polishing a substrate using electrochemical deposition techniques. In one aspect, an apparatus for polishing a substrate comprises a counter-electrode and a pad positioned between a substrate and the counter-electrode and a pad positioned between a substrate and the counter-electrode. A dielectric insert is positioned between the counter-electrode and the substrate. The dielectric insert has a plurality of zones, each zone permitting a separate current density between the counter-electrode and the substrate. In another embodiment, an apparatus for polishing a substrate that include a conductive layer comprises a counter-electrode to the material layer. The counter-electrode comprises a plurality of electrically isolated conductive elements. An electrical connector is separately coupled to each of the conductive elements.Type: GrantFiled: September 16, 2002Date of Patent: January 31, 2006Assignee: Applied Materials, Inc.Inventors: Lizhong Sun, Liang-Yuh Chen, Siew Neo, Feng Q. Liu, Alain Duboust, Stan D. Tsai, Rashid Mavliev
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Patent number: 6988942Abstract: An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.Type: GrantFiled: July 20, 2004Date of Patent: January 24, 2006Assignee: Applied Materials Inc.Inventors: Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel A. Carl, Ralph Wadensweiler, Manoocher Birang, Paul D. Butterfield, Rashid Mavliev, Stan D. Tsai