Patents by Inventor Stanley John

Stanley John has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10061374
    Abstract: A method for dynamic frequency scaling (DFS) on the electronic systems level (ESL). The method can run in a virtual environment and dynamically scale the frequency of a virtual component based on a first transaction time and a second transaction time.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: August 28, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kai-Yuan Ting, Ashok Mehta, Sandeep Kumar Goel, Stanley John
  • Publication number: 20180164369
    Abstract: A device includes a fault generation circuit and a first fault injection circuit. The fault generation circuit is configured to generate a fault signal and a plurality of control signals according to a mode signal. The first fault injection circuit is configured to inject a first final fault signal to an under-test device based on the fault signal and the plurality of control signals, in order to verify robustness of the under-test device.
    Type: Application
    Filed: May 23, 2017
    Publication date: June 14, 2018
    Inventors: Sandeep Kumar GOEL, Stanley JOHN, Ji-Jan CHEN, Yun-Han LEE
  • Publication number: 20180152193
    Abstract: A clock distribution circuit configured to output a clock signal includes a first circuit configured to use a reference clock signal to provide first and second reference signals, wherein the second reference signal indicates whether the first reference signal is locked with the reference clock signal; a second circuit configured to use the reference clock signal to provide an output signal and an indication signal indicative whether the output signal is locked with the reference clock signal; and a monitor circuit, coupled to the first and second circuits, and configured to use at least one of the first reference signal, the second reference signal, the output signal, and the indication signal to determine whether the second circuit is functioning correctly.
    Type: Application
    Filed: September 21, 2017
    Publication date: May 31, 2018
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Sandeep Kumar GOEL, Ji-Jan CHEN, Stanley JOHN, Yun-Han LEE, Yen-Hao HUANG
  • Publication number: 20180068582
    Abstract: In one embodiment, a system for simulating emergency events includes: a signal generator operatively coupleable to one or more detectors; and a controller operably coupled to the signal generator and configured to cause the signal generator to: generate one or more synthetic signals based at least in part on data comprising one or more of: trainee identity, trainee role, synthesized data, and one or more measurements taken during a simulation; and communicate the synthetic signal(s) to the detector(s) by injecting the synthetic signals) directly into a position of a receive path of the detector(s) that is upstream of signal processing electronics of the detector(s) and downstream of a sensor of the detector(s). The synthetic signal(s) is/are waveform signals representative of at least one emergency event; and the synthetic signahs) is/are utilized to mimic conditions during emergency event(s) and under particular emergency conditions. Corresponding methods and computer program prodcuts are disclosed.
    Type: Application
    Filed: October 31, 2017
    Publication date: March 8, 2018
    Inventors: William H. Dunlop, Tawny R. Koncher, Stanley John Luke, Jerry Joseph Sweeney, Gregory K. White
  • Patent number: 9836993
    Abstract: In one embodiment, a system includes a signal generator operatively coupleable to one or more detectors; and a controller, the controller being both operably coupled to the signal generator and configured to cause the signal generator to: generate one or more signals each signal being representative of at least one emergency event; and communicate one or more of the generated signal(s) to a detector to which the signal generator is operably coupled. In another embodiment, a method includes: receiving data corresponding to one or more emergency events; generating at least one signal based on the data; and communicating the generated signal(s) to a detector.
    Type: Grant
    Filed: December 17, 2013
    Date of Patent: December 5, 2017
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: William H. Dunlop, Tawny R. Koncher, Stanley John Luke, Jerry Joseph Sweeney, Gregory K. White
  • Patent number: 9646128
    Abstract: A system comprises a processor-implemented tool configured to generate a layout of an integrated circuit (IC) die. At least one non-transitory machine readable storage medium includes a first portion encoded with a first gate-level description of first and second circuit patterns to be formed on first and second integrated circuit (IC) dies, respectively, and a second portion encoded with a second gate level description of the first and second circuit patterns received from the processor implemented tool. The second gate level description includes power and ground ports, and the first gate level description does not include power and ground ports. A processor-implemented first verification module is provided for comparing the first and second gate level descriptions and outputting a verified second gate-level description of the first and second circuit patterns.
    Type: Grant
    Filed: May 6, 2015
    Date of Patent: May 9, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ashok Mehta, Stanley John, Kai-Yuan Ting, Sandeep Kumar Goel, Chao-Yang Yeh
  • Patent number: 9633147
    Abstract: In some embodiments, in a method performed by at least one processor for estimating an overall power state coverage of an electronic system level (ESL) model comprising a plurality of blocks for a module, a first value and a second value are set for each block of said plurality of blocks. At least one verification case is selected for each block in the ESL model. For each verification case of said at least one verification case: (a) a target coverage value is set, (b) a register transfer level (RTL) simulation is performed, (c) an actual coverage value is received, and (d) the first value or the second value is updated based on whether the actual coverage value is less than the target coverage value or not. A power state coverage is calculated for said each block. The overall power state coverage is calculated for the ESL model comprising said plurality of blocks for said module.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: April 25, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Stanley John, Sandeep Kumar Goel, Tze-Chiang Huang, Yun-Han Lee
  • Publication number: 20170098023
    Abstract: In some embodiments, in a method performed by at least one processor for estimating an overall power state coverage of an electronic system level (ESL) model comprising a plurality of blocks for a module, a first value and a second value are set for each block of said plurality of blocks. At least one verification case is selected for each block in the ESL model. For each verification case of said at least one verification case: (a) a target coverage value is set, (b) a register transfer level (RTL) simulation is performed, (c) an actual coverage value is received, and (d) the first value or the second value is updated based on whether the actual coverage value is less than the target coverage value or not. A power state coverage is calculated for said each block. The overall power state coverage is calculated for the ESL model comprising said plurality of blocks for said module.
    Type: Application
    Filed: October 5, 2015
    Publication date: April 6, 2017
    Inventors: STANLEY JOHN, SANDEEP KUMAR GOEL, TZE-CHIANG HUANG, YUN-HAN LEE
  • Patent number: 9612277
    Abstract: A system and method is disclosed for functional verification of multi-die 3D ICs. The system and method include a reusable verification environment for testing each die in a stack of dies individually without having to simultaneously operate all of the dies in the stack. The system and method includes converting an input/output (“IO”) trace from a die verification test from a first format to a second format to improve performance.
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: April 4, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Stanley John, Ashok Mehta, Sandeep Kumar Goel, Kai-Yuan Ting
  • Publication number: 20150234979
    Abstract: A system comprises a processor-implemented tool configured to generate a layout of an integrated circuit (IC) die. At least one non-transitory machine readable storage medium includes a first portion encoded with a first gate-level description of first and second circuit patterns to be formed on first and second integrated circuit (IC) dies, respectively, and a second portion encoded with a second gate level description of the first and second circuit patterns received from the processor implemented tool. The second gate level description includes power and ground ports, and the first gate level description does not include power and ground ports. A processor-implemented first verification module is provided for comparing the first and second gate level descriptions and outputting a verified second gate-level description of the first and second circuit patterns.
    Type: Application
    Filed: May 6, 2015
    Publication date: August 20, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ashok MEHTA, Stanley JOHN, Kai-Yuan TING, Sandeep Kumar GOEL, Chao-Yang YEH
  • Patent number: 9047432
    Abstract: A system comprises a processor-implemented tool configured to generate a layout of an integrated circuit (IC) die. At least one non-transitory machine readable storage medium includes a first portion encoded with a first gate-level description of first and second circuit patterns to be formed on first and second integrated circuit (IC) dies, respectively, and a second portion encoded with a second gate level description of the first and second circuit patterns received from the processor implemented tool. The second gate level description includes power and ground ports, and the first gate level description does not include power and ground ports. A processor-implemented first verification module is provided for comparing the first and second gate level descriptions and outputting a verified second gate-level description of the first and second circuit patterns.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: June 2, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ashok Mehta, Stanley John, Kai-Yuan Ting, Sandeep Kumar Goel, Chao-Yang Yeh
  • Publication number: 20150123699
    Abstract: A system and method is disclosed for functional verification of multi-die 3D ICs. The system and method include a reusable verification environment for testing each die in a stack of dies individually without having to simultaneously operate all of the dies in the stack. The system and method includes converting an input/output (“IO”) trace from a die verification test from a first format to a second format to improve performance.
    Type: Application
    Filed: January 13, 2015
    Publication date: May 7, 2015
    Inventors: Stanley JOHN, Ashok MEHTA, Sandeep Kumar GOEL, Kai-Yuan TING
  • Patent number: 8972918
    Abstract: A system and method is disclosed for functional verification of multi-die 3D ICs. The system and method include a reusable verification environment for testing each die in a stack of dies individually without having to simultaneously operate all of the dies in the stack. The system and method includes converting an input/output (“IO”) trace from a die verification test from a first format to a second format to improve performance.
    Type: Grant
    Filed: January 27, 2012
    Date of Patent: March 3, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co. Ltd.
    Inventors: Stanley John, Ashok Mehta, Sandeep Kumar Goel, Kai-Yuan Ting
  • Patent number: 8578309
    Abstract: A system and method is disclosed for functional verification and/or simulation of dies in a multi-die 3D ICs. The system and method include converting an I/O trace, embodied as a Value Change Dump, to one or more Universal Verification Methodology objects. This conversion aids in identify and fixing issues contained in die.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: November 5, 2013
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ashok Mehta, Stanley John, Sandeep Kumar Goel, Kai-Yuan Ting
  • Patent number: 8545723
    Abstract: A persistent phosphor of formula I is provided, along with methods for making and using the phosphor: AxAlyO4:Euj, REk, Bm, Znn, Coo, Scp ??I wherein: A is Ba, Sr, Ca, or a combination of these metals; x is greater than about 0.75 and less than about 1.3; y is greater than or equal to about 1.6 and less than or equal to 2; j is greater than about 0.0005 and less than about 0.1; k is greater than about 0.0005 and less than about 0.1; m is greater than or equal to 0 and less than about 0.30; n is greater than 0 and less than about 0.10; o is greater than 0 and less than about 0.01; p is greater than 0 and less than about 0.05; and RE is Dy, Nd, or a combination thereof. Applications for such phosphors include use in toys, emergency equipment, clothing, and instrument panels, among others.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: October 1, 2013
    Assignee: General Electric Company
    Inventors: Holly Ann Comanzo, Alok Mani Srivastava, William Winder Beers, Sergio Martins Loureiro, Anant Achyut Setlur, Stanley John Stoklosa, Claire Susan Henderson
  • Publication number: 20130238309
    Abstract: A method for dynamic frequency scaling (DFS) on the electronic systems level (ESL). The method can run in a virtual environment and dynamically scale the frequency of a virtual component based on a first transaction time and a second transaction time.
    Type: Application
    Filed: March 7, 2012
    Publication date: September 12, 2013
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kai-Yuan TING, Ashok Mehta, Sandeep Kumar Goel, Stanley John
  • Publication number: 20130193980
    Abstract: A system and method is disclosed for functional verification of multi-die 3D ICs. The system and method include a reusable verification environment for testing each die in a stack of dies individually without having to simultaneously operate all of the dies in the stack. The system and method includes converting an input/output (“IO”) trace from a die verification test from a first format to a second format to improve performance.
    Type: Application
    Filed: January 27, 2012
    Publication date: August 1, 2013
    Applicant: Taiwan Semiconductor Manufacturing Co. Ltd.
    Inventors: Stanley JOHN, Ashok Mehta, Sandeep Kumar Goel, Kai-Yuan Ting
  • Publication number: 20130198706
    Abstract: A system and method is disclosed for functional verification and/or simulation of dies in a multi-die 3D ICs. The system and method include converting an I/O trace, embodied as a Value Change Dump, to one or more Universal Verification Methodology objects. This conversion aids in identify and fixing issues contained in die.
    Type: Application
    Filed: January 31, 2012
    Publication date: August 1, 2013
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ashok Mehta, Stanley John, Sandeep Kumar Goel, Kai-Yuan Ting
  • Patent number: 8402404
    Abstract: A system includes an automated place and route tool to generate a layout of an integrated circuit (IC) die based on a gate level circuit description. A machine readable persistent storage medium includes a first portion encoded with a first gate-level description of first and second circuit patterns to be formed on first and second IC dies, respectively, and a second portion encoded with a second gate level description of the plurality of circuit patterns received from the tool. The second gate level description includes power and ground ports, and the first gate level description does not include power and ground ports. A processor-implemented verification module is provided for comparing the first and second gate level descriptions and outputting an error report if the second gate level description has an error. The verification module outputs a verified second gate-level description of the first and second circuit patterns.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: March 19, 2013
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ashok Mehta, Stanley John, Kai-Yuan Ting, Sandeep Kumar Goel, Chao-Yang Yeh
  • Patent number: 8079027
    Abstract: Included are embodiments of a description language program stored in a computing device for updating a first version of a computer program. In at least one embodiment, the first version of the computer program is written in a universal format and the program includes logic configured to receive an updated version of the computer program. Other embodiments include logic configured to retrieve the first version of the computer program and logic configured to translate the updated version of the computer program from a proprietary format to the universal format. Still other embodiments include logic configured to utilize at least one tag to compare the translated updated version of the computer program with the first version of the computer program.
    Type: Grant
    Filed: September 8, 2006
    Date of Patent: December 13, 2011
    Assignee: Via Technologies, Inc.
    Inventors: David Fong, Stanley John, Zheng (Joy) Zhang, Qi (Christine) Chen