Abstract: In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface of the substrate. A membrane layer is formed over the local oxide regions and the top surface of the substrate. A portion of the substrate under the membrane layer is removed. The local oxide regions under the membrane layer is removed.

Abstract: A method for manufacturing a micromechanical sound transducer includes depositing successive layers of first and second membrane support material on a first main surface of a substrate arrangement with a first etching rate and a lower second etching rate, respectively. A layer of membrane material is then deposited. A cavity is created in the substrate arrangement from a side of the substrate arrangement opposite to the membrane support materials and the membrane material at least until the cavity extends to the layer of first membrane support material. The layers of first and second membrane support material are etched by applying an etching agent through the cavity in at least one first region located in an extension of the cavity also in a second region surrounding the first region. The etching creates a tapered surface on the layer of second membrane support material in the second region.

Abstract: A sound transducer structure includes a membrane, a counter electrode, and a plurality of elevations. The membrane includes a first main surface, made of a membrane material, in a sound transducing region and an edge region of the membrane. The counter electrode is made of counter electrode material, and includes a second main surface arranged in parallel to the first main surface of the membrane on a side of a free volume opposite the first main surface of the membrane. The plurality of elevations extend in the sound transducing region from the second main surface of the counter electrode into the free volume.

Abstract: For manufacturing a sound transducer structure, membrane support material is applied on a first main surface of a membrane carrier material and membrane material is applied in a sound transducing region and an edge region on a surface of the membrane support material. In addition, counter electrode support material is applied on a surface of the membrane material and recesses are formed in the sound transducing region of the membrane material. Counter electrode material is applied to the counter electrode support material and membrane carrier material and membrane support material are removed in the sound transducing region to the membrane material.

Abstract: A method for producing a membrane for a device, e.g. a microphone, includes providing a substrate is provided on which a counter electrode is disposed. A sacrificial layer is provided on a surface of the counter electrode facing away from the substrate. The surface of the sacrificial layer facing away from the counter electrode is structured to form a plurality of recesses in the surface to define one or several antistick elements and one or several corrugation grooves at the same time. Subsequently, a membrane material is deposited on the structured surface of the sacrificial layer. Then, the sacrificial layer is removed to form the membrane, which has one or several corrugation grooves and one or several antistick elements.

Abstract: In a method for producing a membrane for a device, e.g. a microphone, first, a substrate is provided, whereon a counter electrode is disposed. A sacrificial layer is provided on a surface of the counter electrode facing away from the substrate. The surface of the sacrificial layer facing away from the counter electrode is structured to form a plurality of recesses in the surface to define one or several antistick elements and one or several corrugation grooves at the same time. Subsequently, a membrane material is deposited on the structured surface of the sacrificial layer. Then, the sacrificial layer is removed to form the membrane, which has one or several corrugation grooves and one or several antistick elements.

Abstract: For manufacturing a sound transducer structure, membrane support material is applied on a first main surface of a membrane carrier material and membrane material is applied in a sound transducing region and an edge region on a surface of the membrane support material. In addition, counter electrode support material is applied on a surface of the membrane material and recesses are formed in the sound transducing region of the membrane material. Counter electrode material is applied to the counter electrode support material and membrane carrier material and membrane support material are removed in the sound transducing region to the membrane material.

Abstract: A micromechanical capacitive converter and a method for manufacturing a micromechanical converter comprise a movable membrane and an electrically conductive face element in a carrier layer. The electrically conductive face element is arranged opposite the membrane above a cavity. The electrically conductive face element and the carrier layer are perforated by perforation openings. The opening width of the perforation openings corresponds approximately to the thickness of the carrier layer.

Abstract: A micromechanical capacitive converter and a method for manufacturing a micromechanical converter comprise a movable membrane and an electrically conductive face element in a carrier layer. The electrically conductive face element is arranged opposite the membrane above a cavity. The electrically conductive face element and the carrier layer are perforated by perforation openings. The opening width of the perforation openings corresponds approximately to the thickness of the carrier layer.

Abstract: A micromechanical capacitive converter and a method for manufacturing a micromechanical converter comprise a movable membrane and an electrically conductive face element in a carrier layer. The electrically conductive face element is arranged opposite the membrane above a cavity. The electrically conductive face element and the carrier layer are perforated by perforation openings. The opening width of the perforation openings corresponds approximately to the thickness of the carrier layer.

Abstract: In a method for manufacturing a device having a moveable structure a substrate is processed in order to obtain intermediate devices on the substrate, wherein an intermediate device comprises the moveable structure and a protective structure protecting the moveable structure. The substrate is diced in order to obtain a diced intermediate device comprising the protective structure. Subsequently, the protective structure is removed from the diced intermediate device in order to obtain the device. An apparatus for manufacturing a device includes means for performing the method steps.

Abstract: In a method for producing a membrane for a device, e.g. a microphone, first, a substrate is provided, whereon a counter electrode is disposed. A sacrificial layer is provided on a surface of the counter electrode facing away from the substrate. The surface of the sacrificial layer facing away from the counter electrode is structured to form a plurality of recesses in the surface to define one or several antistick elements and one or several corrugation grooves at the same time. Subsequently, a membrane material is deposited on the structured surface of the sacrificial layer. Then, the sacrificial layer is removed to form the membrane, which has one or several corrugation grooves and one or several antistick elements.

Abstract: A micromechanical capacitive converter and a method for manufacturing a micromechanical converter comprise a movable membrane and an electrically conductive face element in a carrier layer. The electrically conductive face element is arranged opposite the membrane above a cavity. The electrically conductive face element and the carrier layer are perforated by perforation openings. The opening width of the perforation openings corresponds approximately to the thickness of the carrier layer.

Abstract: In a method for manufacturing a device having a moveable structure a substrate is processed in order to obtain intermediate devices on the substrate, wherein an intermediate device comprises the moveable structure and a protective structure protecting the moveable structure. The substrate is diced in order to obtain a diced intermediate device comprising the protective structure. Subsequently, the protective structure is removed from the diced intermediate device in order to obtain the device. An apparatus for manufacturing a device includes means for performing the method steps.