Abstract: An optoelectronic semiconductor component includes a carrier and at least one optoelectronic semiconductor chip mounted on the carrier top. The semiconductor component includes at least one bonding wire, via which the semiconductor chip is electrically contacted, and at least one covering body mounted on a main radiation side and projects beyond the bonding wire. At least one reflective potting compound encloses the semiconductor chip laterally and extends at least as far as the main radiation side of the semiconductor chip. The bonding wire is covered completely by the reflective potting compound or completely by the reflective potting compound together with the covering body.

Abstract: A method produces a plurality of optoelectronic modules, and includes: A) providing a metallic carrier assembly with a plurality of carrier units; B) applying a logic chip, each having at least one integrated circuit, to the carrier units; C) applying emitter regions that generate radiation, which can be individually electrically controlled; D) covering the emitter regions and the logic chips with a protective material; E) overmolding the emitter regions and the logic chips so that a cast body is formed, which joins the carrier units, the logic chips and the emitter regions to one another; F) removing the protective material and applying electrical conductor paths to the upper sides of the logic chips and to a cast body upper side; and G) dividing the carrier assembly into the modules.

Abstract: A method of producing a conversion element includes providing a conversion body that converts electromagnetic radiation with regard to the wavelength thereof; applying an inorganic material to at least one portion of the conversion body; and forming a reflective layer that reflects the electromagnetic radiation and/or converted electromagnetic radiation with the inorganic material such that the inorganic material of the reflective layer enters into an adhesive connection with the conversion body.

Abstract: An optoelectronic semiconductor module includes a plurality of light-emitting areas, which emit light when in operation. At least two abutting lateral edges of at least one light-emitting area are arranged at an angle of more than 0 degrees and less than 90 degrees to each other. Further embodiments relate to a display having a plurality of such modules.

Abstract: A method is set up to operate an arrangement that has N radiation-emitting semiconductor chips arranged in an electric series circuit. The arrangement includes multiple switching elements, wherein to each of the semiconductor chips one of the switching elements is connected electrically in parallel. The arrangement includes a controller for the mutually independent activation of the switching elements. The arrangement includes a constant current circuit for energizing the series circuit. When switching off, the respective semiconductor chip associated with a switching element is bridged electrically by the switching element. A protective module of the arrangement is set up to reduce or to prevent current peaks when one or more of the semiconductor chips is/are switched off.

Abstract: An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.

Abstract: An optoelectronic semiconductor component and an adaptive headlight are disclosed. In an embodiment an optoelectronic semiconductor component includes a carrier having a carrier top side and a carrier underside, a plurality of active zones, which are fitted at the carrier top side and which are designed for emitting radiation, electrical contact locations at the carrier underside, which are designed for electrically connecting the semiconductor component and a drive unit for electrically addressing the semiconductor component and for electrically driving the active zones, wherein the active zones are fitted in a regular grid at the carrier top side, wherein the grid has a grid pitch, wherein geometrical midpoints of radiation main sides of the active zones lie on grid points of the grid, and wherein a distance between the geometrical midpoints of marginal active zones and a closest edge of the carrier is at most 50% of the grid pitch.

Abstract: An optoelectronic component includes a light-emitting diode and a receiving device on which the light-emitting diode is received. The receiving device includes a securing device that has an adhesive to allow the receiving device to be adhered to a carrier which supports the receiving device. A method for processing an optoelectronic component, a method for equipping a carrier with an optoelectronic component, and a device for receiving an optoelectronic component are also disclosed.

Abstract: A light-emitting diode includes a carrier including a metallic basic body having an outer face including a mounting face; and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein the at least two light-emitting diode chips are embedded in a reflective coating covering the mounting face and side faces of the at least two light-emitting diode chips, the at least two light-emitting diode chips have radiation exit surfaces facing away from the carrier, and the at least two light-emitting diode chips protrude with radiation exit surfaces out of the reflective coating, or the reflective coating terminates flush with the radiation exit surfaces of the at least two light-emitting diode chips.

Abstract: A lighting arrangement includes a light source, a taper, and a two-dimensional image generator, wherein the taper guides light from the light source to the two-dimensional image generator, and the lighting arrangement is configured as a motor vehicle headlamp.

Abstract: A method of producing a conversion element includes providing a conversion body that converts electromagnetic radiation with regard to the wavelength thereof; applying an inorganic material to at least one portion of the conversion body; and forming a reflective layer that reflects the electromagnetic radiation and/or converted electromagnetic radiation with the inorganic material such that the inorganic material of the reflective layer enters into an adhesive connection with the conversion body.

Abstract: An optoelectronic component includes a carrier substrate, a single optoelectronic semiconductor chip arranged on the carrier substrate, an emission surface that emits light radiation which is part of a front side of the optoelectronic component, and a reflective layer adjacent to the emission surface at the front side of the optoelectronic component, wherein the emission surface is arranged such that the emission surface forms a part of an edge of the front side of the optoelectronic component.

Abstract: A method is set up to operate an arrangement that has N radiation-emitting semiconductor chips arranged in an electric series circuit. The arrangement includes multiple switching elements, wherein to each of the semiconductor chips one of the switching elements is connected electrically in parallel. The arrangement includes a controller for the mutually independent activation of the switching elements. The arrangement includes a constant current circuit for energizing the series circuit. When switching off, the respective semiconductor chip associated with a switching element is bridged electrically by the switching element. A protective module of the arrangement is set up to reduce or to prevent current peaks when one or more of the semiconductor chips is/are switched off.

Abstract: A headlight device is disclosed. In an embodiment a headlight device includes a laser light source configured to emit collimated primary radiation, a conversion element comprising conversion regions configured to at least partly convert the collimated primary radiation into secondary radiation and to form luminous regions during operation, and separating webs which separate the conversion regions from one another, wherein the separating webs are nontransmissive to the collimated primary radiation and secondary radiation and a deflection unit configured to direct the collimated primary radiation onto the conversion element and to guide the collimated primary radiation as a scanning beam over partial regions of the conversion element.

Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.

Abstract: A method of producing a component carrier for an electronic component includes a lead frame section including an electrically conductive material, the lead frame section having a first contact section that forms a first electrical contact element, a second contact section that forms a second electrical contact element, and a reception region that receives the electronic component, at least the reception region and the second contact section being electrically conductively connected to one another, a thermally conductive and electrically insulating intermediate element that dissipates heat from the reception region and electrically insulates the reception region formed at least on an opposite side of the lead frame section from the reception region, and a thermal contact that thermally contacts the electronic component formed at least on a side of the intermediate element facing away from the reception region.

Abstract: An electronic device includes a base body, which has a top side and also an underside lying opposite the top side. The base body has connection locations at its underside. An electronic component is arranged at the base body at the top side of the base body. The base body has at least one side area having at least one point of inspection having a first region and second region. The second region is embodied as an indentation in the first region. The first and the second region contain different materials.

Abstract: A radiation-emitting component includes a semiconductor layer stack having an active region that emits electromagnetic radiation, and at least one surface of the semiconductor layer stack or of an optical element that transmits the electromagnetic radiation wherein the surface has a normal vector, wherein on the at least one surface of the semiconductor layer stack or of the optical element through which the electromagnetic radiation passes, an antireflection layer is arranged such that, for a predetermined wavelength, it has a minimum reflection at a viewing angle relative to the normal vector of the surface at which an increase in a zonal luminous flux of the electromagnetic radiation has approximately a maximum.

Abstract: A light-emitting diode includes a carrier including a metallic basic body having an outer face including a mounting face; and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein the at least two light-emitting diode chips are embedded in a reflective coating covering the mounting face and side faces of the at least two light-emitting diode chips, the at least two light-emitting diode chips have radiation exit surfaces facing away from the carrier, and the at least two light-emitting diode chips protrude with radiation exit surfaces out of the reflective coating, or the reflective coating terminates flush with the radiation exit surfaces of the at least two light-emitting diode chips.

Abstract: A light-emitting diode includes a carrier with a mounting face and includes a metallic basic body and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein an outer face of the metallic basic body includes the mounting face, the at least two light-emitting diode chips connect in parallel with one another, the at least two light-emitting diode chips are embedded in a reflective coating, the reflective coating covering the mounting face and side faces of the light-emitting diode chips, and the light-emitting diode chips protrude with their radiation exit surfaces out of the reflective coating, and the radiation exit surfaces face away from the carrier.