Patents by Inventor Stefan Meister

Stefan Meister has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11159131
    Abstract: An optoelectronic device that includes at least one adjustable optical damping member arranged upstream of a photodetector and damps the optical radiation passing to the photodetector. The device is configured so that an electrical output of an amplifier is connected directly or indirectly to the adjustable optical damping member. An output signal of the amplifier or a control signal formed therewith drives the optical damping member, and the photodetector, the amplifier and the damping member are integrated in the same semiconductor substrate.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: October 26, 2021
    Assignee: SICOYA GMBH
    Inventors: Ulrich Keil, Stefan Meister, Marco Vitali, Lei Yan, Chenhui Jiang, Aws Al-Saadi, Hanjo Rhee
  • Patent number: 10948666
    Abstract: The invention relates to a photonic component (10) having a photonically integrated chip (1) and a fibre mounting (5), wherein the fibre mounting (5) has: at least one groove (52), into which an optical fibre (30) is placed, and at least one mirror surface (52), which reflects radiation (S) from the fibre (30) in the direction of the photonically integrated chip (1). According to the invention a chip stack (20) comprising at least two chips is arranged between the photonically integrated chip (1) and the fibre mounting (5), the chip stack (20) has at least two through holes (21) and in each case a guide pin (40), which positions the chip stack (20) and the fibre mounting (5) relative to one another, passes through the at least two through holes (21) of the chip stack (20).
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: March 16, 2021
    Assignee: SICOYA GMBH
    Inventors: Stefan Meister, Moritz Grehn, Sven Otte, Sebastian Höll
  • Patent number: 10775561
    Abstract: An optoelectronic component includes a chip having a substrate and at least one optical waveguide integrated in the chip. The electro-optical component may be monolithically integrated in one or a plurality of semiconductor layers of the chip arranged on the substrate top side of the substrate, or on the substrate top side of the substrate. At least one electrical connection of the monolithically integrated electro-optical component is connected by means of a connection line to a conductor track connection situated below the substrate rear side. The connection line extends through a hole in the substrate from the electro-optical component to the conductor track connection situated below the substrate rear side.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: September 15, 2020
    Assignee: TECHNISCHE UNIVERSITÄT BERLIN
    Inventors: Stefan Meister, Hanjo Rhee, Christoph Theiss, Sebastian Kupijai
  • Patent number: 10707186
    Abstract: Techniques and mechanisms for forming a bond between wafers using a compliant layer. In an embodiment, a layer or layers of one or more compliant materials is provided on a first surface of a first wafer, and the one or more compliant layers are subsequently bonded to a second surface of a second wafer. The bonded wafers are heated to an elevated temperature at which a compliant layer exhibits non-elastic deformations to facilitate relaxation of stresses caused by wafer distortions. In another embodiment, a material of the compliant layer exhibits viscoelastic behavior at room temperature, wherein stress is mitigated by allowing wafer distortion to relax at room temperature.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Mauro J. Kobrinsky, Jasmeet S. Chawla, Stefan Meister, Myra McDonnell, Chytra Pawashe, Daniel Pantuso
  • Publication number: 20200212853
    Abstract: The invention relates to a component (10) with a photodetector (PD) and an electrical amplifier (TIA) connected to the photodetector (PD), wherein the photodetector (PD) and the amplifier (TIA) are integrated in the same semiconductor substrate (11). According to the invention, at least one adjustable optical damping member (30) is arranged in front of the photodetector (PD), which damping member damps or at least can damp optical radiation arriving at the photodetector (PD), an electrical output (A) of the amplifier (TIA) is connected directly or indirectly to the adjustable optical damping member (30) and an output signal (AS) of the amplifier (TIA) or a control signal (ST) formed therewith controls the optical damping member (30), and the photodetector (PD), the amplifier (TIA) and the damping member (30) are integrated in the same semiconductor substrate (11).
    Type: Application
    Filed: June 13, 2018
    Publication date: July 2, 2020
    Applicant: Sicoya GmbH
    Inventors: Ulrich KEIL, Stefan MEISTER, Marco VITALI, Lei YAN, Chenhui JIANG, Aws AL-SAADI, Hanjo RHEE
  • Publication number: 20200096713
    Abstract: The invention relates to a photonic component (10) having a photonically integrated chip (1) and a fibre mounting (5), wherein the fibre mounting (5) has: at least one groove (52), into which an optical fibre (30) is placed, and at least one mirror surface (52), which reflects radiation (S) from the fibre (30) in the direction of the photonically integrated chip (1). According to the invention a chip stack (20) comprising at least two chips is arranged between the photonically integrated chip (1) and the fibre mounting (5), the chip stack (20) has at least two through holes (21) and in each case a guide pin (40), which positions the chip stack (20) and the fibre mounting (5) relative to one another, passes through the at least two through holes (21) of the chip stack (20).
    Type: Application
    Filed: May 2, 2018
    Publication date: March 26, 2020
    Applicant: Sicoya GmbH
    Inventors: Stefan MEISTER, Moritz GREHN, Sven OTTE, Sebastian HÖLL
  • Patent number: 10598859
    Abstract: An optoelectronic component including an optical waveguide integrated into a plane of the component. The optical waveguide configured to guide optical radiation in the plane. The component including a coupling element connected to the waveguide and coupling optical radiation into the waveguide along the main coupling path. The degree of coupling efficiency of the coupling element is less than one in respect to the main coupling path. The coupling element outputs optical loss radiation along a secondary coupling path. The optical loss radiation is proportional to the radiation transferred along the main coupling path. The optoelectronic component includes a detector connected to the coupling element that registers the optical loss radiation and produces a detector signal. The optoelectronic component includes a control unit configured to influence at least one operating variable of the optoelectronic component based on the detector signal.
    Type: Grant
    Filed: May 3, 2016
    Date of Patent: March 24, 2020
    Assignee: TECHNISCHE UNIVERSITÄT BERLIN
    Inventors: Stefan Meister, Hanjo Rhee, Christoph Theiss, Aws Al-Saadi
  • Patent number: 10514584
    Abstract: An embodiment of the invention relates to an optical signal generator comprising an optical emitter configured to generate a beam of optical radiation, a first and second beam deflecting element, a modulator being located between the beam deflecting elements, a phase shifter located between the beam deflecting elements, a control unit configured to control the phase-shift of the phase shifter, wherein the first and second beam deflecting elements, the phase shifter and the modulator are located in the same plane, wherein the beam generated by the optical emitter is angled relative to said plane, wherein said first beam deflecting element is configured to deflect the emitter's beam into the plane towards the modulator, said modulator being configured to modulate the emitter's radiation and outputting a modulated radiation, wherein said second beam deflecting element is configured to deflect the modulated radiation off the plane towards an output port of the signal generator, wherein the modulator is configured
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: December 24, 2019
    Assignee: Sicoya GmbH
    Inventors: Thorsten Kettler, Stefan Meister, Sven Otte
  • Patent number: 10488595
    Abstract: A photonic component that includes a photonically integrated chip and a fiber holder that is mechanically connected to said chip. The fiber holder includes at least one groove with an optical fiber laid therein. The chip includes a substrate whose substrate base material is a semiconductor material, an integrated optical waveguide that is integrated into one or more material layers of the chip, which layers are wave guiding and positioned on the substrate, a coupler formed in the optical waveguide or connected to said optical waveguide, particularly a grating coupler, and an optical diffraction and refraction structure that is integrated into one or more material layers of the chip which are positioned above the optical coupler when viewed from the substrate, and that shapes the beam prior to its being coupled into the waveguide or after being coupled out of the waveguide.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: November 26, 2019
    Assignee: Sicoya GmbH
    Inventors: Moritz Grehn, Sven Otte, Christoph Theiss, Stefan Meister, David Selicke, Hanjo Rhee
  • Patent number: 10481355
    Abstract: An embodiment of the invention relates to an optical assembly comprising an optical emitter configured to generate a beam of optical radiation, a cap unit holding the optical emitter, a photonic chip comprising a coupler, and an intermediate chip arranged between the cap unit and the photonic chip, wherein the cap unit comprises a recess having a bottom section and a sidewall, wherein the optical emitter is mounted on the bottom section of the recess, wherein a section of the sidewall forms a mirror section angled with respect to the bottom section and configured to reflect said beam of optical radiation towards the coupler, and wherein the intermediate chip comprises a lens formed at a lens section of the intermediate chip's surface that faces the cap unit, said lens being configured to focus the reflected optical beam towards the coupler.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: November 19, 2019
    Assignee: Sicoya GmbH
    Inventors: Thorsten Kettler, Moritz Grehn, Christoph Theiss, Stefan Meister
  • Publication number: 20190324222
    Abstract: An embodiment of the invention relates to an optical assembly comprising an optical emitter configured to generate a beam of optical radiation, a cap unit holding the optical emitter, a photonic chip comprising a coupler, and an intermediate chip arranged between the cap unit and the photonic chip, wherein the cap unit comprises a recess having a bottom section and a sidewall, wherein the optical emitter is mounted on the bottom section of the recess, wherein a section of the sidewall forms a mirror section angled with respect to the bottom section and configured to reflect said beam of optical radiation towards the coupler, and wherein the intermediate chip comprises a lens formed at a lens section of the intermediate chip's surface that faces the cap unit, said lens being configured to focus the reflected optical beam towards the coupler.
    Type: Application
    Filed: April 20, 2018
    Publication date: October 24, 2019
    Applicant: Sicoya GmbH
    Inventors: Thorsten KETTLER, Moritz GREHN, Christoph THEISS, Stefan MEISTER
  • Publication number: 20190207368
    Abstract: The invention relates to a photonic component (1) having at least one semiconductor laser amplifier (200), which has at least one first mirror surface (210a) for coupling and/or decoupling optical radiation (S). The first mirror surface (210a) of the semiconductor laser amplifier (200) is coupled to a photonically integrated chip (100), wherein the chip (100) is arranged such that the chip can emit optical radiation (S) from the chip top side (O100) thereof in the direction of the first mirror surface (210a) and couple said radiation in the semiconductor laser amplifier (200), and wherein the emitting of the radiation (S) away from the chip top side (O100) occurs in the direction of the first mirror surface (210a) at an angle of 90°±20°, in particular perpendicular, to the chip top side (O100).
    Type: Application
    Filed: September 1, 2017
    Publication date: July 4, 2019
    Applicant: Sicoya GmbH
    Inventors: Stefan MEISTER, Hanjo RHEE
  • Publication number: 20190179082
    Abstract: The invention relates, inter alia, to a photonic component (1) that comprises a phonetically integrated chip (100) and a fibre holder (200) that is mechanically connected to said chip, said fibre holder comprising: at least one groove (210) with an optical fibre (220) laid therein, and at least one mirroring surface (230) which reflects the beam (S) of the fibre in the direction of the chip, and/or the beam of the chip in the direction of the fibre.
    Type: Application
    Filed: July 28, 2017
    Publication date: June 13, 2019
    Applicant: Sicoya GmbH
    Inventors: Moritz GREHN, Sven OTTE, Christoph THEISS, Stefan MEISTER, David SELICKE, Hanjo RHEE
  • Publication number: 20190146151
    Abstract: The invention relates to an optoelectronic component (100) comprising a chip (110) comprising a substrate (12) and at least one optical waveguide (20) integrated in the chip (110). In one variant of the invention it is provided that an electro-optical component (30) is monolithically integrated in one or a plurality of semiconductor layers of the chip (110) arranged on the substrate top side (12a) of the substrate (12), or on the substrate top side (12a) of the substrate (12) and at least one electrical connection of the monolithically integrated electro-optical component (30) is connected by means of a connection line (41) to a conductor track connection (43) situated below the substrate rear side (12b), wherein the connection line (41) extends through a through hole (42) in the substrate (12) from the electro-optical component (30) to the conductor track connection (43) situated below the substrate rear side (12b).
    Type: Application
    Filed: September 28, 2015
    Publication date: May 16, 2019
    Applicant: TECHNISCHE UNIVERSITÄT BERLIN
    Inventors: Stefan MEISTER, Hanjo RHEE, Christoph THEISS, Sebastian KUPIJAI
  • Publication number: 20190049816
    Abstract: An embodiment of the invention relates to an optical signal generator comprising an optical emitter configured to generate a beam of optical radiation, a first and second beam deflecting element, a modulator being located between the beam deflecting elements, a phase shifter located between the beam deflecting elements, a control unit configured to control the phase-shift of the phase shifter, wherein the first and second beam deflecting elements, the phase shifter and the modulator are located in the same plane, wherein the beam generated by the optical emitter is angled relative to said plane, wherein said first beam deflecting element is configured to deflect the emitter's beam into the plane towards the modulator, said modulator being configured to modulate the emitter's radiation and outputting a modulated radiation, wherein said second beam deflecting element is configured to deflect the modulated radiation off the plane towards an output port of the signal generator, wherein the modulator is configured
    Type: Application
    Filed: August 10, 2017
    Publication date: February 14, 2019
    Applicant: SICOYA GMBH
    Inventors: Thorsten Kettler, Stefan Meister, Sven Otte
  • Patent number: 10025030
    Abstract: An optoelectronic component including an optical waveguide, an integrated optical resonator, in which the waveguide or at least a portion of the waveguide is arranged, and a heat source which can increase the temperature of the resonator during operation. A web region adjoins laterally the waveguide when viewed in the longitudinal direction of the waveguide. The web region forms a jacket portion of the waveguide and has a smaller thickness than the waveguide. The heat source is thermally connected to the waveguide by means of the web region.
    Type: Grant
    Filed: April 12, 2016
    Date of Patent: July 17, 2018
    Assignee: Technische Universitaet Berlin
    Inventors: Stefan Meister, Hanjo Rhee, Christoph Theiss, Aws Al-Saadi, Marvin Henniges, Muhammad Atif
  • Publication number: 20180143378
    Abstract: An optoelectronic component including an optical waveguide integrated into a plane of the component. The optical waveguide configured to guide optical radiation in the plane. The component including a coupling element connected to the waveguide and coupling optical radiation into the waveguide along the main coupling path. The degree of coupling efficiency of the coupling element is less than one in respect to the main coupling path. The coupling element outputs optical loss radiation along a secondary coupling path. The optical loss radiation is proportional to the radiation transferred along the main coupling path. The optoelectronic component includes a detector connected to the coupling element that registers the optical loss radiation and produces a detector signal. The optoelectronic component includes a control unit configured to influence at least one operating variable of the optoelectronic component based on the detector signal.
    Type: Application
    Filed: May 3, 2016
    Publication date: May 24, 2018
    Applicant: Technische Universität Berlin
    Inventors: Stefan MEISTER, Hanjo RHEE, Christoph THEISS, Aws AL-SAADI
  • Publication number: 20180100966
    Abstract: An optoelectronic component including an optical waveguide, an integrated optical resonator, in which the waveguide or at least a portion of the waveguide is arranged, and a heat source which can increase the temperature of the resonator during operation. A web region adjoins laterally the waveguide when viewed in the longitudinal direction of the waveguide. The web region forms a jacket portion of the waveguide and has a smaller thickness than the waveguide. The heat source is thermally connected to the waveguide by means of the web region.
    Type: Application
    Filed: April 12, 2016
    Publication date: April 12, 2018
    Applicant: Technische Universität Berlin
    Inventors: Stefan MEISTER, Hajo RHEE, Christoph THEISS, Aws AL-SAADE, Marvin HENNIGES, Muhammad ATIF
  • Patent number: 9817295
    Abstract: An injection modulator for modulation of optical radiation, having an optical waveguide and a diode structure, having at least two p-doped semiconductor portions, at least two n-doped semiconductor portions and at least one lightly or undoped intermediate portion between the p-doped and n-doped portions. The p-doped portions when viewed in the longitudinal direction of the waveguide are offset with respect to the n-doped portions and the diode structure is arranged in a resonance-free portion of the waveguide. The p-doped portions lie on one side of the waveguide, the n-doped portions lie on the other side of the waveguide and the intermediate portion lies in the center, each portion extends transversely with respect to the waveguide longitudinal direction in the direction of the waveguide center of the waveguide and no p-doped portion when viewed in the longitudinal direction of the waveguide overlaps any n-doped portion.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: November 14, 2017
    Assignees: TECHNISCHE UNIVERSITAT BERLIN, SICOYA GMBH
    Inventors: Stefan Meister, Aws Al-Saadi, Sebastian Kupijai, Christoph Theiss, Hanjo Rhee, Lars Zimmermann, David Stolarek
  • Publication number: 20170299939
    Abstract: An injection modulator for modulation of optical radiation, having an optical waveguide and a diode structure, having at least two p-doped semiconductor portions, at least two n-doped semiconductor portions and at least one lightly or undoped intermediate portion between the p-doped and n-doped portions. The p-doped portions when viewed in the longitudinal direction of the waveguide are offset with respect to the n-doped portions and the diode structure is arranged in a resonance-free portion of the waveguide. The p-doped portions lie on one side of the waveguide, the n-doped portions lie on the other side of the waveguide and the intermediate portion lies in the center, each portion extends transversely with respect to the waveguide longitudinal direction in the direction of the waveguide center of the waveguide and no p-doped portion when viewed in the longitudinal direction of the waveguide overlaps any n-doped portion.
    Type: Application
    Filed: September 21, 2015
    Publication date: October 19, 2017
    Applicants: TECHNISCHE UNIVERSITAET BERLIN, SICOYA GMBH
    Inventors: Stefan MEISTER, Aws AL-SAADI, Sebastian KUPIJAI, Christoph THEISS, Hanjo RHEE, Lars ZIMMERMANN, David STOLAREK