Abstract: A power semiconductor package includes a substrate having a plurality of metal leads, a power semiconductor die attached to a first one of the leads and a magnetic field sensor integrated in the same power semiconductor package as the power semiconductor die and positioned in close proximity to a current pathway of the power semiconductor die. The magnetic field sensor is operable to generate a signal in response to a magnetic field produced by current flowing in the current pathway, the magnitude of the signal being proportional to the amount of current flowing in the current pathway.

Abstract: A semiconductor package includes a semiconductor die attached to a substrate and a magnetic field sensor included as part of the same semiconductor package as the semiconductor die and positioned in close proximity to a current pathway of the semiconductor die so that the magnetic field sensor can sense a magnetic field produced by current flowing in the current pathway. The magnetic field sensor includes a first magnetic field sensing component galvanically isolated from the current pathway and positioned so that a magnetic field produced by current flowing in the current pathway impinges on the first magnetic field sensing component in a first direction. The magnetic field sensor also includes a second magnetic field sensing component galvanically isolated from the current pathway and positioned so that the magnetic field impinges on the second magnetic field sensing component in a second direction different than the first direction.

Abstract: An interconnect module includes a metal clip having a first end section, a second end section and a middle section extending between the first and the second end sections. The first end section is configured for external attachment to a bare semiconductor die or packaged semiconductor die attached to a carrier or to a metal region of the carrier. The second end section is configured for external attachment to a different metal region of the carrier or to a different semiconductor die or packaged semiconductor die attached to the carrier. The module further includes a magnetic field sensor secured to the metal clip. The magnetic field sensor is operable to sense a magnetic field produced by current flowing through the metal clip. The interconnect module can be used to form a direct electrical connection between components and/or metal regions of a carrier to which the module is attached.

Abstract: Described are RFID structures and methods for forming RFID structures. An RFID structure includes an antenna substrate and a loop antenna assembly positioned on the antenna substrate. The loop antenna assembly includes at least two contact pads and a plurality of antenna loop windings having an average spacing between adjacent antenna loop windings of the plurality of loop windings. The plurality of antenna loop windings define one or more gap regions that separate adjacent or adjoining antenna segments of the plurality of antenna loop windings by at least twice the average spacing.

Abstract: Described are antenna assemblies and methods for forming antenna assemblies. An antenna assembly includes a dual polarized far-field antenna and a near-field loop antenna. The near-field loop antenna is electromagnetically coupled to the dual polarized far-field antenna. The near-field loop antenna includes two contacts for electrically connecting to a chip.

Abstract: Described are RFID structures. An RFID structure includes a planar gasket layer with a tensile modulus value less than 5 Gpa. The gasket layer defines a perimeter including one or more guide indentations. The RFID structure also includes a loop antenna assembly positioned within the gasket layer. The loop antenna includes an antenna track, and at least two contact pads. The loop antenna assembly surrounds an area that can be more than at least 10% of a total area defined by an outer perimeter of the gasket layer. The RFID structure also includes an integrated circuit unit coupled to the at least two contact pads.

Abstract: Described are RFID structures and methods for forming RFID structures. An RFID structure includes a loop antenna assembly, an antenna substrate supporting the loop antenna assembly, and a shielding layer parallel with a plane defined by the antenna substrate. The loop antenna assembly has a stand-alone resonant frequency of f1 above or below a standardized reader frequency range. The loop antenna includes an antenna track and at least two contact pads. The loop antenna assembly in combination with the shielding layer has a resonant frequency of f2 below the standardized reader frequency range. If positioned against a metallic surface, the loop antenna assembly in combination with the shielding layer has a resonant frequency within the standardized reader frequency range.

Abstract: The invention relates to a multilayered film element (1) comprising a first component, more particularly an RFID antenna in the form of a multilayered film element, and to a method for fixing a second component on a film element (1) of this type. The film element (1) has a dielectric layer (10) having a front side (10V) and a rear side (10R). The film element (1) has a layer (11, 12) forming a first component, and at least one component contact area (23, 24) arranged on the front side (10V) and connected to the first component. The film element (1) has at least one thermode contact layer (30) which is arranged on the dielectric layer (10) and which, as seen perpendicularly to the dielectric layer (10), is arranged in the region of the at least one component contact area (23, 24). The thermode contact layer (30) has a thermode contact area (32) on a side facing away from the dielectric layer (10), said thermode contact area forming an outer surface of the film element (1).

Abstract: Described are RFID structures. An RFID structure includes a planar gasket layer with a tensile modulus value less than 5 Gpa. The gasket layer defines a perimeter including one or more guide indentations. The RFID structure also includes a loop antenna assembly positioned within the gasket layer. The loop antenna includes an antenna track, and at least two contact pads. The loop antenna assembly surrounds an area that can be more than at least 10% of a total area defined by an outer perimeter of the gasket layer. The RFID structure also includes an integrated circuit unit coupled to the at least two contact pads.

Abstract: An apparatus for screening the magnetic field of a transponder is described, which apparatus comprises, in a first area section, at least one flat antenna structure which comprises conductor tracks for conducting current in a direction of current flow and has an application-specific extent, wherein the apparatus comprises a second area section or carrier to which strips of a highly permeable screening material are applied such that they are oriented with respect to one another in a predetermined manner, wherein the second area section is arranged parallel to the first area section.

Abstract: Described are RFID structures and methods for forming RFID structures. An RFID structure includes an antenna substrate and a loop antenna assembly positioned on the antenna substrate. The loop antenna assembly includes at least two contact pads and a plurality of antenna loop windings having an average spacing between adjacent antenna loop windings of the plurality of loop windings. The plurality of antenna loop windings define one or more gap regions that separate adjacent or adjoining antenna segments of the plurality of antenna loop windings by at least twice the average spacing.

Abstract: Described are RFID structures and methods for forming RFID structures. An RFID structure includes a loop antenna assembly, an antenna substrate supporting the loop antenna assembly, and a shielding layer parallel with a plane defined by the antenna substrate. The loop antenna assembly has a stand-alone resonant frequency of ƒ1 above or below a standardized reader frequency range. The loop antenna includes an antenna track and at least two contact pads. The loop antenna assembly in combination with the shielding layer has a resonant frequency of ƒ2 below the standardized reader frequency range. If positioned against a metallic surface, the loop antenna assembly in combination with the shielding layer has a resonant frequency within the standardized reader frequency range.

Abstract: Described are antenna assemblies and methods for forming antenna assemblies. An antenna assembly includes a dual polarized far-field antenna and a near-field loop antenna. The near-field loop antenna is electromagnetically coupled to the dual polarized far-field antenna. The near-field loop antenna includes two contacts for electrically connecting to a chip.

Abstract: An apparatus for screening the magnetic field of a transponder is described, which apparatus comprises, in a first area section, at least one flat antenna structure which comprises conductor tracks for conducting current in a direction of current flow and has an application-specific extent, wherein the apparatus comprises a second area section or carrier to which strips of a highly permeable screening material are applied such that they are oriented with respect to one another in a predetermined manner, wherein the second area section is arranged parallel to the first area section.