Abstract: The present invention concerns a power module comprising at least one power die, the at least one power die is embedded in a multilayer structure, the multilayer structure is an assembly of at least two sub-modules, each sub-module being formed of isolation and conductor layers and the power module further comprises at least one capacitor embedded in the multilayer structure for decoupling an electric power supply to the at least one power die embedded in the multilayer structure and at least one driving circuit of the at least one power die that is disposed on a surface of the multilayer structure or embedded completely or partially in the multilayer structure.

Abstract: The present invention concerns a power module composed of a first and second parts (100a, 100b), the first part being composed of conductor layers and insulation layers, characterized in that a first conductor layer is on bottom of the first part, the second part is composed of at least one second conductor layer, the first and/or the second conductor layers comprise cavities that form pipes (300a, 300b) when the first and second conductor layers are in contact, and in that the first and the second conductor layers are bonded together by a metal plating (400a, 400g) of the walls of the pipes.

Abstract: The present invention concerns a system for allowing the restoration of a first interconnection of a die of a power module connecting the die to an electric circuit. The system comprises: at least one other interconnection of the power module, a periodic current source that is connected to the at least one other interconnection for generating a periodic current flow through the at least one other interconnection in order to reach, in at least a part of the first interconnection, a predetermined temperature during a predetermined time duration. The present invention concerns also the associated method.

Abstract: The present invention concerns a device and a method for controlling the switching from a conducting state to a non conducting state or from a non conducting state to a conducting state of a semiconductor power switch providing current to a load, the device receiving an input signal that is intended to drive the semiconductor power switch. The invention: —senses the derivative of the drain to source current going through the semiconductor power switch in order to obtain a voltage representative of the sensed derivative of drain to source current, —amplifies the voltage representative of the sensed derivative of drain to source current, —adds the amplified voltage representative of the derivative of the sensed drain to source current to the input signal during a given time period.

Abstract: The present invention concerns a device for controlling the switching of a first and a second power semiconductor switches providing current to a load in a half bridge configuration. The device comprises: means for obtaining a first current value through the first switch or the load just before the switching of the first switch from conducting to non-conducting state, means for limiting the current through the second switch during the switching of the second switch from non-conducting to conducting state using the obtained first current value, by modifying the gate signal of the second switch, means for obtaining a second current value through the second switch or the load just before the switching of the second switch from conducting to non-conducting state, means for limiting the current through the first switch during the switching of the first switch from non-conducting to conducting state using the obtained second current value by modifying the gate signal of the first switch.

Abstract: A device comprising at least one power semiconductor die coated with a metallization and at least one light guide having two opposite ends. The first end is able to be connected at least to a light source and to a light receiver. The second end is permanently fixed facing to a surface of the metallization such that to form a light path towards said surface and a light path from said surface.

Abstract: The invention relates to an electrical power assembly (1), comprising: a power die (10), having at least two electrical contacts (11), an electrically insulating core (20), wherein the power die is embedded in the electrically insulating core, and two layers (30) of electrically conductive material on opposite main surfaces of the electrically insulating core, characterized in that the electrical power assembly comprises at least one open cavity (40) extending from an electrical contact (11) of the power die, through the electrically insulating core and the layer (30) of electrically conductive material located on the same side of the power die than the electrical contact, such that the open cavity has a bottom (41) formed by an area of the electrical contact of the power die.

Abstract: The present invention concerns a system comprising at least one power module comprising at least one power die that is cooled by a liquid cooled system, the liquid cooled system is arranged to provide at least one electric potential to each power dies of the power module, characterized in that the liquid cooled system is composed of a first and a second current-carrying bars connected together by an electrically non-conductive pipe, the first bar is placed on the top of the power module and provides a first electric potential to the power die and the second bar is placed on the bottom of the power module and provides a second electric potential to the power dies and the liquid coolant is electrically conductive and the channels surfaces are covered by an electrical insulation layer.

Abstract: A power module (1) is disclosed, comprising: first and second substrates (10), each substrate patterned layer of electrically conductive material (12), a plurality of pre-packed power cells (20), positioned between the substrates, each cell comprising: an electrically insulating core (21) embedding at least one power die (22), and two external layers (23) of electrically conductive material on opposite sides of the electrically insulating core (21), said external layers being respectively connected to each patterned layers of the substrates, wherein each external layer of a pre-packed power cell comprises a contact pad (230) connected to a respective contact (220) of the power die through connections arranged in the electrically insulating core (21), said contact pad having a surface area greater than the surface area of the power die electrical contact to which it is connected.

Abstract: The present invention concerns a device and a method for controlling the switching from a conducting state to a non conducting state or from a non conducting state to a conducting state of a semiconductor power switch providing current to a load, the device receiving an input signal that is intended to drive the semiconductor power switch. The invention:—senses the derivative of the drain to source current going through the semiconductor power switch in order to obtain a voltage representative of the sensed derivative of drain to source current,—amplifies the voltage representative of the sensed derivative of drain to source current,—adds the amplified voltage representative of the derivative of the sensed drain to source current to the input signal during a given time period.

Abstract: The present invention concerns a method for controlling the temperature of a multi-die power module, comprising: determining and memorizing a first weighted arithmetic mean of junction temperatures of the dies of the multi-die power module, determining successively another weighted arithmetic mean of junction temperatures of the dies, checking if the difference between the other weighted arithmetic mean and the memorized weighted arithmetic mean is lower than a first predetermined value, enabling a modification of the duty cycle of an input signal to apply to at least one selected die of the multi-die power module if the difference is lower than a first predetermined value, disabling a modification of the duty cycle of the input signal to apply to the at least one die of the multi-die power module if the difference is not lower than the first predetermined value.

Abstract: The present invention relates to a printed circuit board embedding a power die wherein interconnections between the power die and the printed circuit board are composed of micro/nano wires, the printed circuit board comprising a cavity wherein the power die is placed, and wherein the cavity is further filled with a dielectric fluid.

Abstract: A method estimates a level of damage or a lifetime expectation of a power semiconductor module having at least one die that is mechanically and electrically attached to a ceramic substrate. The ceramic substrate has piezoelectric properties and the method includes: controlling the at least one power die, the control of the at least one power die generating changes in the electrical potential across the ceramic substrate; obtaining information representative of a mechanical deformation of the ceramic substrate; determining if a notification indicating the level of damage or the lifetime expectation has to be performed according to the obtained information and reference information; and notifying the level of damage or the lifetime expectation if the determining step determines that the notification has to be performed.

Abstract: The present invention concerns a system for allowing the restoration of an interconnection of a die of a power module, a first terminal of the interconnection being fixed on the die and a second terminal of the interconnection being connected to an electric circuit. The system comprises:—at least one material located in the vicinity of the first terminal of the interconnection, the material having a predetermined melting temperature,—means for controlling the temperature of the die at the predetermined melting temperature during a predetermined period of time. The present invention concerns also the method.

Abstract: The present invention concerns a system for allowing the restoration of a first interconnection of a die of a power module connecting the die to an electric circuit. The system comprises: at least one other interconnection of the power module, a periodic current source that is connected to the at least one other interconnection for generating a periodic current flow through the at least one other interconnection in order to reach, in at least a part of the first interconnection, a predetermined temperature during a predetermined time duration. The present invention concerns also the associated method.

Abstract: The present invention concerns a method for estimating a level of damage of an electric device. The method comprises the steps of: forming a histogram of operating cycles related to the electric device for which the level of damage estimation is performed, comparing the formed histogram to histograms of a collection of histograms or to combinations of histograms of the collection of histograms, each histogram of the collection of histogram being associated to a level of damage, in order to determine the histogram of the collection of histograms or the combination of histograms which is the closest from the formed histogram, determining an estimate of the level of damage of the electric device from the level of damage of the closest histogram or from the levels of damages of the histograms of the closest combination of histograms.

Abstract: The present invention concerns a method and a device for estimating a level of damage or a lifetime expectation of a power semiconductor module comprising at least one die that is mechanically, thermally, and electrically attached to a substrate, composed of plural layers of different materials. The invention: obtains power losses of the power semiconductor module, obtains the temperature in at least two different locations of the power semiconductor module, estimates a thermal model between the at least two different locations of the power semiconductor module using the determined power losses and the obtained temperatures, determines if a notification indicating the level of damage or the lifetime expectation has to be performed according to the estimated thermal model and a reference thermal model. notifies the level and location of damage or the lifetime expectation if the determining step determines that the notification has to be performed.

Abstract: The present invention concerns a device for controlling the operation of a power module composed of switches, each switch being composed of a plurality of power dies connected in parallel, characterized in that the device comprises, for each power die of the power module: —a temperature sensor to sense the temperature of the power die, —a current sensor to sense the current going through the power die, —a gate interrupt circuit to interrupt the signal provided to the power die if the sensed current is higher than a predetermined current threshold, —a controller to reduce the conducting time of the die if the sensed temperature of the power die is higher than the average die temperature across the power dies of at least one switch.

Abstract: The present invention concerns a power module composed of a first and second parts (100a, 100b), the first part being composed of conductor layers and insulation layers, characterized in that a first conductor layer is on bottom of the first part, the second part is composed of at least one second conductor layer, the first and/or the second conductor layers comprise cavities that form pipes (300a, 300b) when the first and second conductor layers are in contact, and in that the first and the second conductor layers are bonded together by a metal plating (400a, 400g) of the walls of the pipes.

Abstract: The present invention concerns a system comprising at least one power module comprising at least one power die that is cooled by a liquid cooled system, the liquid cooled system is arranged to provide at least one electric potential to each power dies of the power module, characterized in that the liquid cooled system is composed of a first and a second current-carrying bars connected together by an electrically non-conductive pipe, the first bar is placed on the top of the power module and provides a first electric potential to the power die and the second bar is placed on the bottom of the power module and provides a second electric potential to the power dies and the liquid coolant is electrically conductive and the channels surfaces are covered by an electrical insulation layer.