Abstract: A cooling apparatus for cooling an electronic component includes a heat sink, a heat sink cover to close a top area opening of the heat sink, a tube-shaped cooling element arranged inside the heat sink for some cooling ribs of the heat sink in mechanical contact with an outer side of the tube-shaped cooling element, and an impeller with blades for generating a cooling flow of a cooling medium. The tube-shaped cooling element forms a first cooling duct to conduct the cooling flow in a first cooling flow direction. A second cooling duct opposite the first cooling duct is formed between an inner area of the heat sink and the outer side of the tube-shaped cooling element to conduct the cooling flow in a second cooling flow direction. The cooling flow is redirected from the first cooling duct to the second cooling duct or vice versa.

Abstract: A cooling apparatus for cooling an electronic component includes a heat sink, a heat sink cover to close a top area opening of the heat sink, a tube-shaped cooling element arranged inside the heat sink for some cooling ribs of the heat sink in mechanical contact with an outer side of the tube-shaped cooling element, and an impeller with blades for generating a cooling flow of a cooling medium. The tube-shaped cooling element forms a first cooling duct to conduct the cooling flow in a first cooling flow direction. A second cooling duct opposite the first cooling duct is formed between an inner area of the heat sink and the outer side of the tube-shaped cooling element to conduct the cooling flow in a second cooling flow direction. The cooling flow is redirected from the first cooling duct to the second cooling duct or vice versa.

Abstract: An electrical converter having pluggable converter components includes a first electronic assembly having electronic parts an assembly carrier, a housing chassis and a housing cover, wherein at least one of the electronic parts is a power semiconductor switch having a wide band gap and made of GaN or of InGaN. The power semiconductor switch is operated with a reverse bias of at least 400 V and at a clock frequency of at least 40 kHz during operation of the electrical converter. The first electronic assembly is mechanically plugged into the assembly carrier by connecting elements, and the first electronic assembly together with the assembly carrier is mechanically plugged and locked by further connecting elements to the housing chassis or to the housing cover using corresponding locking elements on the housing chassis or to the housing cover, respectively.

Abstract: A semiconductor module includes a substrate composed of electrically insulating material. A structured metal layer for contact with an electrical component is applied to a top side of the substrate. The structured metal layer is applied to the substrate only in a central region of the substrate, so that an edge region which surrounds the central region and in which the structured metal layer is not applied to the substrate remains on the top side of the substrate. A contact layer for making contact with a cooling body is situated opposite the structured metal layer and applied to a bottom side of the substrate in the central region. A structured supporting structure is further applied to the bottom side of the substrate in the edge region and has a thickness which corresponds to a thickness of the contact layer.

Abstract: A semiconductor module includes a substrate composed of electrically insulating material. A structured metal layer for contact with an electrical component is applied to a top side of the substrate. The structured metal layer is applied to the substrate only in a central region of the substrate, so that an edge region which surrounds the central region and in which the structured metal layer is not applied to the substrate remains on the top side of the substrate. A contact layer for making contact with a cooling body is situated opposite the structured metal layer and applied to a bottom side of the substrate in the central region. A structured supporting structure is further applied to the bottom side of the substrate in the edge region and has a thickness which corresponds to a thickness of the contact layer.

Abstract: The invention relates to a method (20) for producing an electric circuit (2) in which a circuit carrier (4) comprising a first contact surface (14) and a second contact surface (16) is provided. An insulating body (26) is placed on the circuit carrier (4), wherein the insulating body (26) at least partially covers the first contact surface (14) and the second contact surface (16), and the insulating body (26) comprises a recess (34) in the region of both contact surfaces (14, 16). A flowable electro-conductive medium (44) is introduced into the insulating body (26). The invention also relates to an electric circuit (2) and to a further method (60) for producing an electric circuit (2).

Abstract: Various embodiments may include an electronic assembly comprising: a first circuit carrier having a first mounting face for electronic components; a second circuit carrier having a second mounting face for electronic components; wherein the second mounting face faces the first mounting face and is connected thereto; and an electronic component connected both to the first mounting face and the second mounting face; wherein the first mounting face includes a contact region between the first circuit carrier and the component; and the contact region is flexible in a direction perpendicular to the first mounting face in comparison to an adjacent region of the first circuit carrier surrounding the contact region and in comparison to the second circuit carrier.

Abstract: Various embodiments may include an electronic assembly comprising: a first circuit carrier having a first mounting face for electronic components; a second circuit carrier having a second mounting face for electronic components; wherein the second mounting face faces the first mounting face and is connected thereto; and an electronic component connected both to the first mounting face and the second mounting face; wherein the first mounting face includes a contact region between the first circuit carrier and the component; and the contact region is flexible in a direction perpendicular to the first mounting face in comparison to an adjacent region of the first circuit carrier surrounding the contact region and in comparison to the second circuit carrier.

Abstract: An electrical circuit arrangement has at least one capacitor (1) and at least one other circuit part (4) electrically cooperating with the first capacitor (1). The first capacitor (1) is part of a first capacitor arrangement (2) which annularly surrounds the cavity (3). The other circuit part (4) is provided at least partially within the cavity (3) and is electrically connected to the first capacitor (1). The first capacitor arrangement (2) has fastening elements (7) by means of which the circuit arrangement can be mechanically fastened to a holding element (8).

Abstract: A circuit board with a conductor path having a recess, an implant with left, right, lower and upper edges arranged in the recess, where the implant has first and second optical layers, a second optical layer and a conductor arranged between them, the first and the second optical layer each have at least one light-conducting structure with first and second ends, where a light-conductor is arranged in a right edge of the implant, in which respective second ends of the light-conducting structures are located, such that light fed in at the first end of the optical fiber of the first optical layer is deflected to the second end of the light-conducting structure of the second optical layer such that a beam path of the light encompasses the conductor, and the circuit also includes an optical transmitter and an optical receiver with and evaluator that form a fiber optic current sensor.

Abstract: An electrical circuit arrangement has at least one capacitor (1) and at least one other circuit part (4) electrically cooperating with the first capacitor (1). The first capacitor (1) is part of a first capacitor arrangement (2) which annularly surrounds the cavity (3). The other circuit part (4) is provided at least partially within the cavity (3) and is electrically connected to the first capacitor (1). The first capacitor arrangement (2) has fastening elements (7) by means of which the circuit arrangement can be mechanically fastened to a holding element (8).

Abstract: A circuit board with a conductor path having a recess, an implant with left, right, lower and upper edges arranged in the recess, where the implant has first and second optical layers, a second optical layer and a conductor arranged between them, the first and the second optical layer each have at least one light-conducting structure with first and second ends, where a light-conductor is arranged in a right edge of the implant, in which respective second ends of the light-conducting structures are located, such that light fed in at the first end of the optical fiber of the first optical layer is deflected to the second end of the light-conducting structure of the second optical layer such that a beam path of the light encompasses the conductor, and the circuit also includes an optical transmitter and an optical receiver with and evaluator that form a fiber optic current sensor.