Abstract: An optical element for reflecting radiation comprises: a substrate having first and second partial bodies put together at an interface; a reflective coating applied to a surface of the first partial body; a plurality of cooling channels running in the substrate in the region of the interface below the surface to which the reflective coating; a distributor in the substrate for connecting a coolant inlet to the plurality of cooling channels; and a collector in the substrate for connecting the plurality of cooling channels to a coolant outlet. The distributor and/or the collector extend, proceeding from the interface, further into the second partial body of the substrate than into the first partial body of the substrate. An optical arrangement, for example in an EUV lithography system, comprises: at least one such optical element; and a cooling device designed for flowing a coolant through the plurality of cooling channels.

Abstract: A stop, such as a numerical aperture stop, obscuration stop or false-light stop, for a lithography apparatus, includes a light-transmissive aperture and a stop element, in which or at which the aperture is provided. The stop element is opaque and fluid-permeable outside the aperture.

Abstract: A projection exposure apparatus for semiconductor lithography having a projection optical unit. The projection optical unit includes a sensor frame, a carrying frame, and a module. The module includes an optical element and actuators for positioning and orienting the optical element. The module is on the carrying frame, and the sensor frame is a reference for the positioning of the optical element. The module includes an infrastructure which includes interfaces for separating a module from the projection optical unit. A method exchanges the module of a projection optical unit of a projection exposure apparatus for semiconductor lithography, wherein the module includes an optical element, while the reference remains in the projection exposure apparatus.

Abstract: A projection exposure apparatus for semiconductor lithography having a projection optical unit. The projection optical unit includes a sensor frame, a carrying frame, and a module. The module includes an optical element and actuators for positioning and orienting the optical element. The module is on the carrying frame, and the sensor frame is a reference for the positioning of the optical element. The module includes an infrastructure which includes interfaces for separating a module from the projection optical unit. A method exchanges the module of a projection optical unit of a projection exposure apparatus for semiconductor lithography, wherein the module includes an optical element, while the reference remains in the projection exposure apparatus.

Abstract: A connection arrangement is provided for a force-fit connecting ceramic components for a lithography apparatus. The connection arrangement includes first and a second ceramic components and a clamping device. The clamping device directly clamps the first and the second ceramic component against one another in a force-fit manner.

Abstract: The invention relates to an optical imaging device, in particular an objective 1 for microlithography in the field of EUVL for producing semiconductor components, having a beam path 2, a plurality of optical elements 3 and a diaphragm device 7 with an adjustable diaphragm opening shape. The diaphragm device has a diaphragm store 7a, 7b with a plurality of different diaphragm openings 6 with fixed shapes in each case, which can be introduced into the beam path 2.

Abstract: Microlithographic illumination system includes individually drivable elements to variably illuminate a pupil surface of the system. Each element deviates an incident light beam based on a control signal applied to the element. The system also includes an instrument to provide a measurement signal, and a model-based state estimator configured to compute, for each element, an estimated state vector based on the measurement signal. The estimated state vector represents: a deviation of a light beam caused by the element; and a time derivative of the deviation. The illumination system further includes a regulator configured to receive, for each element: a) the estimated state vector; and b) target values for: i) the deviation of the light beam caused by the deviating element; and ii) the time derivative of the deviation.

Abstract: Microlithographic illumination system includes individually drivable elements to variably illuminate a pupil surface of the system. Each element deviates an incident light beam based on a control signal applied to the element. The system also includes an instrument to provide a measurement signal, and a model-based state estimator configured to compute, for each element, an estimated state vector based on the measurement signal. The estimated state vector represents: a deviation of a light beam caused by the element; and a time derivative of the deviation. The illumination system further includes a regulator configured to receive, for each element: a) the estimated state vector; and b) target values for: i) the deviation of the light beam caused by the deviating element; and ii) the time derivative of the deviation.

Abstract: An optical imaging apparatus includes an optical element support sub-structure and an auxiliary support sub-structure. The optical element support sub-structure is configured to support an optical element and has a first temporary support interface arrangement. The optical element is configured to form part of a group of optical elements of the optical imaging apparatus configured to transfer, in an exposure process using exposure light, an image of a pattern of a mask onto a substrate. The auxiliary support sub-structure is configured to support an auxiliary component and has a second temporary support interface arrangement. The auxiliary component is configured to execute, during the exposure process, an auxiliary function of the exposure process other than transferring the image of the pattern onto the substrate.

Abstract: A connection arrangement is provided for a force-fit connecting ceramic components for a lithography apparatus. The connection arrangement includes first and a second ceramic components and a clamping device. The clamping device directly clamps the first and the second ceramic component against one another in a force-fit manner.

Abstract: The invention relates to an optical imaging device, in particular an objective 1 for microlithography in the field of EUVL for producing semiconductor components, having a beam path 2, a plurality of optical elements 3 and a diaphragm device 7 with an adjustable diaphragm opening shape. The diaphragm device has a diaphragm store 7a, 7b with a plurality of different diaphragm openings 6 with fixed shapes in each case, which can be introduced into the beam path 2.

Abstract: Microlithographic illumination system includes individually drivable elements to variably illuminate a pupil surface of the system. Each element deviates an incident light beam based on a control signal applied to the element. The system also includes an instrument to provide a measurement signal, and a model-based state estimator configured to compute, for each element, an estimated state vector based on the measurement signal. The estimated state vector represents: a deviation of a light beam caused by the element; and a time derivative of the deviation. The illumination system further includes a regulator configured to receive, for each element: a) the estimated state vector; and b) target values for: i) the deviation of the light beam caused by the deviating element; and ii) the time derivative of the deviation.

Abstract: An optical system for semiconductor lithography including a plurality of optical components, as well as related components and methods, are disclosed. The apparatus can include an optical component that can be moved by a distance along a straight line within a time of between 5 ms and 500 ms. The straight line can have a polar and azimuth angle of between 0° and 90°, and a distance between the straight line and an optical axis of the apparatus being less than a cross-sectional dimension of a projection exposure beam bundle of the projection exposure apparatus. The apparatus can also include a guide unit configured to guide the optical component.

Abstract: An optical imaging apparatus includes an optical element support sub-structure and an auxiliary support sub-structure. The optical element support sub-structure is configured to support an optical element and has a first temporary support interface arrangement. The optical element is configured to form part of a group of optical elements of the optical imaging apparatus configured to transfer, in an exposure process using exposure light, an image of a pattern of a mask onto a substrate. The auxiliary support sub-structure is configured to support an auxiliary component and has a second temporary support interface arrangement. The auxiliary component is configured to execute, during the exposure process, an auxiliary function of the exposure process other than transferring the image of the pattern onto the substrate.

Abstract: An optical arrangement has a plurality of optical elements capable of transmitting a beam. A partial housing is provided which extends from a surface of an optical element in the direction of the beam emanating from the optical element, or of the beam incident on the optical element, and whose shape is adapted to the shape of the beam. The partial housing is surrounded at least partially by a measurement structure which is mechanically decoupled therefrom. The measurement structure has at least one sensor.

Abstract: An optical arrangement includes a multiplicity of optical elements and a carrier structure which carries the optical elements. The carrier structure is composed of at least two releasably interconnected modules. Each module is composed of at least one carrier structure subelement. A subhousing is produced by a multiplicity of carrier structure subelements and/or modules. The subhousing has a geometry that varies, at least in regions, in correspondence to a usable beam path in the projection exposure apparatus, the usable beam path being defined as an envelope of all light bundles which can propagate from all field points in a field plane to an image plane of the projection exposure apparatus. A projection exposure apparatus for EUV lithography includes such an optical arrangement.

Abstract: Microlithographic illumination system includes individually drivable elements to variably illuminate a pupil surface of the system. Each element deviates an incident light beam based on a control signal applied to the element. The system also includes an instrument to provide a measurement signal, and a model-based state estimator configured to compute, for each element, an estimated state vector based on the measurement signal. The estimated state vector represents: a deviation of a light beam caused by the element; and a time derivative of the deviation. The illumination system further includes a regulator configured to receive, for each element: a) the estimated state vector; and b) target values for: i) the deviation of the light beam caused by the deviating element; and ii) the time derivative of the deviation.

Abstract: Microlithographic illumination system includes individually drivable elements to variably illuminate a pupil surface of the system. Each element deviates an incident light beam based on a control signal applied to the element. The system also includes an instrument to provide a measurement signal, and a model-based state estimator configured to compute, for each element, an estimated state vector based on the measurement signal. The estimated state vector represents: a deviation of a light beam caused by the element; and a time derivative of the deviation. The illumination system further includes a regulator configured to receive, for each element: a) the estimated state vector; and b) target values for: i) the deviation of the light beam caused by the deviating element; and ii) the time derivative of the deviation.

Abstract: A lithography apparatus is disclosed, which comprises: a first component, a second component, a coupling device which is configured to couple the first and second components to one another, a capture device for capturing a movement of a floor on which the lithography apparatus stands, and a control device which is configured to actuate the coupling device depending on the captured movement of the floor in order to restrict a movement of the second component relative to the first component.

Abstract: Microlithographic illumination system includes individually drivable elements to variably illuminate a pupil surface of the system. Each element deviates an incident light beam based on a control signal applied to the element. The system also includes an instrument to provide a measurement signal, and a model-based state estimator configured to compute, for each element, an estimated state vector based on the measurement signal. The estimated state vector represents: a deviation of a light beam caused by the element; and a time derivative of the deviation. The illumination system further includes a regulator configured to receive, for each element: a) the estimated state vector; and b) target values for: i) the deviation of the light beam caused by the deviating element; and ii) the time derivative of the deviation.