Patents by Inventor Stefano Oggioni
Stefano Oggioni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11251160Abstract: Manufacturing of flip-chip type assemblies is provided, and includes forming one or more contact elements of electrically conductive material on a carrier surface of at least one chip carrier, providing a restrain structure around the contact elements, depositing solder material on the contact elements and/or on one or more terminals of electrically conductive material on a chip surface of at least one integrated circuit chip, and placing the chip with each terminal facing corresponding contact elements. Further, the method includes soldering each terminal to the corresponding contact element by a soldering material, the soldering material being restrained during a soldering of the terminals to the contact elements by the restrain structure, and forming one or more heat dissipation elements of thermally conductive material on the carrier surface for facing the chip surface displaced from the terminals, where the one or more heat dissipation elements are free of any solder mask.Type: GrantFiled: July 31, 2020Date of Patent: February 15, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stefano Oggioni, Thomas Brunschwiler, Gerd Schlottig
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Patent number: 10886254Abstract: A solution relating to electronic devices of flip-chip type is provided, which includes at least one chip carrier having a carrier surface, the carrier(s) including one or more contact elements of electrically conductive material on the carrier surface, at least one integrated circuit chip having a chip surface, the chip(s) including one or more terminals of electrically conductive material on the chip surface each one facing a corresponding contact element, solder material soldering each terminal to the corresponding contact element, and a restrain structure around the contact elements for restraining the solder material during a soldering of the terminals to the contact elements. The carrier includes one or more heat dissipation elements of thermally conductive material on the carrier surface facing the chip surface displaced from the terminals, the dissipation elements being free of any solder mask.Type: GrantFiled: September 28, 2018Date of Patent: January 5, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stefano Oggioni, Thomas Brunschwiler, Gerd Schlottig
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Publication number: 20200357774Abstract: Manufacturing of flip-chip type assemblies is provided, and includes forming one or more contact elements of electrically conductive material on a carrier surface of at least one chip carrier, providing a restrain structure around the contact elements, depositing solder material on the contact elements and/or on one or more terminals of electrically conductive material on a chip surface of at least one integrated circuit chip, and placing the chip with each terminal facing corresponding contact elements. Further, the method includes soldering each terminal to the corresponding contact element by a soldering material, the soldering material being restrained during a soldering of the terminals to the contact elements by the restrain structure, and forming one or more heat dissipation elements of thermally conductive material on the carrier surface for facing the chip surface displaced from the terminals, where the one or more heat dissipation elements are free of any solder mask.Type: ApplicationFiled: July 31, 2020Publication date: November 12, 2020Inventors: Stefano OGGIONI, Thomas BRUNSCHWILER, Gerd SCHLOTTIG
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Publication number: 20190043838Abstract: A solution relating to electronic devices of flip-chip type is provided, which includes at least one chip carrier having a carrier surface, the carrier(s) including one or more contact elements of electrically conductive material on the carrier surface, at least one integrated circuit chip having a chip surface, the chip(s) including one or more terminals of electrically conductive material on the chip surface each one facing a corresponding contact element, solder material soldering each terminal to the corresponding contact element, and a restrain structure around the contact elements for restraining the solder material during a soldering of the terminals to the contact elements. The carrier includes one or more heat dissipation elements of thermally conductive material on the carrier surface facing the chip surface displaced from the terminals, the dissipation elements being free of any solder mask.Type: ApplicationFiled: September 28, 2018Publication date: February 7, 2019Inventors: Stefano OGGIONI, Thomas BRUNSCHWILER, Gerd SCHLOTTIG
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Patent number: 10153250Abstract: A solution relating to electronic devices of flip-chip type is provided, which includes at least one chip carrier having a carrier surface, the carrier(s) including one or more contact elements of electrically conductive material on the carrier surface, at least one integrated circuit chip having a chip surface, the chip(s) including one or more terminals of electrically conductive material on the chip surface each one facing a corresponding contact element, solder material soldering each terminal to the corresponding contact element, and a restrain structure around the contact elements for restraining the solder material during a soldering of the terminals to the contact elements. The carrier includes one or more heat dissipation elements of thermally conductive material on the carrier surface facing the chip surface displaced from the terminals, the dissipation elements being free of any solder mask.Type: GrantFiled: November 26, 2014Date of Patent: December 11, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stefano Oggioni, Thomas Brunschwiler, Gerd Schlottig
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Publication number: 20160307874Abstract: A solution relating to electronic devices of flip-chip type is proposed.Type: ApplicationFiled: November 26, 2014Publication date: October 20, 2016Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stefano OGGIONI, Thomas BRUNSCHWILER, Gerd SCHLOTTIG
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Publication number: 20080069494Abstract: An electro-optical module comprising flexible connection cable and aligning capabilities is disclosed. Electro-optical devices may be soldered on a transparent substrate such as glass or a substrate comprising an optical waveguide wherein electrically conductive traces are designed, forming an electro-optical module. When such electro-optical module is inserted and aligned into a printed circuit board, the external part of the substrate, comprising electrically conductive traces and pads, referred to as flex-cable, is bent down toward the mounting plane of the PCB allowing to establish electrical connections between these pads and the PCB. The substrate may be broken along a pre-formed groove, and the external part of the substrate can be removed leaving the flex-cable section in place.Type: ApplicationFiled: September 26, 2007Publication date: March 20, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stefano Oggioni, Bert Offrein
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Publication number: 20080036598Abstract: A tamper-proof structure for protecting an electronic module, comprising a pattern of signal lines having a highly unpredictable layout, which is an approximation of a space-filling curve obtained by the replication of at least one elementary space element having an inscribed base curve inscribed therein. The base curve is adapted, by replication of the elementary space element, to generate an approximation of an at least two-dimensional space-filling curve, the replication being such that an end of the base curve in one elementary space element is connected to the end of the base curve in another, adjacent elementary space element of the replication.Type: ApplicationFiled: February 28, 2007Publication date: February 14, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventor: Stefano Oggioni
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Publication number: 20080032520Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: February 7, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas
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Publication number: 20080023845Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: January 31, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas
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Publication number: 20080026605Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: January 31, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas
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Publication number: 20080026606Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: January 31, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas
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Publication number: 20080026607Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: January 31, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas
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Publication number: 20080020599Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: January 24, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas
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Publication number: 20080020603Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: January 24, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas
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Publication number: 20080020596Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: January 24, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas
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Publication number: 20080020597Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: January 24, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas
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Publication number: 20080020601Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: January 24, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas
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Publication number: 20080020600Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: January 24, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas
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Publication number: 20080011814Abstract: A method and system for efficiently self-aligning parts of a MEMS during manufacturing, as well as controlling distance between these parts, are disclosed. According to the invention each MEMS part comprises at least one pad that is aligned so as to form a pair of pads. In a preferred embodiment, each part comprises three pads. The pad shape of two pairs of pads is rectangular, one pair being rotated of an angle approximately equal to 90° from the other, and the pad shape of the third pair is annular. Therefore, one of the pair of pads allows alignment according to a first direction, a second pair of pads allows alignment according to a second direction, and the third pair of pads allows rotational alignment.Type: ApplicationFiled: November 8, 2004Publication date: January 17, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stefano Oggioni, Thomas Albrecht, Michel Despont, Mark Lantz, Michele Castriotta