Patents by Inventor Stephan Bradl

Stephan Bradl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7566378
    Abstract: The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.
    Type: Grant
    Filed: May 23, 2006
    Date of Patent: July 28, 2009
    Assignee: Infineon Technologies AG
    Inventors: Stephan Bradl, Michael Melzl, Josef Schwaiger, Thilo Stache
  • Publication number: 20090108440
    Abstract: A semiconductor device is disclosed. One embodiment provides an arrangement of a plurality of semiconductor chips arranged side by side in a spaced apart relationship. A first material fills at least partly the spacings between adjacent semiconductor chips. A second material is arranged over the semiconductor chips and the first material. A coefficient of thermal expansion of the first material is selected to adapt the lateral thermal expansion of the arrangement in a plane intersecting the first material and the semiconductor chips to the lateral thermal expansion of the arrangement in a plane intersecting the second material.
    Type: Application
    Filed: October 26, 2007
    Publication date: April 30, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Thorsten Meyer, Markus Brunnbauer, Marcus Kastner, Stephan Bradl
  • Publication number: 20090093127
    Abstract: The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.
    Type: Application
    Filed: December 9, 2008
    Publication date: April 9, 2009
    Inventors: Stephan Bradl, Michael Melzl, Josef Schwaiger, Thilo Stache
  • Publication number: 20090045511
    Abstract: An integrated circuit includes a substrate including a contact pad, a redistribution line coupled to the contact pad, and a dielectric material layer between the substrate and the redistribution line. The integrated circuit includes a solder ball coupled to the redistribution line and a parylene material layer sealing the dielectric material layer and the redistribution line.
    Type: Application
    Filed: August 15, 2007
    Publication date: February 19, 2009
    Inventors: Thorsten Meyer, Markus Brunnbauer, Stephan Bradl
  • Publication number: 20080265383
    Abstract: A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer. In the molding compound a contact via is arranged.
    Type: Application
    Filed: November 14, 2007
    Publication date: October 30, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Markus Brunnbauer, Jens Pohl, Klaus Pressel, Thorsten Meyer, Recai Sezi, Stephan Bradl, Ralf Plieninger
  • Publication number: 20080265421
    Abstract: A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer.
    Type: Application
    Filed: May 10, 2007
    Publication date: October 30, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Markus Brunnbauer, Thorsten Meyer, Stephan Bradl, Ralf Plieninger
  • Publication number: 20070178612
    Abstract: A semiconductor wafer with rear side identification and to a method for producing the same is disclosed. In one embodiment, the rear side identification has a multiplicity of information regarding the monocrystalline and surface and also rear side constitution. A multiplicity of semiconductor device positions arranged in rows and columns are provided on the top side of the semiconductor wafer, an information chip being arranged at an exposed semiconductor device position, the information chip having at least the information of the rear side identification.
    Type: Application
    Filed: January 11, 2007
    Publication date: August 2, 2007
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Stephan Bradl, Rainer Holmer
  • Publication number: 20070117351
    Abstract: A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.
    Type: Application
    Filed: October 13, 2006
    Publication date: May 24, 2007
    Inventors: Stephan Bradl, Walther Grommes, Werner Kroninger, Michael Melzl, Josef Schwaiger, Thilo Stache
  • Publication number: 20060276010
    Abstract: The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.
    Type: Application
    Filed: May 23, 2006
    Publication date: December 7, 2006
    Inventors: Stephan Bradl, Michael Melzl, Josef Schwaiger, Thilo Stache
  • Publication number: 20050221602
    Abstract: A method is described in which a contact hole (18) to an interconnect (14) in an insulating layer (16) is fabricated. A barrier layer (20) is subsequently applied. Afterward, a photoresist layer (30) is applied, irradiated and developed. With the aid of a galvanic method, a copper contact (32) is then produced in the contact hole (18). Either the barrier layer (20) or an additional boundary electrode layer (22) serves as a boundary electrode in the galvanic process. Critical metal contaminations are minimized in production.
    Type: Application
    Filed: May 23, 2005
    Publication date: October 6, 2005
    Inventors: Stephan Bradl, Klaus Kerkel, Christine Lindner
  • Patent number: 6459296
    Abstract: The electrical characteristic of a microelectronic circuit configuration that has at least one analog electronic unit is set. In a configuration step, by feeding and/or extracting electrical charge, the analog electronic unit is put into a state which permanently determines the analog electrical characteristics of the unit. In particular, the floating gate of an EEPROM cell is charged up to a freely selectable charge value lying within a continuous range.
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: October 1, 2002
    Assignee: Infineon Technologies AG
    Inventors: Stephan Bradl, Oliver Gehring, Olaf Heitzsch
  • Patent number: 6447372
    Abstract: The polishing agent of the invention has polishing grains suspended in a solution. The polishing grains consist essentially of a first substance with a glass transition temperature TG, and the polishing grains contain a dopant. The concentration of the dopant is set so that the glass transition temperature TG′ of the doped substance is lower than the glass transition temperature TG of the undoped first substance. The polishing agent is advantageously used for the microscratch-free planarization of a semiconductor substrate or of layers applied on it.
    Type: Grant
    Filed: January 25, 2000
    Date of Patent: September 10, 2002
    Assignee: Infineon Technologies AG
    Inventors: Stephan Bradl, Olaf Heitzsch
  • Publication number: 20020072301
    Abstract: A method and an apparatus for detecting the presence of a work piece in an automatic processing apparatus are described. Previously known detection devices cannot make a clear distinction between the presence and absence of the work piece under all conditions. An apparatus is therefore provided which contains an ultrasound transmitter, an ultrasound receiver and a detection device (controller). The detection as to whether a work piece is held in a holder in the processing apparatus is carried out by irradiating the holder with ultrasound waves, receiving the reflected ultrasound waves and detecting on the basis of the reflected ultrasound waves. The method can be used advantageously in particular in polishing machines for wafers, where the polishing cloth is distinguished considerably, in terms of its acoustic reflection capacity, from the wafer to be polished.
    Type: Application
    Filed: September 24, 2001
    Publication date: June 13, 2002
    Inventors: Stephan Bradl, Olaf Heitzsch
  • Publication number: 20020011869
    Abstract: The electrical characteristics of a microelectronic circuit configuration that has at least one analog electronic unit is set. In a configuration step, by feeding and/or extracting electrical charge, the analog electronic unit is put into a state which permanently determines the analog electrical characteristics of the unit. In particular, the floating gate of an EEPROM cell is charged up to a freely selectable charge value lying within a continuous range.
    Type: Application
    Filed: July 26, 2001
    Publication date: January 31, 2002
    Inventors: Stephan Bradl, Oliver Gehring, Olaf Heitzsch
  • Patent number: 6337255
    Abstract: A method for forming a trench structure in a silicon substrate, which trench structure serves for electrically insulating a first region of the substrate from a second substrate region. The method proceeds from a growth of a thermal oxide layer on the substrate surface and an application and patterning of a mask layer over the thermal oxide layer. A trench of predetermined depth is subsequently etched into the silicon substrate through the patterned mask layer. The trench is filled by a deposition of a conformal covering oxide layer on the substrate with an essentially uniform thickness that is sufficient for completely filling the trench. Afterwards, a polysilicon layer is deposited on the covering oxide layer and a chemical mechanical planarization method is carried out with high selectivity S between the polysilicon material and the oxide material in order to obtain a flat surface.
    Type: Grant
    Filed: March 24, 2000
    Date of Patent: January 8, 2002
    Assignee: Infineon Technologies AG
    Inventors: Stephan Bradl, Olaf Heitzsch, Michael Schmidt
  • Patent number: 6086269
    Abstract: A method and an apparatus apply a substance, especially a developer, to a surface through jets. Each jet carries the substance to be applied to a predetermined portion of the surface, and each jet essentially applies a predetermined quantity of substance per unit of surface area, wherein at least one jet applies a maximum quantity of substance per unit of surface area to the surface. The quantity of substance per unit of surface area applied by each jet is selected in such a way that it is greater than 1% of the maximum quantity of substance per unit of surface area.
    Type: Grant
    Filed: May 5, 1998
    Date of Patent: July 11, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Stephan Bradl, Elke Hietschold
  • Patent number: 6014218
    Abstract: A device for end-point monitoring used in the polishing of components, in particular semiconductor components. The device has a textile structure, which may be constructed as a cloth or a pad, and is used to accommodate a component that is to be monitored. The textile-like structure has a windowless construction. The textile structure may be disposed on a platen. Furthermore, a light source, preferably a laser, for emitting a monochromatic red light beam having a preferred wavelength of approximately 800 nm is provided. The red light beam is directed through the textile structure onto the component to be monitored. In addition, a detector is used to detect the red light beam reflected by the component to be monitored. The end-point monitoring may, for example, be carried out by interferometry. In addition, a corresponding method is also described.
    Type: Grant
    Filed: December 3, 1998
    Date of Patent: January 11, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Stephan Bradl, Olaf Heitzsch