Abstract: A pivot component of an apparatus in one example is coupled with a first circuit board that comprises a first connection component. The pivot component controls a relative alignment of the first connection component with a second connection component of a second circuit board for an engagement of the first connection component with the second connection component.

Abstract: An assembly for supporting a short printed circuit card includes a card slot separator disposed in a card bay of a computer system and at least one card support block. The at least one card support block couples to the card slot separator and can be selectively positioned along the card slot separator for reception of an unsupported edge of the short printed circuit card.

Abstract: A pivot component of an apparatus in one example is coupled with a first circuit board that comprises a first connection component. The pivot component controls a relative alignment of the first connection component with a second connection component of a second circuit board for an engagement of the first connection component with the second connection component.

Abstract: A device for removing heat from an electronic component, comprising a heat sink that can be coupled to the electronic component and conduct heat therefrom. A finned appurtenance coupled to the heat sink can transfer the heat into a fluid medium. The fins are oriented at an angle with respect to several flow streams of the fluid medium across the fins. Each flow stream follows a unique direction.

Abstract: A localized system for dissipating heat generated by an electronic component includes a controllable cooling element and a control system for controlling the cooling element. The control system adjusts a speed of operation of the cooling element in response to variations in power consumption of the electronic component.

Abstract: An apparatus for heat dissipation in a chassis housing an electronic system, and a method for implementing the same. The apparatus comprises a heat sink base for collecting thermal heat. The apparatus further comprises a fin thermally coupled to the heat sink base for dissipating the thermal heat. The fin is arranged in the chassis to direct air flow from a first direction, that is originally directed at said fin, to a second direction.

Abstract: Disclosed herein are exemplary embodiments of a Pivoted Field Replaceable Unit (FRU) for an electronic device.

Abstract: A thermal dissipation apparatus for implementing chassis conducted cooling for a server. The apparatus includes a heat sink having a first surface and a second surface. The first surface is adapted to accept a chip thermal interface for a chip. The second surface is adapted to accept a chassis thermal interface for a chassis surface, wherein the second surface implements a thermal conductive path from the chip to the chassis surface.

Abstract: Disclosed herein are exemplary embodiments of a Field Replaceable Unit (FRU) access device an electronic device.

Abstract: System for electrically interconnecting components are provided. One such system comprises: a flex cable having a first end and a second end; a first connector attached to a electrically communicating with the first end of the flex cable; a second connector attached to and electrically communicating with the second end of the flex cable; and a first retention member extending outwardly from the flex cable.

Abstract: Systems for electrically interconnecting components are provided. One such system comprises: a flex cable having a first end and a second end; a first connector attached to and electrically communicating with the first end of the flex cable; a second connector attached to and electrically communicating with the second end of the flex cable; and a first retention member extending outwardly from the flex cable.

Abstract: Systems for electrically interconnecting components are provided. One such system comprises: a flex cable having a first end and a second end; a first connector attached to and electrically communicating with the first end of the flex cable; a second connector attached to and electrically communicating with the second end of the flex cable; and a first retention member extending outwardly from the flex cable.

Abstract: A hinged-bezel system for use with electronic devices housed in equipment enclosures. The system, comprising a comb, a clamp plate, and a hinged bezel, extends the pivot of a hinge outward from the face of a equipment enclosure to allow full access to components within the equipment enclosure, through the front face of the equipment enclosure, without removing the hinged bezel. Additionally, the system allows the electronic device to be fully anchored to the equipment enclosure. The comb, mounted to the front face of the equipment enclosure, securely fastens to the clamp plate, which is attached to the front sidewall of the electronic device along with the hinged bezel.

Abstract: A method and apparatus to support varying sizes of memory cards against shock and vibration. One embodiment of the invention involves a method to assemble a support clip to one or more cards attached on a substrate by a connector. A second embodiment of the invention involves a method to fabricate a support clip. A third embodiment of the invention involves an assembled substrate with a plurality of cards secured by one or more support clips to the substrate.

Abstract: A fluid-flow balancer mimics the air-flow resistance of a component omitted from an electronic system so that omission causes little or no disruption to or alteration of the flow of a cooling fluid. This prevents overheating that such disruption or alteration may otherwise cause. In addition, the fluid-flow balancer may also mimic the EMI suppression characteristics of the omitted component. Thus, a system not fully populated with components can still be adequately cooled and shielded without changing the cooling or shielding systems.

Abstract: A bezel that includes a number of unitary EMI-shield-and-snap-retention features molded onto an inner surface of a bezel. The EMI-shield-and-snap-retention features partially fasten an EMI shield to the bezel, while also fastening the bezel to a snap attached to an equipment enclosure. Each feature contains two flanged and tapered guide strips flanking one or more ramp-shaped pieces. As the EMI shield is placed flat along the interior of the bezel, the flanged sections of the guide strips lie over top of the EMI shield, pressing the EMI shield against the interior of the bezel. As the bezel closes against the equipment enclosure, the tapered sections of the guide strips guide the snap up the ramp-shaped pieces. The snap gains tension ascending the ramp-shaped pieces. When the snap crests the ramps, tension is released in the snap, causing the convex tip of the snap to stay secured to the ramp-shaped pieces.

Abstract: A combination of EMI-shield-retention features molded onto a bezel for an equipment enclosure. The features collectively fasten a notched and cutout EMI shield to the inner surface of the bezel without requiring any tools or fasteners. Several −Z-retention features provide surfaces for the EMI shield to lie flat against the inner surface of the bezel, while several X, Y-retention features protrude through holes and notches cut in the EMI shield to further retain the EMI shield. Finally, +Z-retention features along one edge of the bezel provide flanges for the EMI shield to slide under, while +Z-retention features, on the opposite edge of the bezel from the flanges, snap over top of the EMI shield.

Abstract: A hinged-bezel system for use with electronic devices housed in equipment enclosures. The system, comprising a comb, a clamp plate, and a hinged bezel, extends the pivot of a hinge outward from the face of a equipment enclosure to allow full access to components within the equipment enclosure, through the front face of the equipment enclosure, without removing the hinged bezel. Additionally, the system allows the electronic device to be fully anchored to the equipment enclosure. The comb, mounted to the front face of the equipment enclosure, securely fastens to the clamp plate, which is attached to the front sidewall of the electronic device along with the hinged bezel.

Abstract: A bezel that includes a number of unitary EMI-shield-and-snap-retention features molded onto an inner surface of a bezel. The EMI-shield-and-snap-retention features partially fasten an EMI shield to the bezel, while also fastening the bezel to a snap attached to an equipment enclosure. Each feature contains two flanged and tapered guide strips flanking one or more ramp-shaped pieces. As the EMI shield is placed flat along the interior of the bezel, the flanged sections of the guide strips lie over top of the EMI shield, pressing the EMI shield against the interior of the bezel. As the bezel closes against the equipment enclosure, the tapered sections of the guide strips guide the snap up the ramp-shaped pieces. The snap gains tension ascending the ramp-shaped pieces. When the snap crests the ramps, tension is released in the snap, causing the convex tip of the snap to stay secured to the ramp-shaped pieces.