Abstract: A sealing device and method are described herein that can be used to manufacture a hermetically sealed glass package. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment (e.g., oxygen, moisture). Some examples of such glass packages are organic emitting light diode (OLED) displays, sensors, and other optical devices. The present invention is demonstrated using an OLED display as an example.

Abstract: A method for manufacturing a hermetically sealed package is provided, the method comprising the steps of: using a laser to heat a frit, disposed in a pattern between two substrates, such that the heated frit forms a hermetic seal which connects the substrates and further comprising: directing the laser to enter the frit pattern, then to trace the frit pattern, then to retrace a portion of the frit pattern, and then to exit the frit pattern; and selecting an initial laser power which, when the laser enters the frit pattern, is insufficient to heat the frit to form a hermetic seal; then increasing the laser power over a first section of the frit pattern to a target laser power at least sufficient to heat the frit to form a hermetic seal; and then decreasing the laser power over a second section of the frit pattern until the laser power is insufficient to heat the frit to form a hermetic seal before the laser exits the frit pattern.

Abstract: A laser assisted frit sealing method is described herein that is used to manufacture a glass package having a first glass plate (with a relatively high CTE of about 80-90×10?7° C.?1), a second glass plate, and a frit (with a CTE that is at least about 35×10?7° C.?1), where the frit forms a seal (e.g., hermetic seal) which connects the first glass plate to the second glass plate.

Abstract: A method of finding defects in sealing material formed as a frame line on a glass plate includes irradiating the frame line of sealing material. A temperature of the irradiated sealing material is measured and a change of the temperature caused by a nonuniformity in sealing material is detected. Another aspect features a method of hermetically sealing a thin film device between glass plates. Sealing material is dispensed on a cover glass plate in the form of a frame line cell. The sealing material is pre-sintered onto the cover glass plate and cooled. A laser beam is moved around the frame line on the sealing material. A temperature of the sealing material contacted with the laser beam is measured. A change in the temperature (?T) caused by a nonuniformity in the sealing material is measured. Further aspects include a feedback process, infrared imaging and use of delta temperature data to increase sensitivity of temperature measurement data.

Abstract: Vacuum-insulated glass (VIG) windows (10) that employ glass-bump spacers (50) and two or more glass panes (20) are disclosed. The glass-bump spacers are formed in the surface (24) of one of the glass panes (20) and consist of the glass material from the body portion (23) of the glass pane. Thus, the glass-bump spacers are integrally formed in the glass pane, as opposed to being discrete spacer elements that need to be added and fixed to the glass pane. Methods of forming VIG windows are also disclosed. The methods include forming the glass-bump spacers by irradiating a glass pane with a focused beam (112F) from a laser (110). Heating effects in the glass cause the glass to locally expand, thereby forming a glass-bump spacer. The process is repeated at different locations in the glass pane to form an array of glass-bump spacers. A second glass pane is brought into contact with the glass-bump spacers, and the edges (28F, 28B) sealed.

Abstract: A method for laser patterning of a glass body, the method comprising the steps of: (i) providing a laser, said laser having an output beam at a laser wavelength ?; (ii) providing a glass body having optical density at of at least 1.5/cm at said wavelength; (iii) directing said laser output beam to (a) impinge on the glass body without ablating said glass, and (b) heat the glass body at a location proximate to said laser output beam so as to form a swell at this location; and (iv) etching this location.

Abstract: A glass article having at least one edge of which at least a portion has been laser melted. The laser melted portion scatters light, thus enabling the glass article to be properly aligned. In some embodiments, the laser melted portion also provides a roughened edge having a coefficient of friction that facilitates handling of the glass article. The laser melted portion is formed by irradiating the peripheral surface with a laser beam to cause localized melting.

Abstract: A display device (10) including a first substrate (12), a second substrate (16), an OLED element (18), and a wall (14) that contains glass. A sealed portion (6) is formed in the wall and between the first substrate and the second substrate so as to produce a hermetic seal. The sealed portion is disposed in the wall so that unsealed portions (7,8) are disposed on opposite sides of the sealed portion. A width (3) of the sealed portion is from about 35% to about 77.3% of a width (2) of the wall. The sealed portion may be formed by heating the wall with a laser beam (32) so that a thickness (1) of the wall lies within the depth of focus (34) of the laser beam. Further, the width (36) of the laser beam can be less than or equal to the width of the wall.

Abstract: A method of encapsulating a display device between substrates with a glass frit. The method includes depositing a frit having an optical absorption ? which is a function of wavelength onto a first substrate wherein the deposited frit has a height h, placing a second substrate in contact with the frit, sealing together the substrates by traversing a laser light having a wavelength ? over the frit at a speed greater than about 5 mm/s, and wherein ?·h at ? is between 0.4 and about 1.75.

Abstract: Packages for elements, e.g., OLEDs, that are temperature sensitive are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals at least one temperature sensitive element (18,28,36) between the substrates (12,16). The wall (14) comprises a sintered frit and at least a portion of the wall is laser sealed to the second substrate (16) by melting a glass component of the sintered frit. The minimum width (40) of the laser-sealed portion of the wall (14) at any location along the wall (14) is greater than or equal to 2 millimeters so as to provide greater hermeticity and strength to the package. The laser sealing is performed without substantially degrading the temperature sensitive element(s) (18,28,36) housed in the package.

Abstract: A method of minimizing stress in an OLED device laser sealing process using an elongated laser beam. A laser beam having an intensity distribution which decreases as a function of distance from the longitudinal axis of the beam is passed through a mask to create an elongated beam having a length-wise intensity distribution which decreases as a function of distance from the axis of the beam and a substantially constant width-wise intensity distribution. The elongated beam is traversed over a line of frit disposed between two substrates. The tails of the length-wise intensity distribution provide for a slow cool down of the frit as the beam traverses the line of frit.

Abstract: Microlenses are formed on a substrate having a first absorption within an operational wavelength range, and a second absorption outside the operational wavelength range, wherein the second absorption is greater than the first absorption. One or more waveguides are coupled with a processing light beam having a wavelength outside the operational wavelength range, and the processing light beam is directed through the waveguides to the substrate to locally heat and expand the substrate so as to form microlenses on the substrate surface. The processing light beam is terminated to stop heating of the substrate and fix the microlenses.

Abstract: Glass-based micropositioning systems and methods are disclosed. The micropositioning systems and methods utilize microbumps (40) formed in a glass substrate (12 or 100). The microbumps are formed by subjecting a portion of the glass substrate to localized heating, which results in local rapid expansion of glass where the heat was applied. The height and shape of the microbumps depend on the type of glass substrate and the amount and form of heat delivered to the substrate. The microbumps allow for active or passive micropositioning of optical elements, including planar waveguides and optical fibers. Optical assemblies formed using microbump micropositioners are also disclosed.

Abstract: A glass article having at least one edge of which at least a portion has been laser melted. The laser melted portion scatters light, thus enabling the glass article to be properly aligned. In some embodiments, the laser melted portion also provides a roughened edge having a coefficient of friction that facilitates handling of the glass article. The laser melted portion is formed by irradiating the peripheral surface with a laser beam to cause localized melting.

Abstract: A method of sealing a plurality of frame-like frit walls disposed between two substrates. The frit walls are arranged in rows and columns and divided into groups, each group being sealed by a separate laser beam. Several strategies are disclosed for the order in which the frit walls are heated and sealed by a laser beam to optimize the efficiency of the sealing process.

Abstract: A method of making a mask for frit sealing a glass envelope comprising depositing a paste onto a glass substrate, depositing a metallic layer overtop the substrate and paste, and removing the paste and a portion of the metallic layer. The paste may be, for example, a glass frit.

Abstract: A method is disclosed for sealing a plurality of glass articles, comprising providing a first glass article comprising at least one first sealing surface, wherein the at least one first sealing surface comprises a glass comprising a copper compound, and optionally a silver compound, positioned within a portion of the glass of the first glass article; providing a second glass article comprising at least one second sealing surface; contacting at least a portion of the first sealing surface with at least a portion of the second sealing surface; and irradiating at least a portion of the first sealing surface in a manner that causes at least a portion of the first glass article and at least a portion of the second glass article to be sealed together. A fused device is also disclosed.

Abstract: A glass package is disclosed comprising a first substrate and a second substrate, where the substrates are attached in at least two locations, at least one attachment comprising a frit, and at least one attachment comprising a polymeric adhesive and wherein the frit comprises a glass portion comprising: a base component comprising and at least one absorbing component. Also disclosed is a method of sealing a light emitting display device comprising providing a light emitting layer, a first substrate and a second substrate, where a frit is deposited between the substrates and a polymeric adhesive is deposited either between the substrates or around the edge of the device, and where the frit is sealed with a radiation source and the polymeric adhesive is cured.

Abstract: A top emission, organic light emitting diode display comprises an organic light emitting diode (OLED), a first substrate having an inner surface, and a second substrate having an inner surface, wherein the OLED is sandwiched between the first substrate and the second substrate. At least one of the first substrate and the second substrate includes a pocket formed in the inner surface thereof having a depth such that a distance between the inner surface of the first substrate and the inner surface of the second substrate sufficient to reduce or eliminate the formation of optical distortions such as Newton rings in the display. Other embodiments of the display comprise a frit located between the first and second substrates having a thickness such that the distance between the inner surfaces of the first and second substrates is great enough to prevent the formation of Newton rings.