Abstract: A method for manufacturing a filled cavity between a first surface and a second surface. The steps of the method include: providing a first surface and a second surface; applying on the first surface and/or the second surface a filling material that has a carrier fluid and necking particles; providing spacer elements for defining a width of a cavity between the first and second surfaces; bringing the first and second surfaces together to deform the filling material such that at least one spacer element is held between the first and second surfaces; and removing the carrier fluid such that necking particles attach in a contact region of at least one spacer element with the first surface or the second surface to form necks.

Abstract: A computer program product or hardware description language (“HDL”) design structure in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional representation of a heat-conductive material for transferring heat from at least the second region through the optical layer to a heat sink.

Abstract: An integrated circuitry structure includes at least first and second regions. An optical layer includes optical waveguides. A heat-conductive material transfers heat from at least the second region through the optical layer to a heat sink.

Abstract: A desalination system (1) for producing a distillate from a feed liquid includes: a steam raising device (2) having a liquid section (5) and a steam section (6) which are separated by a membrane system (7); a membrane distillation device (3) having a first steam section (11) and a liquid section (12) which are separated by a wall (14) and having a second steam section (13) which is separated from the liquid section (12) by a membrane system (15); and a heat exchange device (4) having a first liquid section (21) and a second liquid section (22), which are separated by a wall (23).

Abstract: A method in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional representation of a heat-conductive material for transferring heat from at least the second region through the optical layer to a heat sink.

Abstract: An integrated circuit coupling device includes an integrated circuit package; and an optical data transmission medium connected to the integrated circuit package, and comprising a movable coolant, adapted to remove heat from the integrated circuit package, in operation.

Abstract: Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module.

Abstract: A mechanism is provided for cooling electronic components of a printed circuit board module and for supplying power to the electronic components of the printed circuit board module. The computer module comprises a printed circuit board module, wherein the electronic components are attached to a first side of the printed circuit board module, and a cooling module being attached to a second side of the printed circuit board, being arranged in parallel to the printed circuit board and having a first layer being thermally and electrically conductive. The first layer is arranged such that heat is dissipated from the printed circuit board module and that power from a power source is supplied to the electronic components of the printed circuit board module.

Abstract: An integrated circuit coupling device includes an integrated circuit package with N integrated circuit layers (L1-LN) arranged as a 3D stack; and a data transmission medium with n data transmission layers (l1-ln), wherein n?1 and N?2, and wherein the N integrated circuit layers are electrically connectable to the n data transmission layers.

Abstract: A method in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional representation of a heat-conductive material for transferring heat from at least the second region through the optical layer to a heat sink.

Abstract: Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module.

Abstract: A chip module cooling device includes two fluid circuits corresponding to inlet and outlet fluid circuits, respectively, wherein each comprises orifices and channel portions forming a tree structure, wherein branches represent the orifices, and nodes represent the channel portions, a branch linking a node to one child node only, wherein several nodes having a same parent node are sibling nodes and extends through L levels of the tree structure, with L?3, and in fluidic connection with the other of the two fluid circuits, via channel portions corresponding to leaf nodes. For each fluid circuit, channel portions corresponding to sibling nodes are parallel to each other, and are not parallel to a channel portion corresponding to a parent node of the sibling nodes; and wherein channel portions of one of the fluid circuits are parallel to and interdigitated with channel portions of the other one of the fluid circuits.

Abstract: A photovoltaic thermal hybrid solar receiver includes a thermal collector, extending in a first plane and comprising an aperture; and a photovoltaic module, configured for electrical output power delivery, comprising a photo-active area that extends in a second plane at a distance from the first plane, the photo-active area being vis-à-vis the aperture, a projection of the aperture perpendicularly to the second plane corresponding to the photo-active area.

Abstract: A method is disclosed for operating a photovoltaic thermal hybrid system having a hybrid solar receiver with a photovoltaic module, operatively coupled to the system to deliver an electrical output power for a power user, a thermal collector distinct from the photovoltaic module, wherein the photovoltaic module and/or the thermal collector are movably mounted in the system, a collector thermal storage thermally connected to the thermal collector to store heat collected at the thermal collector, and a positioning mechanism adapted to move the photovoltaic module and/or the thermal collector. The method includes instructing the positioning mechanism to move the photovoltaic module and/or the thermal collector to change a ratio of an intensity of radiation received at the photovoltaic module to an intensity of radiation received at the thermal collector.

Abstract: A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D VLSI device further comprises a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the 3D VLSI device the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the three-dimensional VLSI device, and the at least one signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A mechanism is provided for a thermal power plane that delivers power and constitutes minimal thermal resistance. The mechanism comprises a processor layer coupled, via a first set of coupling devices, to a signaling and input/output (I/O) layer and a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the mechanism, the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism. In the mechanism, the power delivery layer comprises a plurality of conductors, a plurality of insulating materials, one or more ground planes, and a plurality of through laminate vias. In the mechanism, the signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A mechanism is provided for integrated power delivery and distribution via a heat sink. The mechanism comprises a processor layer coupled to a signaling and input/output (I/O) layer via a first set of coupling devices and a heat sink coupled to the processor layer via a second set of coupling devices. In the mechanism, the heat sink comprises a plurality of grooves on one face, where each groove provides either a path for power or a path for ground to be delivered to the processor layer. In the mechanism, the heat sink is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism and the signaling and I/O layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D VLSI device further comprises a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the 3D VLSI device the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the three-dimensional VLSI device, and the at least one signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D VLSI device further comprises a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the 3D VLSI device the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the three-dimensional VLSI device, and the at least one signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: An integrated circuitry structure includes at least first and second regions. An optical layer includes optical waveguides. A heat-conductive material transfers heat from at least the second region through the optical layer to a heat sink.