Abstract: An integrated circuit coupling device includes an integrated circuit package; and an optical data transmission medium connected to the integrated circuit package, and comprising a movable coolant, adapted to remove heat from the integrated circuit package, in operation.

Abstract: An integrated circuit coupling device includes an integrated circuit package with N integrated circuit layers (L1-LN) arranged as a 3D stack; and a data transmission medium with n data transmission layers (l1-ln), wherein n?1 and N?2, and wherein the N integrated circuit layers are electrically connectable to the n data transmission layers.

Abstract: A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D VLSI device further comprises a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the 3D VLSI device the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the three-dimensional VLSI device, and the at least one signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A mechanism is provided for integrated power delivery and distribution via a heat sink. The mechanism comprises a processor layer coupled to a signaling and input/output (I/O) layer via a first set of coupling devices and a heat sink coupled to the processor layer via a second set of coupling devices. In the mechanism, the heat sink comprises a plurality of grooves on one face, where each groove provides either a path for power or a path for ground to be delivered to the processor layer. In the mechanism, the heat sink is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism and the signaling and I/O layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A mechanism is provided for a thermal power plane that delivers power and constitutes minimal thermal resistance. The mechanism comprises a processor layer coupled, via a first set of coupling devices, to a signaling and input/output (I/O) layer and a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the mechanism, the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism. In the mechanism, the power delivery layer comprises a plurality of conductors, a plurality of insulating materials, one or more ground planes, and a plurality of through laminate vias. In the mechanism, the signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A coupling element (3) and a waveguide structure (4) are deposited on a common substrate (2) of an optical component (1). The coupling element (3) serves for the optical coupling of the waveguide structures (4) to a further optical component. The coupling element (3) contains a reflecting, curved surface (31.1-31.8) for deflecting and for collimation of light which propagates between the waveguide structure 4 and the further optical component. The coupling element (3) creates a standard for interfaces between the optical component (1) and a further optical component. The manufacture of the coupling element (3) is simple and inexpensive, may be standardized and directed to large batch numbers.

Abstract: A coupling element (3) and a waveguide structure (4) are deposited on a common substrate (2) of an optical component (1). The coupling element (3) serves for the optical coupling of the waveguide structures (4) to a further optical component. The coupling element (3) contains a reflecting, curved surface (31.1-31.8) for deflecting and for collimation of light which propagates between the waveguide structure 4 and the further optical component. The coupling element (3) creates a standard for interfaces between the optical component (1) and a further optical component. The manufacture of the coupling element (3) is simple and inexpensive, may be standardized and directed to large batch numbers.