Abstract: Semiconductor Device And Method Of Producing A Semiconductor Device A semiconductor device comprises a memory cell (160) including a transistor body (150) having a top surface (111) and including a first doping area (10a) and a second doping area (10b) with a channel region (110) in between. The memory cell (160) further includes a gate electrode (3a) arranged above the channel region (110) and separated therefrom by a dielectric layer (2a). An oxide-nitride-oxide layer (66) has first portions (661) and second portions (662). The first portions (661) of the oxide-nitride-oxide layer (66) are arranged above at least parts of the first and second doping areas (10a, 10b) and are substantially parallel to the top surface (111) of the transistor body (150). The second portions (662) of the oxide-nitride-oxide layer (66) are adjacent to the gate electrode (3a) and extend in a direction not substantially parallel to the top surface (111) of the transistor body (150).

Abstract: The method aims at improving the charge confinement of the memory layer at the edges facing the regions of buried bitlines. After the deposition of the memory layer between confinement layers and the implantation of dopants for bitlines and source/drain regions, an oxidation of semiconductor material to form upper bitline isolation regions takes place. By this method, additional oxide regions are produced at the edges of the memory layer in the same oxidation step. Either a silicon layer may be deposited and reduced to sidewall spacers, which are subsequently oxidized; or recesses are etched into the memory layer and subsequently filled with semiconductor oxide.

Abstract: A method for fabricating a drain/source path is provided, in which essentially firstly a nitride layer is applied, on which a TEOS layer is then patterned. The patterning is effected in a simplified manner by virtue of the fact that the nitride layer acts as an etching stop layer during the etching away of the TEOS layer.

Abstract: Insulation regions in the manner of STI isolations, which run transversely with respect to the word lines, isolate the source/drain regions of adjacent memory cells. Metallic bit lines are applied on the top side and patterned for example along zigzag lines such that the source/drain regions of a memory transistor which are contact-connected by the bit lines are in each case electrically connected by two mutually adjacent bit lines.

Abstract: A semiconductor configuration has an active region, a metalization layer having at least one metal plane, and connecting lines between the active region and the metalization layer. The least one metal plane is embedded in an intermetal dielectric. A UV protection plane is integrated with the metalization layer. A method for fabricating such a semiconductor configuration is also provided.

Abstract: An NROM memory cell is of a planar configuration without an additional oxidation being affected for the fabrication of the bit line oxide. The ONO layer is provided as a memory layer and is disposed with a uniform thickness on the semiconductor material of the source and drain regions and of the channel region, so that the ONO layer forms not only the gate dielectric, but also the insulation of the bit lines from the word lines or the gate electrode.

Abstract: A method of operating a computer system and apparatus. The invention relates to a method of operating a computer system as well as to a computer system within which a central processing unit (1) is connected to at least two digital signal processors (3.1-3.n) in a way to permit electronic data to be exchanged between the central processing unit (1) and the respective one of the at least two digital signal processors (3.1-3.n) which, upon request, each automatically execute digital calculating tasks to be performed by the computer system. With this method, information about the workload of the at least two digital signal processors (3.1-3.n) is acquired automatically with the assistance of detector means; and subsequently calculating operations are distributed with the assistance of distributor means to the at least two digital signal processors (3.1-3.n) in response to the workload detected of the at least two digital signal processors (3.1-3.n).