Abstract: Disclosed herein are contact pads for use with integrated circuit (IC) packages. In some embodiments, a contact pad disclosed herein may be disposed on a substrate of an IC package, and may include a metal projection portion and a metal recess portion. Each of the metal projection portion and the metal recess portion may have a solder contact surface. The solder contact surface of the metal recess portion may be spaced away from the solder contact surface of the metal projection portion. Related devices and techniques are also disclosed herein, and other embodiments may be claimed.

Abstract: Disclosed herein are contact pads for use with integrated circuit (IC) packages. In some embodiments, a contact pad disclosed herein may be disposed on a substrate of an IC package, and may include a metal projection portion and a metal recess portion. Each of the metal projection portion and the metal recess portion may have a solder contact surface. The solder contact surface of the metal recess portion may be spaced away from the solder contact surface of the metal projection portion. Related devices and techniques are also disclosed herein, and other embodiments may be claimed.

Abstract: Disclosed herein are contact pads for use with integrated circuit (IC) packages. In some embodiments, a contact pad disclosed herein may be disposed on a substrate of an IC package, and may include a metal projection portion and a metal recess portion. Each of the metal projection portion and the metal recess portion may have a solder contact surface. The solder contact surface of the metal recess portion may be spaced away from the solder contact surface of the metal projection portion. Related devices and techniques are also disclosed herein, and other embodiments may be claimed.

Abstract: The invention relates to a module comprising a carrier element having a lower stiffness or a different structure in a first region than in a second region, and also comprising a component applied to the carrier element. The component and the first region are connected to one another by a wire connection covered by a material.

Abstract: An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.

Abstract: The invention relates to a module comprising a carrier element having a lower stiffness or a different structure in a first region than in a second region, and also comprising a component applied to the carrier element. The component and the first region are connected to one another by a wire connection covered by a material.

Abstract: An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.

Abstract: An electronic component and a method for fabricating it is disclosed, where the component comprises a semiconductor chips which has flip-chip contacts. These contacts are fixed on a rewiring substrate, the interspace between the rewiring substrate and the semiconductor chip being filled with a thermoplastic. The glass transition temperature of the thermoplastic is above the highest operating test temperature of the component and below the melting temperature of the solder material for external contacts.

Abstract: An electronic module contains a semiconductor chip that has flexible chip contacts. The flexible chip contacts are disposed on an uppermost metallization layer and have a dimensionally stable contact plate which is connected to contact surfaces on the uppermost metallization layer via electrically conductive components in an elastomeric embedding compound.

Abstract: An electronic module contains a semiconductor chip that has flexible chip contacts. The flexible chip contacts are disposed on an uppermost metallization layer and have a dimensionally stable contact plate which is connected to contact surfaces on the uppermost metallization layer via electrically conductive components in an elastomeric embedding compound.