Patents by Inventor Stephen B. Krasulick

Stephen B. Krasulick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10373939
    Abstract: A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: August 6, 2019
    Assignee: Skorpios Technologies, Inc.
    Inventors: Stephen B. Krasulick, John Dallesasse
  • Patent number: 10330871
    Abstract: A waveguide coupler includes a first waveguide and a second waveguide. The waveguide coupler also includes a connecting waveguide disposed between the first waveguide and the second waveguide. The connecting waveguide includes a first material having a first index of refraction and a second material having a second index of refraction higher than the first index of refraction.
    Type: Grant
    Filed: January 14, 2016
    Date of Patent: June 25, 2019
    Assignee: Skorpios Technologies, Inc.
    Inventors: Amit Mizrahi, Timothy Creazzo, Elton Marchena, Derek Van Orden, Stephen B. Krasulick
  • Publication number: 20190170944
    Abstract: A device is provided for optical mode spot size conversion to optically couple a semiconductor waveguide with an optical fiber. The device includes a waveguide comprising a waveguide taper region, which comprises a shoulder portion and a ridge portion above the shoulder portion. The ridge portion has a width that tapers to meet a width of the shoulder portion. The waveguide taper region comprises a first material. The device also has a mode converter coupled to the waveguide. The mode converter includes a plurality of stages, and each of the plurality of stages tapers in a direction similar to a direction of taper of the waveguide taper region. The mode converter is made of a second material different from the first material.
    Type: Application
    Filed: October 25, 2018
    Publication date: June 6, 2019
    Inventors: Majid Sodagar, Stephen B. Krasulick, John Zyskind, Paveen Apiratikul, Luca Cafiero
  • Publication number: 20190170572
    Abstract: A photonics system includes a transmit photonics module and a receive photonics module. The photonics system also includes a transmit waveguide coupled to the transmit photonics module, a first optical switch integrated with the transmit waveguide, and a diagnostics waveguide optically coupled to the first optical switch. The photonics system further includes a receive waveguide coupled to the receive photonics module and a second optical switch integrated with the receive waveguide and optically coupled to the diagnostics waveguide.
    Type: Application
    Filed: November 2, 2018
    Publication date: June 6, 2019
    Applicant: Skorpios Technologies, Inc.
    Inventors: Robert J. Stone, Stephen B. Krasulick
  • Publication number: 20190113680
    Abstract: A device for optical communication is described. The device comprises two transceivers integrated on one chip. A first transceiver can be used with existing optical-communication architecture. As a more advanced optical-communication architecture becomes adopted, the device can be switched from using the first transceiver to using a second transceiver to communicate using the more advanced optical-communication architecture.
    Type: Application
    Filed: October 15, 2018
    Publication date: April 18, 2019
    Applicant: Skorpios Technologies, Inc.
    Inventors: Majid Sodagar, Stephen B. Krasulick, John Zyskind, Paveen Apiratikul, Luca Cafiero
  • Patent number: 10209448
    Abstract: An integrated non-reciprocal polarization rotator comprises a substrate, a Faraday crystal, a first waveguide, and a second waveguide. The substrate has a recess extending to a predetermined depth. The Faraday crystal is mounted in the recess and optically coupled with the first waveguide and the second waveguide.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: February 19, 2019
    Assignee: Skorpios Technologies, Inc.
    Inventors: John Dallesasse, Stephen B. Krasulick
  • Patent number: 10200131
    Abstract: A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: February 5, 2019
    Assignee: Skorpios Technologies, Inc.
    Inventors: Stephen B. Krasulick, Timothy Creazzo, Kalpit Jha, Elton Marchena, Amit Mizrahi
  • Patent number: 10151627
    Abstract: A photonics system includes a transmit photonics module and a receive photonics module. The photonics system also includes a transmit waveguide coupled to the transmit photonics module, a first optical switch integrated with the transmit waveguide, and a diagnostics waveguide optically coupled to the first optical switch. The photonics system further includes a receive waveguide coupled to the receive photonics module and a second optical switch integrated with the receive waveguide and optically coupled to the diagnostics waveguide.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: December 11, 2018
    Assignee: Skorpios Technologies, Inc.
    Inventors: Robert J. Stone, Stephen B. Krasulick
  • Publication number: 20180348432
    Abstract: A method of fabricating a waveguide mode expander includes providing a substrate including a waveguide, bonding a chiplet including multiple optical material layers in a mounting region adjacent an output end of the waveguide, and selectively removing portions of the chiplet to form tapered stages that successively increase in number and lateral size from a proximal end to a distal end of the chiplet. The first optical material layer supports an input mode substantially the same size as a mode exiting the waveguide. One or more of the overlying layers, when combined with the first layer, support a larger, output optical mode size. Each tapered stage of the mode expander is formed of a portion of a respective layer of the chiplet. The first layer and the tapered stages form a waveguide mode expander that expands an optical mode of light traversing the chiplet.
    Type: Application
    Filed: May 1, 2018
    Publication date: December 6, 2018
    Inventors: Damien Lambert, Guoliang Li, John Zyskind, Stephen B. Krasulick
  • Publication number: 20180331765
    Abstract: A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power.
    Type: Application
    Filed: April 6, 2018
    Publication date: November 15, 2018
    Inventors: Stephen B. Krasulick, Timothy Creazzo, Kalpit Jha, Elton Marchena, Amit Mizrahi
  • Patent number: 10126501
    Abstract: A reflective structure includes an input/output port and an optical splitter coupled to the input/output port. The optical splitter has a first branch and a second branch. The reflective structure also includes a first resonant cavity optically coupled to the first branch of the optical splitter. The first resonant cavity comprises a first set of reflectors and a first waveguide region disposed between the first set of reflectors. The reflective structures further includes a second resonant cavity optically coupled to the second branch of the optical splitter. The second resonant cavity comprises a second set of reflectors and a second waveguide region disposed between the second set of reflectors.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: November 13, 2018
    Assignee: Skorpios Technologies, Inc.
    Inventors: Derek Van Orden, Amit Mizrahi, Timothy Creazzo, Stephen B. Krasulick
  • Publication number: 20180308834
    Abstract: Fabricating a multilevel composite semiconductor structure includes providing a first substrate comprising a first material; dicing a second substrate to provide a plurality of dies; mounting the plurality of dies on a third substrate; joining the first substrate and the third substrate to form a composite structure; and joining a fourth substrate and the composite structure.
    Type: Application
    Filed: February 20, 2018
    Publication date: October 25, 2018
    Inventors: Stephen B. Krasulick, Timothy Creazzo, Elton Marchena, John Dallesasse
  • Publication number: 20180164500
    Abstract: A reflective structure includes an input/output port and an optical splitter coupled to the input/output port. The optical splitter has a first branch and a second branch. The reflective structure also includes a first resonant cavity optically coupled to the first branch of the optical splitter. The first resonant cavity comprises a first set of reflectors and a first waveguide region disposed between the first set of reflectors. The reflective structures further includes a second resonant cavity optically coupled to the second branch of the optical splitter. The second resonant cavity comprises a second set of reflectors and a second waveguide region disposed between the second set of reflectors.
    Type: Application
    Filed: October 30, 2017
    Publication date: June 14, 2018
    Applicant: Skorpios Technologies, Inc.
    Inventors: Derek Van Orden, Amit Mizrahi, Timothy Creazzo, Stephen B. Krasulick
  • Patent number: 9977188
    Abstract: A method of fabricating a waveguide mode expander includes providing a substrate including a waveguide, bonding a chiplet including multiple optical material layers in a mounting region adjacent an output end of the waveguide, and selectively removing portions of the chiplet to form tapered stages that successively increase in number and lateral size from a proximal end to a distal end of the chiplet. The first optical material layer supports an input mode substantially the same size as a mode exiting the waveguide. One or more of the overlying layers, when combined with the first layer, support a larger, output optical mode size. Each tapered stage of the mode expander is formed of a portion of a respective layer of the chiplet. The first layer and the tapered stages form a waveguide mode expander that expands an optical mode of light traversing the chiplet.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: May 22, 2018
    Assignee: Skorpios Technologies, Inc.
    Inventors: Damien Lambert, Guoliang Li, John Zyskind, Stephen B. Krasulick
  • Patent number: 9960854
    Abstract: A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: May 1, 2018
    Assignee: Skorpios Technologies, Inc.
    Inventors: Stephen B. Krasulick, Timothy Creazzo, Kalpit Jha, Elton Marchena, Amit Mizrahi
  • Patent number: 9923105
    Abstract: A method for fabricating a photonic composite device for splitting functionality across materials comprises providing a composite device having a platform and a chip bonded in the platform. The chip is processed comprising patterning, etching, deposition, and/or other processing steps while the chip is bonded to the platform. The chip is used as a gain medium and the platform is at least partially made of silicon.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: March 20, 2018
    Assignee: Skorpios Technologies, Inc.
    Inventors: Stephen B. Krasulick, John Dallesasse, Amit Mizrahi, Timothy Creazzo, Elton Marchena, John Y. Spann
  • Patent number: 9922967
    Abstract: Fabricating a multilevel composite semiconductor structure includes providing a first substrate comprising a first material; dicing a second substrate to provide a plurality of dies; mounting the plurality of dies on a third substrate; joining the first substrate and the third substrate to form a composite structure; and joining a fourth substrate and the composite structure.
    Type: Grant
    Filed: September 23, 2015
    Date of Patent: March 20, 2018
    Assignee: SKORPIOS TECHNOLOGIES, INC.
    Inventor: Stephen B. Krasulick
  • Patent number: 9917417
    Abstract: A widely tunable laser system includes a substrate, first and second lasers, an output and at least one optical combining device. The first laser is integrated with the substrate, includes a gain medium that includes a first material, and emits light at a wavelength that is tunable within a first wavelength range that is determined at least in part by the first material. The second laser is integrated with the substrate, includes a gain medium that includes a second material, and emits light at a wavelength that is tunable within a second wavelength range that is different from the first wavelength range that is determined at least in part by the second material. The at least one optical combining device is configured to direct light from one or both of the first laser and the second laser to the output.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: March 13, 2018
    Assignee: Skorpios Technologies, Inc.
    Inventors: Guoliang Li, Stephen B. Krasulick, Damien Lambert
  • Publication number: 20180067343
    Abstract: A modulator and a capacitor are integrated on a semiconductor substrate for modulating a laser beam. Integrating the capacitor on the substrate reduces parasitic inductance for high-speed optical communication.
    Type: Application
    Filed: July 21, 2017
    Publication date: March 8, 2018
    Applicant: Skorpios Technologies, Inc.
    Inventors: Stephen B. Krasulick, Damien Lambert, Andrew Bonthron, Guoliang Li
  • Publication number: 20180052283
    Abstract: A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.
    Type: Application
    Filed: June 26, 2017
    Publication date: February 22, 2018
    Applicant: Skorpios Technologies, Inc.
    Inventors: Stephen B. Krasulick, John Dallesasse