Abstract: The disclosed technology generally relates to electrical overstress protection devices, and more particularly to electrical overstress monitoring devices for detecting electrical overstress events in semiconductor devices. In one aspect, an electrical overstress monitor and/or protection device includes a two different conductive structures configured to electrically are in response to an EOS event and a sensing circuit configured to detect a change in a physical property of the two conductive structures caused by the EOS event.

Abstract: A memory device comprising a memory array including memory cells to store memory data, error correcting code (ECC) circuitry configured to generate ECC data and use the ECC data to detect errors in the memory data, and an ECC circuitry checker. The ECC circuitry checker is configured to substitute the ECC data with check ECC data, compare an output of the ECC circuitry to an expected output when the substituted check ECC data is applied to the ECC circuitry, and generate an alert when the comparing indicates an error in the ECC circuitry.

Abstract: Aspects of the present disclosure include using particles in phase change materials to track temperature change of an object. The particles may be initially disposed at specific locations within the phase change materials. As the phase change materials transition from the solid state to the fluid state, the particles may move from the initial locations to different locations. The change in locations of the particles may be detected magnetically, electrically, optically, and/or visually. Such change may indicate that the object experienced a temperate above at least one phase transition temperature of the phase change materials.

Abstract: Aspects of the present disclosure include using particles in phase change materials to track temperature change of an object. The particles may be initially disposed at specific locations within the phase change materials. As the phase change materials transition from the solid state to the fluid state, the particles may move from the initial locations to different locations. The change in locations of the particles may be detected magnetically, electrically, optically, and/or visually. Such change may indicate that the object experienced a temperate above at least one phase transition temperature of the phase change materials.

Abstract: Aspects of the present disclosure include using particles in phase change materials to track temperature change of an object. The particles may be initially disposed at specific locations within the phase change materials. As the phase change materials transition from the solid state to the fluid state, the particles may move from the initial locations to different locations. The change in locations of the particles may be detected magnetically, electrically, optically, and/or visually. Such change may indicate that the object experienced a temperate above at least one phase transition temperature of the phase change materials.

Abstract: Aspects of the present disclosure include using particles in phase change materials to track temperature change of an object. The particles may be initially disposed at specific locations within the phase change materials. As the phase change materials transition from the solid state to the fluid state, the particles may move from the initial locations to different locations. The change in locations of the particles may be detected magnetically, electrically, optically, and/or visually. Such change may indicate that the object experienced a temperate above at least one phase transition temperature of the phase change materials.

Abstract: Aspects of the present disclosure include using particles in phase change materials to track temperature change of an object. The particles may be initially disposed at specific locations within the phase change materials. As the phase change materials transition from the solid state to the fluid state, the particles may move from the initial locations to different locations. The change in locations of the particles may be detected magnetically, electrically, optically, and/or visually. Such change may indicate that the object experienced a temperate above at least one phase transition temperature of the phase change materials.

Abstract: A memory device comprising a memory array including memory cells to store memory data, error correcting code (ECC) circuitry configured to generate ECC data and use the ECC data to detect errors in the memory data, and an ECC circuitry checker. The ECC circuitry checker is configured to substitute the ECC data with check ECC data, compare an output of the ECC circuitry to an expected output when the substituted check ECC data is applied to the ECC circuitry, and generate an alert when the comparing indicates an error in the ECC circuitry.

Abstract: Disclosed herein are systems and methods executing a server that perform various processes for generating alerts containing various data fields indicating threats of fraud or attempts to penetrate an enterprise network. Analyst computers may query and fetch alerts from a database, and then present the alerts to be addressed by an analyst according to the priority level of the respective alerts.

Abstract: Disclosed herein are systems and methods executing a server that perform various processes for generating alerts containing various data fields indicating threats of fraud or attempts to penetrate an enterprise network. Analyst computers may query and fetch alerts from a database, and then present the alerts to be addressed by an analyst according to the priority level of the respective alerts.

Abstract: A displacement sensor has a graded index multi-mode fiber with a length that is an odd multiple of a quarter pitch length of the graded index multi-mode fiber and a single-mode optical fiber fusion spliced to the first end of said graded index multi-mode fiber. A reflective mirror coating is applied to a planar facet on the second end of said graded index multi-mode fiber. A plurality of mechanical attachments are spaced along the graded index multi-mode fiber and single-mode optical fiber that mechanically deform said graded index multi-mode fiber, when any one of said plurality of mechanical attachments is displaced relative to any other one of said plurality of mechanical attachments.

Abstract: A personal protection apparatus includes a wearable covering, a reservoir supported on the wearable covering and containing a sprayable fluid and includes a valve operable to control the flow of fluid from the reservoir. The apparatus further includes a circuit having a force-sensing resistor for actuating the valve. The force-sensing resistor is disposed on a thumb covering and is activated under pressure when the wearer's thumb is positioned between the index finger and middle finger. Pressure on the force-sensing resistor decreased its resistance in the circuit. With the resistance lowered, current is allowed to flow and a power supply powers a servomotor coupled to a cam that opens a valve to allow fluid to be sprayed.

Abstract: Using a local-potential-driving probe drives a conductor to a known potential while adjacent lines are grounded through the sample body reduces electrostatic scanning microscope signal from adjacent lines, allows imaging of metal lines deeper in the sample. Providing different potentials locally on different conductive lines using multiple local-potential-driving probes allows different conductors to be highlighted in the same image, for example, by changing the phase of the signal being applied to the different local-potential-driving probes.

Abstract: A SPM head incorporates a probe and a cantilever on which the probe is mounted. The cantilever has a planar reflecting surface proximate a free end of the cantilever. The cantilever extends from a mechanical mount and a single-mode optical fiber is supported by the mechanical mount to provide a beam. A micromirror is mounted to reflect the beam substantially 90° to the planar reflecting surface.

Abstract: Systems, machines, and methods for monitoring wafer handling are disclosed herein. A system for monitoring wafer handling includes a sensor and a controller. The sensor is capable of being secured to an assembled wafer handling machine. The controller is in electronic communication with the sensor and includes control logic. The control logic is configured to store a reference output of the sensor when the wafer handling machine is aligned and is configured to generate an indication signal when a difference between the reference output and a current output of the sensor exceeds a threshold.

Abstract: Using a local-potential-driving probe drives a conductor to a known potential while adjacent lines are grounded through the sample body reduces electrostatic scanning microscope signal from adjacent lines, allows imaging of metal lines deeper in the sample. Providing different potentials locally on different conductive lines using multiple local-potential-driving probes allows different conductors to be highlighted in the same image, for example, by changing the phase of the signal being applied to the different local-potential-driving probes.

Abstract: Automated mechanical handling systems (AMHS) for integrated circuit fabrication, system computers programmed for use in the AMHSs, and methods of handling a wafer carrier having an inlet port and an outlet port are provided. An exemplary method of handling the wafer carrier includes providing a plurality of carrier storage positions that are adapted to receive the wafer carrier. The carrier storage positions include a presence sensor and a gas nozzle. The wafer carrier is loaded into one of the carrier storage positions. The presence of the wafer carrier in the carrier storage position is sensed with the presence sensor. A malfunction in gas flow through the inlet port is identified in the carrier storage position that contains the wafer carrier. The wafer carrier is relocated to another carrier storage position in response to identifying the malfunction.

Abstract: A SPM head incorporates a probe and a cantilever on which the probe is mounted. The cantilever has a planar reflecting surface proximate a free end of the cantilever. The cantilever extends from a mechanical mount and a single-mode optical fiber is supported by the mechanical mount to provide a beam. A micromirror is mounted to reflect the beam substantially 90° to the planar reflecting surface.

Abstract: A SPM head incorporates a probe and a cantilever on which the probe is mounted. The cantilever has a planar reflecting surface proximate a free end of the cantilever. The cantilever extends from a mechanical mount and a single-mode optical fiber is supported by the mechanical mount to provide a beam axis at an angle away from normal relative to the reflecting surface.