Abstract: A structure for locating a fault in a semiconductor chip. The chip includes a substrate on a dielectric interconnect. A first electrical response image of the chip, which includes a spot representing the fault, is overlayed on a first reflection image for monochromatic light in an optical path from an optical microscope through a SIL/NAIL and into the chip. The index of refraction of the substrate exceeds that of the dielectric interconnect and is equal to that of the SIL/NAIL. A second electrical response image of the chip is overlayed on a second reflection image for the monochromatic light in an optical path in which an optical stop prevents all subcritical angular components of the monochromatic light from being incident on the SIL/NAIL. If the second electrical response image includes or does not include the spot, then the fault is in the substrate or the dielectric interconnect, respectively.

Abstract: A method and apparatus for measuring nip width in an image production device is disclosed. The method may include receiving a signal to measure the nip width, the nip width being the distance of an arc length created by an intersection of a fuser roll and a pressure roll, positioning a nip width measuring device into the nip, measuring the nip width, determining if the measured nip width meets a required nip width, wherein if the measured nip width does not meet the required nip width, adjusting the nip width.

Abstract: A structure for locating a fault in a semiconductor chip. The chip includes a substrate on a dielectric interconnect. A first electrical response image of the chip, which includes a spot representing the fault, is overlayed on a first reflection image for monochromatic light in an optical path from an optical microscope through a SIL/NAIL and into the chip. The index of refraction of the substrate exceeds that of the dielectric interconnect and is equal to that of the SIL/NAIL. A second electrical response image of the chip is overlayed on a second reflection image for the monochromatic light in an optical path in which an optical stop prevents all subcritical angular components of the monochromatic light from being incident on the SIL/NAIL. If the second electrical response image includes or does not include the spot, then the fault is in the substrate or the dielectric interconnect, respectively.

Abstract: An apparatus (100) and method (300) that adjusts a fuser nip width in an apparatus that can include a fuser member having a fuser nip configured to fuse an image on media is disclosed. The method can include feeding (320) a media sheet in a media sheet travel direction through the fuser nip. The method can also include sensing (330) a media sheet exit temperature of the media sheet after the media sheet exits the fuser nip. The method can also include adjusting (340) a fuser member nip width according to the sensed media sheet exit temperature, where the fuser nip width is substantially parallel to the media sheet travel direction.

Abstract: A method and structure for locating a fault in a semiconductor chip. The chip includes a substrate on a dielectric interconnect. A first electrical response image of the chip, which includes a spot representing the fault, is overlayed on a first reflection image for monochromatic light in an optical path from an optical microscope through a SIL/NAIL and into the chip. The index of refraction of the substrate exceeds that of the dielectric interconnect and is equal to that of the SIL/NAIL. A second electrical response image of the chip is overlayed on a second reflection image for the monochromatic light in an optical path in which an optical stop prevents all subcritical angular components of the monochromatic light from being incident on the SIL/NAIL. If the second electrical response image includes or does not include the spot, then the fault is in the substrate or the dielectric interconnect, respectively.

Abstract: Apparatuses useful for printing and methods for stripping media from surfaces in apparatuses useful for printing are disclosed. An apparatus useful for printing including a first member including a first outer surface; a second member including a second outer surface; a belt including an inner surface and an outer surface; a first nip formed by contact between the inner surface of the belt and the second outer surface and contact between the outer surface of the belt and the first outer surface; and a stripping mechanism including a stripping member disposed internal to the belt. The stripping member is positionable relative to the first nip to vary a pressure applied by the outer surface of the belt against the first outer surface downstream from the first nip. The media are stripped from the outer surface of the belt after exiting from the first nip.

Abstract: A semiconductor wafer resting on a contact element has a spatially distributed force applied to its frontside and an equal and opposing force applied to its backside. The contact element comprises a solid immersion lens (SIL), and has an area less than the area of the wafer, but no less than the larger of the area of an optical collection area and an electrical probe assembly. The equal and opposing forces cause the wafer to conform to the shape of the contact element. Measurements, including electrical testing, optical probing and wafer characterization are performed on the wafer.

Abstract: Apparatuses useful for printing and methods for stripping media from surfaces in apparatuses useful for printing are disclosed. An apparatus useful for printing comprising a first member including a first outer surface; a second member including a second outer surface; a belt including an inner surface and an outer surface; a first nip formed by contact between the inner surface of the belt and the second outer surface and contact between the outer surface of the belt and the first outer surface; and a stripping mechanism comprising a stripping member disposed internal to the belt. The stripping member is positionable relative to the first nip to vary a pressure applied by the outer surface of the belt against the first outer surface downstream from the first nip. The media are stripped from the outer surface of the belt after exiting from the first nip.

Abstract: An apparatus (100) and method (300) that adjusts a fuser nip width in an apparatus that can include a fuser member having a fuser nip configured to fuse an image on media is disclosed. The method can include feeding (320) a media sheet in a media sheet travel direction through the fuser nip. The method can also include sensing (330) a media sheet exit temperature of the media sheet after the media sheet exits the fuser nip. The method can also include adjusting (340) a fuser member nip width according to the sensed media sheet exit temperature, where the fuser nip width is substantially parallel to the media sheet travel direction.

Abstract: A method and apparatus for measuring nip width in an image production device is disclosed. The method may include receiving a signal to measure the nip width, the nip width being the distance of an arc length created by an intersection of the fuser roll and the pressure roll, positioning a nip width measuring device into the nip, measuring the nip width, determining if the measured nip width meets a required nip width, wherein if the measured nip width does not meet the required nip width, adjusting the nip width.

Abstract: A method and structure for locating a fault in a semiconductor chip. The chip includes a substrate on a dielectric interconnect. A first electrical response image of the chip, which includes a spot representing the fault, is overlayed on a first reflection image for monochromatic light in an optical path from an optical microscope through a SIL/NAIL and into the chip. The index of refraction of the substrate exceeds that of the dielectric interconnect and is equal to that of the SIL/NAIL. A second electrical response image of the chip is overlayed on a second reflection image for the monochromatic light in an optical path in which an optical stop prevents all subcritical angular components of the monochromatic light from being incident on the SIL/NAIL. If the second electrical response image includes or does not include the spot, then the fault is in the substrate or the dielectric interconnect, respectively.

Abstract: The present invention relates to a drink sleeve that includes a first layer, a second layer and a tab. The first layer includes a top end, a bottom end and lateral edges. The second layer also includes a top end, a bottom end and lateral edges. The lateral edges of the first layer are bonded to the lateral edges of the second layer such that a pocket is formed between the first and second layers. The pocket is adapted to receive a beverage container that is inserted between the top ends of the first and second layers. The tab extends between the bottom end of the first layer and the bottom end of the second layer. The tab includes a fold which unfolds as the beverage container is inserted into the pocket. Once the beverage container is fully inserted into the pocket, the tab forms a coaster.

Abstract: An improved footrest for motorcycles featuring a recessed planar area to accept and support the heel of rider footwear. A raised lip bordering the recessed area serves to retain secure placement of heel within said recess. The footrest body is counter bored to accept existing mount hardware appropriate to application and secured by a bolt passing through the counter bore into mount hardware. Angular orientation is secured by a plurality of set screws in the footrest body positioned to seat on mount hardware.

Abstract: A predistortion arrangement is described for using an input signal to drive a nonlinear device having a drive input. Initially, first means sample a portion of the input signal. The sampled portion of the input signal is introduced to at least one predistortion path including a mixer responsive to the sampled portion of the input signal for producing at least second order intermodulation products of the input signal. The second order intermodulation products are conditioned. Combining means then combine the conditioned second order intermodulation products with the sampled input signal in a way which produces a predistorted drive signal compensated for second order distortion for use in driving the drive input of the nonlinear device. In one aspect, the sampling means and the combining means may be provided using resistive networks. The use of the resistive networks eliminates the need for directional couplers incorporating magnetic components.

Abstract: A drywall installation apparatus includes a support for holding a piece of drywall to be installed on a stud wall, an extension to adjust the length of the drywall installation apparatus, and a base to which a lifting mechanism may be coupled to raise the drywall installation apparatus and the piece of drywall being supported into a desired position for installation on a stud wall. The drywall installation apparatus further includes an alignment member to assist in orienting properly the piece of sheetrock to be installed on the stud wall.