Patents by Inventor Stephen Chee Wong

Stephen Chee Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070105342
    Abstract: A method of simultaneously bonding components, comprising the following steps. At least first, second and third components are provided and comprise: at least one glass component; and at least one conductive or semiconductive material component. The order of stacking of the components is determined to establish interfaces between the adjacent components. A hydrogen-free amorphous film is applied to one of the component surfaces at each interface comprising an adjacent: glass component; and conductive or semiconductive component. A sol gel with or without alkaline ions film is applied to one of the component surfaces at each interface comprising an adjacent: conductive or semiconductive component; and conductive or semiconductive component. The components are simultaneously anodically bonded in the determined order of stacking.
    Type: Application
    Filed: December 21, 2006
    Publication date: May 10, 2007
    Inventors: Jun Wei, Stephen Chee Wong, Yongling Wu, Fern Ng
  • Publication number: 20060286388
    Abstract: A bonded component structure comprising the following. A first ceramic component having a first conductive layer thereover. An intermediate film over the first conductive layer. A second ceramic component having a second conductive layer is formed thereover anodically bonded to the first ceramic component wherein the second conductive layer opposes the intermediate film. At least one transition layer upon at least one of the first and second ceramic components.
    Type: Application
    Filed: August 23, 2006
    Publication date: December 21, 2006
    Inventors: Jun Wei, Stephen Chee Wong, Sharon Nai