Abstract: A novel specimen holder for specimen support specimen support devices for insertion in electron microscopes is provided. The novel specimen holder of the invention provides mechanical support for specimen support devices and as well as electrical contacts to the specimens or specimen support devices.

Abstract: Electron microscope support structures and methods of making and using same. The support structures are generally constructed using semiconductor materials and semiconductor manufacturing processes. The temperature of the support structure may be controlled and/or gases or liquids may be confined in the observation region for reactions and/or imaging.

Abstract: A novel specimen holder for specimen support devices for insertion in electron microscopes. The novel specimen holder of the invention provides mechanical support for specimen support devices and as well as electrical contacts to the specimens or specimen support devices.

Abstract: A novel specimen holder for specimen support devices for insertion in electron microscopes. The novel specimen holder of the invention provides mechanical support for specimen support devices and as well as electrical contacts to the specimens or specimen support devices.

Abstract: A novel sample holder for specimen support devices for insertion in electron microscopes. The novel sample holder of the invention allows for the introduction of gases or liquids to specimens for in situ imaging, as well as electrical contacts for electrochemical or thermal experiments.

Abstract: A novel specimen holder for specimen support specimen support devices for insertion in electron microscopes is provided. The novel specimen holder of the invention provides mechanical support for specimen support devices and as well as electrical contacts to the specimens or specimen support devices.

Abstract: A novel sample holder for specimen support devices for insertion in electron microscopes. The novel sample holder of the invention allows for the introduction of gases or liquids to specimens for in situ imaging, as well as electrical contacts for electrochemical or thermal experiments.

Abstract: A novel specimen holder for specimen support devices for insertion in electron microscopes. The novel specimen holder of the invention provides mechanical support for specimen support devices and as well as electrical contacts to the specimens or specimen support devices.

Abstract: A novel specimen holder for specimen support specimen support devices for insertion in electron microscopes. The novel specimen holder of the invention provides mechanical support for specimen support devices and as well as electrical contacts to the specimens or specimen support devices.

Abstract: A novel specimen holder for specimen support specimen support devices for insertion in electron microscopes. The novel specimen holder of the invention provides mechanical support for specimen support devices and as well as electrical contacts to the specimens or specimen support devices.

Abstract: A novel specimen holder for specimen support devices for insertion in electron microscopes. The novel specimen holder of the invention provides mechanical support for specimen support devices and as well as electrical contacts to the specimens or specimen support devices.

Abstract: Electron microscope support structures and methods of making and using same. The support structures are generally constructed using semiconductor materials and semiconductor manufacturing processes. The temperature of the support structure may be controlled and/or gases or liquids may be confined in the observation region for reactions and/or imaging.

Abstract: Devices, mounts, stages, interfaces and systems to be developed that allow for in situ manipulation, experimentation and analysis of specimens directly within an electron microscope.

Abstract: The present invention is directed generally to templates used in the creation of thin-film replicas, for example, the creation of thin films, such as carbon films, for use as specimen support in electron-beam specimen analysis. More specifically, the present invention is directed to novel reusable patterned templates, the methodology of making these reusable templates, the templates made from such methodologies, the use and reuse of these templates to make thin films of any type for any purpose, and the thin films made from these templates. A feature of the novel template of the present invention is in its employment of one or more zones of discontinuity, or undercuts, associated with the patterns transferred into the template to allow for the removal of the thin film from the template without sacrificing the structural integrity of the template to prevent at least one re-use of the template.

Abstract: A sample support structure comprising a sample support manufactured from a semiconductor material and having one or more openings therein. Methods of making and using the sample support structure.

Abstract: A sample support structure with integrated support features and methods of making and using the reinforced membrane. The sample support structures are useful for supporting samples for analysis using microscopic techniques, such as electron microscopy, optical microscopy, x-ray microscopy, UV-VIS spectroscopy and nuclear magnetic resonance (NMR) techniques.

Abstract: The present invention is directed generally to templates used in the creation of thin-film replicas, for example, the creation of thin films, such as carbon films, for use as specimen support in electron-beam specimen analysis. More specifically, the present invention is directed to novel reusable patterned templates, the methodology of making these reusable templates, the templates made from such methodologies, the use and reuse of these templates to make thin films of any type for any purpose, and the thin films made from these templates. A feature of the novel template of the present invention is in its employment of one or more zones of discontinuity, or undercuts, associated with the patterns transferred into the template to allow for the removal of the thin film from the template without sacrificing the structural integrity of the template to prevent at least one re-use of the template.

Abstract: Microelectronic packages include a first microelectronic substrate having a first face and a first AC-coupled interconnect element on the first face. A second microelectronic substrate includes a second face and a second AC-coupled interconnect element on the second face. A buried solder bump extends between the first and second faces, and is at least partially buried beneath the first and/or second faces, to maintain the first and second AC-coupled interconnect elements in closely spaced apart relation. The buried solder bump also may couple DC power between the first and second substrates. Other technologies also may be used to maintain the AC-coupled interconnect elements in closely spaced apart relation and to couple DC power between the substrates. The first and second AC-coupled interconnect elements may be first and second capacitor plates, first and second inductors and/or first and second combined inductive and capacitive elements.

Abstract: Microelectronic packages include a first microelectronic substrate having a first face and a first AC-coupled interconnect element on the first face. A second microelectronic substrate includes a second face and a second AC-coupled interconnect element on the second face. A buried solder bump extends between the first and second faces, and is at least partially buried beneath the first and/or second faces, to maintain the first and second AC-coupled interconnect elements in closely spaced apart relation. The buried solder bump also may couple DC power between the first and second substrates. Other technologies also may be used to maintain the AC-coupled interconnect elements in closely spaced apart relation and to couple DC power between the substrates. The first and second AC-coupled interconnect elements may be first and second capacitor plates, first and second inductors and/or first and second combined inductive and capacitive elements.

Abstract: Microelectronic packages include a first microelectronic substrate having a first face and a first AC-coupled interconnect element on the first face. A second microelectronic substrate includes a second face and a second AC-coupled interconnect element on the second face. A buried solder bump extends between the first and second faces, and is at least partially buried beneath the first and/or second faces, to maintain the first and second AC-coupled interconnect elements in closely spaced apart relation. The buried solder bump also may couple DC power between the first and second substrates. Other technologies also may be used to maintain the AC-coupled interconnect elements in closely spaced apart relation and to couple DC power between the substrates. The first and second AC-coupled interconnect elements may be first and second capacitor plates, first and second inductors and/or first and second combined inductive and capacitive elements.