Patents by Inventor Stephen J. Whitney
Stephen J. Whitney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10325739Abstract: A circuit protection device including a housing defining a chamber and a metal oxide varistor (MOV) stack disposed within the chamber. A first spring is electrically attached at a first end to a first input terminal of the MOV stack by a solder connection and at a second end to a first input line. The first spring is biased away from the first input terminal. A second spring is electrically attached to a second input terminal of the MOV stack by a solder connection and at a second end to a second input line. The second conductive spring is biased away from the second input terminal. When an overvoltage condition occurs, heat generated by the MOV stack melts at least one of the first or second solder connections to allow the corresponding springs to be displaced away from the respective MOV stack input terminals.Type: GrantFiled: January 10, 2018Date of Patent: June 18, 2019Assignee: LITTELFUSE, INC.Inventors: Wen Yang, Hailang Tang, Huawei Yin, Stephen J. Whitney, G. Todd Dietsch
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Patent number: 10062530Abstract: A circuit protection device including a housing (15) defining a chamber (19) and a metal oxide varistor (MOV) stack (310) disposed within the chamber (19). A first spring (330a) is electrically attached at a first end to a first input terminal (311a) of the MOV stack (310) by a solder connection (30) and at a second end to a first input line (20a). The first spring (330a) is biased away from the first input terminal (311a). A second spring (330b) is electrically attached to a second input terminal (311b) of the MOV stack (310) by a solder connection (40) and at a second end to a second input line (20b). The second conductive spring (330b) is biased away from the second input terminal (311b). When an overvoltage condition occurs, heat generated by the MOV stack (310) melts at least one of the first or second solder connections (30, 40) to allow the corresponding springs to be displaced away from the respective MOV stack (310) input terminals (311 a, 311 b), thereby creating an opening circuit.Type: GrantFiled: October 26, 2012Date of Patent: August 28, 2018Assignee: DONGGUAN LITTELFUSE ELECTRONICS CO., LTD.Inventors: Wen Yang, Hailang Tang, Huawei Yin, Stephen J. Whitney, G. Todd Dietsch
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Publication number: 20180130624Abstract: A circuit protection device including a housing defining a chamber and a metal oxide varistor (MOV) stack disposed within the chamber. A first spring is electrically attached at a first end to a first input terminal of the MOV stack by a solder connection and at a second end to a first input line. The first spring is biased away from the first input terminal. A second spring is electrically attached to a second input terminal of the MOV stack by a solder connection and at a second end to a second input line. The second conductive spring is biased away from the second input terminal. When an overvoltage condition occurs, heat generated by the MOV stack melts at least one of the first or second solder connections to allow the corresponding springs to be displaced away from the respective MOV stack input terminals, thereby creating an opening circuit.Type: ApplicationFiled: January 10, 2018Publication date: May 10, 2018Applicant: Littelfuse, Inc.Inventors: Wen Yang, Hailang Tang, Huawei Yin, Stephen J. Whitney, G. Todd Dietsch
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Patent number: 9443688Abstract: A fuse in one embodiment includes first and second leads. A fuse element provides electrical communication between the first and second leads. The fuse element includes a material with a melting point of less than 250.degree. C. and acts as both an overcurrent fuse and a thermal fuse by melting when subjected to a predetermined current or upon reaching a predetermined temperature. A body houses the fuse element and portions of the first and second leads.Type: GrantFiled: August 8, 2012Date of Patent: September 13, 2016Assignee: LITTELFUSE, INC.Inventors: Stephen J. Whitney, John E. C. Semana, Jamica P. Bato, Francisco De Guia, Bienvenido Salonga
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Publication number: 20150228429Abstract: A circuit protection device including a housing (15) defining a chamber (19) and a metal oxide varistor (MOV) stack (310) disposed within the chamber (19). A first spring (330a) is electrically attached at a first end to a first input terminal (311a) of the MOV stack (310) by a solder connection (30) and at a second end to a first input line (20a). The first spring (330a) is biased away from the first input terminal (311a). A second spring (330b) is electrically attached to a second input terminal (311b) of the MOV stack (310) by a solder connection (40) and at a second end to a second input line (20b). The second conductive spring (330b) is biased away from the second input terminal (311b). When an overvoltage condition occurs, heat generated by the MOV stack (310) melts at least one of the first or second solder connections (30, 40) to allow the corresponding springs to be displaced away from the respective MOV stack (310) input terminals (311 a, 311 b), thereby creating an opening circuit.Type: ApplicationFiled: October 26, 2012Publication date: August 13, 2015Applicant: LITTELFUSE, INC.Inventors: Wen Yang, Hailang Tang, Huawei Yin, Stephen J. Whitney, G. Todd Dietsch
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Patent number: 8937524Abstract: A surface mount fuse in one embodiment includes an insulative body, first and second conductive and caps attached to the insulative body, each end cap defining an aperture, and a fuse element extending (i) through the insulative body and the apertures and (ii) along outside surfaces of the first and second conductive end caps in such a way that solder used to attach the first and second conductive end caps to an external medium also fastens the fuse element to the first and second end caps.Type: GrantFiled: March 25, 2009Date of Patent: January 20, 2015Assignee: Littelfuse, Inc.Inventors: Conrado de Leon, Gordon T. Dietsch, Edgardo Olan, John Emannuel Semana, John Song, Stephen J. Whitney
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Publication number: 20140368309Abstract: A circuit protection device, including a conductor connected to first and second terminals and a spring exerting force on the conductor to move the conductor away from the first and/or second terminals when an over-voltage or over-temperature condition occurs within a charging circuit. One or more heat generating resistive elements melts material associated with one or more connection points of the conductor thereby releasing the conductor such that the spring moves the conductor to create an open circuit.Type: ApplicationFiled: June 18, 2013Publication date: December 18, 2014Applicant: LITTELFUSE, INC.Inventors: G. Todd Dietsch, Olga Spaldon-Stewart, Stephen J. Whitney
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Patent number: 8525633Abstract: A fuse element includes a substrate disposed between first and second terminals. The substrate includes an electrically insulative material. A conductive film is disposed on a first surface of the substrate and in electrical contact with the first terminal and second terminals.Type: GrantFiled: April 17, 2009Date of Patent: September 3, 2013Assignee: Littelfuse, Inc.Inventors: Stephen J. Whitney, William Travis, Jeffrey P. Youngblood, Sarah M. Book, Edward D. Barriball, Milea J. Kittle
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Publication number: 20120299692Abstract: A fuse in one embodiment includes first and second leads. A fuse element provides electrical communication between the first and second leads. The fuse element includes a material with a melting point of less than 250.degree. C. and acts as both an overcurrent fuse and a thermal fuse by melting when subjected to a predetermined current or upon reaching a predetermined temperature.Type: ApplicationFiled: August 8, 2012Publication date: November 29, 2012Applicant: LITTELFUSE, INC.Inventors: Stephen J. Whitney, John E.C. Semana, Jamica P. Bato, Francisco De Guia, Bienvenido Salonga
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Patent number: 8289123Abstract: A fused conductor includes a first conductor portion, a second conductor portion, and a fuse element in electrical communication with the first and second conductor portions via at least one dual metal wire, the fuse element protected by a glass body bonded chemically to the dual metal wire.Type: GrantFiled: July 24, 2006Date of Patent: October 16, 2012Assignee: Littelfuse, Inc.Inventors: Stephen J. Whitney, Gordon Todd Dietsch, Christian Garcia, Daniel Onken, Janus Pagharion, Phil Shaw, Robert G. Swensen
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Patent number: 8076751Abstract: An integral circuit protection device includes a substrate disposed between first and second terminals. The substrate is composed of a resistive material. A first conductive layer is disposed on a first surface of the substrate and in electrical contact with the first terminal. A second conductive layer is disposed on a second surface of the substrate. A first electrically insulating layer is disposed on the second conductive layer and substantially covers the second conductive layer. The first electrically insulating layer includes an aperture. A fuse element is disposed on the first electrically insulating layer and is in electrical contact with the second conductive layer through the aperture and in electrical contact with the second terminal. The fuse element is in electrical series with the resistive material. A second electrically insulating layer is disposed over the fuse element.Type: GrantFiled: April 21, 2008Date of Patent: December 13, 2011Assignee: Littelfuse, Inc.Inventor: Stephen J. Whitney
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Patent number: 7952848Abstract: Electrostatic discharge protection, also known as ESD protection, is provided in the form of a discrete array with a voltage variable material (VVM) or a VVM device. The array is fabricated with a common electrode for connection to ground, and one or more electrodes configured for connection to an electrical component. The electrical component is a connector attached to an electrical circuit containing devices subject to damage by ESD events. The array is placed into a pocket or space on the connector and is held in place mechanically by spring force or by soldering to leads or electrodes of the connector. The array may be soldered to a ground connection or held in place by pressure, such as from a spring or from an outer housing or shell. In some embodiments, the array is removable from the component without affecting component circuits other than removal of ESD protection.Type: GrantFiled: April 4, 2008Date of Patent: May 31, 2011Assignee: Littelfuse, Inc.Inventors: Jeffery A. Whalin, Maxwill Bassler, Ramon Leon, Timothy E. Pachla, Stephen J. Whitney
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Publication number: 20100245025Abstract: A surface mount fuse in one embodiment includes an insulative body, first and second conductive and caps attached to the insulative body, each end cap defining an aperture, and a fuse element extending (i) through the insulative body and the apertures and (ii) along outside surfaces of the first and second conductive end caps in such a way that solder used to attach the first and second conductive end caps to an external medium also fastens the fuse element to the first and second end caps.Type: ApplicationFiled: March 25, 2009Publication date: September 30, 2010Applicant: Littelfuse, Inc.Inventors: Conrado de Leon, Gordon T. Dietsch, Edgardo Olan, John Emannuel Semana, John Song, Stephen J. Whitney
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Publication number: 20100090792Abstract: In one aspect of the present invention, subminiature fuses are soldered to a PCB via clips attached to the fuse end caps. The clips are physically attached to the PCB pads, enabling the fuse to be replaced if needed and providing thermal decoupling between the fuse and the heating sinking solder/PCB pads. The fuse and clips can also be picked and placed in one operation. In another aspect, improved fuse clips are provided that include tabs that separate the housing portions of the clips from the heating sinking solder/PCB pads. Such improved clips further enhance thermal decoupling. In a further aspect, an improved fuse is provided, in which the thermal decoupling tabs just described are provided directly with the fuse. In yet a further aspect, a thermally insulative fuse body is provided to further decouple the fuse element from its surroundings.Type: ApplicationFiled: June 12, 2009Publication date: April 15, 2010Applicant: Littelfuse, Inc.Inventors: Stephen J. Whitney, Gordon T. Dietsch, Vincent Minh-Tu Tran
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Publication number: 20100066477Abstract: A fuse element includes a substrate disposed between first and second terminals. The substrate includes an electrically insulative material. A conductive film is disposed on a first surface of the substrate and in electrical contact with the first terminal and second terminals.Type: ApplicationFiled: April 17, 2009Publication date: March 18, 2010Applicants: Littlefuse, Inc., Purdue Technology CenterInventors: Stephen J. Whitney, William Travis, Jeffrey P. Youngblood, Sarah M. Book, Edward D. Barriball, Milea J. Kittle
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Patent number: 7643265Abstract: A gas-filled surge arrester includes at least two electrodes, a gas filling and an activating compound applied to at least one of said electrodes. The activating compound can include: (i) nickel powder in an amount of about 10% to about 35% by weight; (ii) potassium or sodium silicate in an amount of about 20% to about 40% by weight; (iii) titanium powder in an amount of about 5% to about 25% by weight; (iv) calcium titanium oxide in an amount of about 5% to about 15% by weight; and (v) sodium bromide in an amount of about 10% to about 20% by weight. Ignition striping process and resulting stripes from ink-jetting of striping material are disclosed.Type: GrantFiled: September 14, 2006Date of Patent: January 5, 2010Assignee: Littelfuse, Inc.Inventors: Kelvin Loader, Stephen J. Whitney
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Patent number: 7636028Abstract: Electrical fuse indicators which may be used to diagnose and identify a fault state or failure mode of the electrical fuse include in various exemplary embodiments, indicator materials such as a reactive material, which are incorporated into various fuse indicator devices to cooperate with a visually perceptible indicator portion or layer to indicate the failure mode or fault state if the electrical fuse.Type: GrantFiled: July 20, 2006Date of Patent: December 22, 2009Assignee: Littelfuse, Inc.Inventors: William G. Rodseth, Stephen J. Whitney
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Publication number: 20090261451Abstract: An integral circuit protection device includes a substrate disposed between first and second terminals. The substrate is composed of a resistive material. A first conductive layer is disposed on a first surface of the substrate and in electrical contact with the first terminal. A second conductive layer is disposed on a second surface of the substrate. A first electrically insulating layer is disposed on the second conductive layer and substantially covers the second conductive layer. The first electrically insulating layer includes an aperture. A fuse element is disposed on the first electrically insulating layer and is in electrical contact with the second conductive layer through the aperture and in electrical contact with the second terminal. The fuse element is in electrical series with the resistive material. A second electrically insulating layer is disposed over the fuse element.Type: ApplicationFiled: April 21, 2008Publication date: October 22, 2009Applicant: Littlefuse, Inc.Inventor: Stephen J. Whitney
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Publication number: 20090251841Abstract: Electrostatic discharge protection, also known as ESD protection, is provided in the form of a discrete array with a voltage variable material (VVM) or a VVM device. The array is fabricated with a common electrode for connection to ground, and one or more electrodes configured for connection to an electrical component. The electrical component is a connector attached to an electrical circuit containing devices subject to damage by ESD events. The array is placed into a pocket or space on the connector and is held in place mechanically by spring force or by soldering to leads or electrodes of the connector. The array may be soldered to a ground connection or held in place by pressure, such as from a spring or from an outer housing or shell. In some embodiments, the array is removable from the component without affecting component circuits other than removal of ESD protection.Type: ApplicationFiled: April 4, 2008Publication date: October 8, 2009Applicant: Littelfuse, Inc.Inventors: Jeffery A. Whalin, Maxwill Bassler, Ramon Leon, Timothy E. Pachla, Stephen J. Whitney
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Patent number: 7564337Abstract: In one aspect of the present invention, subminiature fuses are soldered to a PCB via clips attached to the fuse end caps. The clips are physically attached to the PCB pads, enabling the fuse to be replaced if needed and providing thermal decoupling between the fuse and the heating sinking solder/PCB pads. The fuse and clips can also be picked and placed in one operation. In another aspect, improved fuse clips are provided that include tabs that separate the housing portions of the clips from the heating sinking solder/PCB pads. Such improved clips further enhance thermal decoupling. In a further aspect, an improved fuse is provided, in which the thermal decoupling tabs just described are provided directly with the fuse. In yet a further aspect, a thermally insultive fuse body is provided to further decouple the fuse element from its surroundings.Type: GrantFiled: March 3, 2005Date of Patent: July 21, 2009Assignee: Littelfuse, Inc.Inventors: Stephen J. Whitney, Gordon T. Dietsch, Vincent Minh-Tu Tran