Abstract: A device with a first MEMS device and a second MEMS device is disclosed. The first MEMS device is configured to sense at least one external influence. The second MEMS device is responsive to the at least one external influence. The first MEMS device is configured to change a state when the at least one external influence exceeds a threshold value. The first MEMS device is configured to retain the state below the threshold value, wherein the change in state of the first MEMS device is done passively and wherein the state of the first MEMS device is indicative of a status of the second MEMS device. In one example, the first MEMS device further comprises a normally open switch that closes when the external influence exceeds the threshold value.

Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.

Abstract: A device with a first MEMS device and a second MEMS device is disclosed. The first MEMS device is configured to sense at least one external influence. The second MEMS device is responsive to the at least one external influence. The first MEMS device is configured to change a state when the at least one external influence exceeds a threshold value. The first MEMS device is configured to retain the state below the threshold value, wherein the change in state of the first MEMS device is done passively and wherein the state of the first MEMS device is indicative of a status of the second MEMS device.

Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.

Abstract: The present invention is directed toward a device and system having a sensor hub capable of receiving measurement outputs from a plurality of sensors and processing the measurements for output to other devices, from a single chip arrangement. The sensor hub provides for facilitating efficient communication among the sensors for improved high-level features, such as interpreting gestures or actions according to the context.

Abstract: A system and/or method for efficiently operating a MEMS gyroscope without drive circuitry and/or with drive circuitry and a non-constant oscillating amplitude. In a non-limiting example, drive circuitry may be utilized to drive the MEMS gyroscope proof mass to a desired oscillating amplitude, and then the drive circuitry may be powered off. Rotational velocity may be sensed while the proof mass is being driven to a desired oscillating amplitude, while the proof mass is being maintained at a desired oscillating amplitude, and/or while the proof mass amplitude decays.

Abstract: A package combining a MEMS substrate, a CMOS substrate and another MEMS substrate in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first MEMS substrate and a CMOS substrate with a first surface and a second surface and where the first MEMS substrate is attached to the first surface of the CMOS substrate. The package further includes a second MEMS substrate with a first surface and a second surface, where the first surface of the second MEMS substrate is attached to the second surface of the CMOS substrate and the second surface of the second MEMS substrate is attached to a packaging substrate. The first MEMS substrate, the CMOS substrate, the second MEMS substrate and the packaging substrate are provided with electrical inter-connects.

Abstract: A system and method for providing and/or controlling air flow to an air sensor. As a non-limiting example, an air sensor system may include mechanical and/or electromechanical features (e.g., MEMS features) to control air flow to an air sensor. Various aspects of the disclosure may, for example, be implemented in a personal electronic device.

Abstract: Systems and methods are disclosed for implementing optical image stabilization (OIS) in a mobile device. One or more functions associated with OIS may be performed by hardware and/or processing resources that are provided independently of a camera unit.

Abstract: Disclosed herein are methods of identifying small molecule compounds that are likely to be OGG1 inhibitors, kits that facilitate the performance of the methods, and methods of inhibiting OGG1 in vitro and in vivo.

Abstract: A package combining a MEMS substrate, a CMOS substrate and another MEMS substrate in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first MEMS substrate and a CMOS substrate with a first surface and a second surface and where the first MEMS substrate is attached to the first surface of the CMOS substrate. The package further includes a second MEMS substrate with a first surface and a second surface, where the first surface of the second MEMS substrate is attached to the second surface of the CMOS substrate and the second surface of the second MEMS substrate is attached to a packaging substrate. The first MEMS substrate, the CMOS substrate, the second MEMS substrate and the packaging substrate are provided with electrical inter-connects.

Abstract: A system and method for providing a chip scale package of a MEMS device are disclosed. The system is a chip scale package (CSP) that comprises a substrate, a cap substrate, a MEMS device substrate bonded to and located between both the substrate and the cap substrate, at least one solder ball, and a via support structure coupled to both the at least one solder ball and the substrate, wherein the MEMS device substrate and the cap substrate are mechanically isolated from the at least one solder ball. The method comprises coupling a MEMS device substrate to a cap substrate, forming at least one insulated via through both the MEMS device substrate and the cap substrate, providing singulation of the cap substrate to provide a via support structure that surrounds the at least one insulated via, and coupling at least one solder ball to the via support structure.

Abstract: A device with a first MEMS device and a second MEMS device is disclosed. The first MEMS device is configured to sense at least one external influence. The second MEMS device is responsive to the at least one external influence. The first MEMS device is configured to change a state when the at least one external influence exceeds a threshold value. The first MEMS device is configured to retain the state below the threshold value, wherein the change in state of the first MEMS device is done passively and wherein the state of the first MEMS device is indicative of a status of the second MEMS device.

Abstract: A MEMS device is disclosed. The MEMS device comprises a first plate with a first surface and a second surface; and an anchor attached to a first substrate. The MEMS device further includes a second plate with a third surface and a fourth surface attached to the first plate. A linkage connects the anchor to the first plate, wherein the first plate and second plate are displaced in the presence of an acoustic pressure differential between the first and second surfaces of the first plate. The first plate, second plate, linkage, and anchor are all contained in an enclosure formed by the first substrate and a second substrate, wherein one of the first and second substrates contains a through opening to expose the first surface of the first plate to the environment.

Abstract: A system and/or method for efficiently operating a MEMS gyroscope without drive circuitry and/or with drive circuitry and a non-constant oscillating amplitude. In a non-limiting example, drive circuitry may be utilized to drive the MEMS gyroscope proof mass to a desired oscillating amplitude, and then the drive circuitry may be powered off. Rotational velocity may be sensed while the proof mass is being driven to a desired oscillating amplitude, while the proof mass is being maintained at a desired oscillating amplitude, and/or while the proof mass amplitude decays.

Abstract: A system and method for providing and/or controlling air flow to an air sensor. As a non-limiting example, an air sensor system may include mechanical and/or electromechanical features (e.g., MEMS features) to control air flow to an air sensor. Various aspects of the disclosure may, for example, be implemented in a personal electronic device.

Abstract: A method and system for a device with a magnetic sensor element and magnetic storage elements is disclosed. The device includes an integrated circuit substrate. At least a magnetic sensor with a magnetic sensor element with a permanent magnet is disposed over the integrated circuit substrate. A plurality of magnetic storage elements, each with at least one permanent magnet is disposed over the integrated circuit substrate.

Abstract: In a first aspect, an oscillator is disclosed. The oscillator comprises a digital circuit; and at least one Microelectromechanical system (MEMS) resonator. The oscillator includes a non-volatile memory, the non-volatile memory (NVM) storing a frequency value related to a resonant frequency of the at least one MEMS resonator. The digital circuit utilizes the frequency value stored in the NVM to provide a measure of real time from the MEMS resonator. In a second aspect, a system is disclosed. The system includes a processor and at least one Microelectromechanical system (MEMS) resonator operating at first frequency. The system also includes a memory. The memory storing a frequency value related to a resonant frequency of the at least one MEMS resonator. The frequency value is measured by an outside source. The processor utilizes the frequency value stored in the memory to provide a measure of real time from the MEMS resonator.

Abstract: A method for protecting a boat hull is provided. A first polymer thermal spray coating is applied to a surface of a boat hull and to a rigid member. The rigid member is placed at a desired location on the surface of the boat hull. The rigid member is heated such that the first polymer thermal spray coating adhesively bonds the rigid member to the surface of the boat hull.

Abstract: Parameters, such as, quality factor and/or resonance frequency of an acoustic transducer can be electrically tuned. The acoustic transducer can include a piezoelectric layer deposited on a silicon supporting layer, a first electrode layer deposited on the piezoelectric layer, and a second electrode layer deposited between the silicon supporting layer and piezoelectric layer. In one aspect, a resonant frequency of the piezoelectric actuated transducer is electrically tuned based on modifying a voltage across at least a portion of the first electrode layer and the second electrode layer. In another aspect, a quality factor of the piezoelectric actuated transducer is electrically tuned based on modifying a resistance across at least another portion of the first electrode layer and the second electrode layer.