Abstract: A shielded interconnect bus crossover useful in interconnecting MEM devices with control signal sources or the like and a method of fabricating such a shielded interconnect bus crossover are disclosed. In one embodiment, a shielded interconnect bus crossover (10) includes a plurality of base pads (44A-C) and a plurality of support columns (74) extending upward from the base pads (44A-C) through holes formed in an interconnect bus shield (78) overlying a plurality of interconnect bus lines (42). The support columns (74) support a two layer elevated crossing line (92/112) in a spaced relation above the interconnect bus shield (78). The two layer elevated crossing line (92/112) is oriented transverse to the direction of the interconnect bus lines (42) and is located within the perimeter of a two layer rectangular crossing line shield wall (96/116).

Abstract: A microelectromechanical system is disclosed that constrains the direction of a force acting on a first load, where the force originates from the interaction of the first load and a second load. In particular, the direction of a force acting on the first load is caused to be substantially parallel with a motion of the first load. This force direction constraint is achieved by a force isolator microstructure that contains no rubbing or contacting surfaces. Various embodiments of structures/methods to achieve this force direction constraint using a force isolator microstructure are disclosed.

Abstract: A microelectromechanical system is disclosed that has a connector (444) between an elongate coupling/tether (400) and an elevation structure (382) that is movably interconnected with an appropriate substrate (380). A first free end (392) of the elevation structure (382) moves at least generally away from or toward the substrate (380), depending upon the direction of motion of an actuator assembly (464) that is appropriately interconnected with the tether (400). Part of the connector (444) is in compression and another part of the connector (444) is in tension, regardless of whether a pulling or pushing force is being exerted on the tether (400), and thereby the connector (444), by the actuator assembly (464).

Abstract: A multi-level shielded multi-conductor interconnect bus for use in interconnecting MEM devices with control signal sources and a method of fabricating a multi-level shielded multi-conductor interconnect bus are disclosed. In one embodiment, a multi-level shielded interconnect bus (410A) formed on a substrate (20) includes first and second level electrically conductive lines (42, 92) arranged in sets of one, two or more conductive lines between first and second level electrically conductive shield walls (46, 66, 96). The first and second level electrically conductive lines (42, 92) are surrounded by various layers of dielectric material (30, 50, 80, 100). A first level electrically conductive shield (78) overlies the first level electrically conductive lines (42) and shield walls (46, 66). A second level electrically conductive shield (112) overlies the second level electrically conductive lines (92) and shield walls (96).

Abstract: The present invention provides a free space optical cross connect for switching optical signals between a plurality of optical signal ports to/from the switch interface. In one embodiment, a single chip 2N OXC (10) for switching optical signals (12) between any one of N input optical fibers (14) and any one of N output optical fibers (16) within a compact free space switch interface (18) includes N reflective microstructures (20) built/assembled on a substrate (30) and N positioning systems (40) associated with the reflective microstructures (20) that are also built/assembled on the substrate (30).

Abstract: A microelectromechanical system is disclosed that uses a stiff tether between an actuator assembly and a lever that is interconnected with an appropriate substrate such that a first end of the lever may move relative to the substrate, depending upon the direction of motion of the actuator assembly. Any appropriate load may be interconnected with the lever, including a mirror for any optical application.

Abstract: A microelectromechanical system is disclosed that constrains the direction of a force acting on a first load, where the force originates from the interaction of the first load and a second load. In particular, the direction of a force acting on the first load is caused to be substantially parallel with a motion of the first load. This force direction constraint is achieved by a force isolator microstructure that contains no rubbing or contacting surfaces. Various embodiments of structures/methods to achieve this force direction constraint using a force isolator microstructure are disclosed.

Abstract: A shielded multi-conductor interconnect bus for use in interconnecting MEM devices with control signal sources or the like and a method of fabricating a shielded multi-conductor interconnect bus are disclosed. In one embodiment, a shielded interconnect bus formed on a substrate (20) includes a plurality of electrically conductive lines (42) arranged in sets of one, two or more conductive lines between electrically conductive shield walls (46, 66). The electrically conductive lines (42) are surrounded by layers of dielectric material (30, 50). An electrically conductive shield (78) overlies the electrically conductive lines (42) and electrically conductive shield walls (46, 66).

Abstract: A shielded interconnect bus crossover useful in interconnecting MEM devices with control signal sources or the like and a method of fabricating such a shielded interconnect bus crossover are disclosed. In one embodiment, a shielded interconnect bus crossover (10) includes a plurality of base pads (44A-C) and a plurality of support columns (74) extending upward from the base pads (44A-C) through holes formed in an interconnect bus shield (78) overlying a plurality of interconnect bus lines (42). The support columns (74) support a two layer elevated crossing line (92/112) in a spaced relation above the interconnect bus shield (78). The two layer elevated crossing line (92/112) is oriented transverse to the direction of the interconnect bus lines (42) and is located within the perimeter of a two layer rectangular crossing line shield wall (96/116).

Abstract: A microelectromechanical system is disclosed that provides amplified movement without requiring the use of a displacement multiplier. Generally, a lever or the like is interconnected with a substrate on which the system is fabricated at a first location, while a free end of the lever is able to move relative to the substrate, typically at least generally about the first location. One or more actuators are movably interconnected with the substrate, and in turn are interconnected with the lever at a location that is somewhere between the free end and the first location. The lever may be configured to move at least generally away from the substrate upon movement of the actuator in one direction, at least generally toward the substrate upon movement of the actuator in another direction, or in any direction and in any manner. The movement of the “free” end of the lever may be used to perform any function, including lifting/pivoting a mirror away from/relative to the substrate.

Abstract: A multi-level shielded multi-conductor interconnect bus for use in interconnecting MEM devices with control signal sources and a method of fabricating a multi-level shielded multi-conductor interconnect bus are disclosed. In one embodiment, a multi-level shielded interconnect bus (410A) formed on a substrate (20) includes first and second level electrically conductive lines (42, 92) arranged in sets of one, two or more conductive lines between first and second level electrically conductive shield walls (46, 66, 96). The first and second level electrically conductive lines (42, 92) are surrounded by various layers of dielectric material (30, 50, 80, 100). A first level electrically conductive shield (78) overlies the first level electrically conductive lines (42) and shield walls (46, 66). A second level electrically conductive shield (112) overlies the second level electrically conductive lines (92) and shield walls (96).

Abstract: A microelectromechanical system is disclosed that constrains the direction of a force acting on a first load, where the force originates from the interaction of the first load and a second load. In particular, the direction of a force acting on the first load is caused to be substantially parallel with a motion of the first load. This force direction constraint is achieved by a force isolator microstructure that contains no rubbing or contacting surfaces. Various embodiments of structures/methods to achieve this force direction constraint using a force isolator microstructure are disclosed.

Abstract: A microelectromechanical system is disclosed that has a connector (444) between an elongate coupling/tether (400) and an elevation structure (382) that is movably interconnected with an appropriate substrate (380). A first free end (392) of the elevation structure (382) moves at least generally away from or toward the substrate (380), depending upon the direction of motion of an actuator assembly (464) that is appropriately interconnected with the tether (400). Part of the connector (444) is in compression and another part of the connector (444) is in tension, regardless of whether a pulling or pushing force is being exerted on the tether (400), and thereby the connector (444), by the actuator assembly (464).

Abstract: The present invention provides a MEM system (10) having a platform (14) that is both elevatable from the substrate (12) on which it is fabricated and tiltable with one, two or more degrees of freedom with respect to the substrate (12). In one embodiment, the MEM system (10) includes the platform (14), a pair of A-frame structures (40), and two pairs of actuators (30) formed on the substrate (12). Ends (46A) of rigid members (46) extending from apexes (40A) of the A-frame structures (40) are attached to the platform (14) by compliant members (48A, 48B). The platform (14) is also attached to the substrate (12) by a compliant member (48C). The A-frame structures (40) are separately pivotable about bases (40B) thereof. Each pair of actuators (30) is coupled through a yoke (32) and displacement multiplier (34) to one of the A-frame structures (40) and is separately operable to effect pivoting of the A-frame structures (40) with respect to the substrate (12) by equal or unequal angular amounts.

Abstract: The present invention provides a free space optical cross connect for switching optical signals between a plurality of optical signal ports to/from the switch interface. In one embodiment, a single chip 2N OXC (10) for switching optical signals (12) between any one of N input optical fibers (14) and any one of N output optical fibers (16) within a compact free space switch interface (18) includes N reflective microstructures (20) built/assembled on a substrate (30) and N positioning systems (40) associated with the reflective microstructures (20) that are also built/assembled on the substrate (30).