Abstract: High intensity ultrasound is used for pipeline obstruction remediation. Ultrasound transducers are positioned around an outside of the pipeline. The transducers transmit acoustic energy into the obstruction. The acoustic energy heats the obstruction at a location spaced away from the walls of the pipeline. As the obstruction heats, an opening may be formed in the obstruction, relieving pressure build-up without releasing the plug.

Abstract: Therapy control and/or monitoring is performed with an ultrasound scanner. The ultrasound scanner detects temperature to monitor therapy, and perform HIFU beam location refocusing of the therapy system based on the temperature. The monitoring is synchronized with the therapy using a trigger output of the ultrasound scanner. The trigger output responds to a scan sequence of the ultrasound scanner. To meet a given therapy plan, the scan sequence is customized, resulting in the customized trigger sequence. Three dimensional or multi-planar reconstruction rendering is used to represent temperature for monitoring feedback. The temperature at locations not being treated may be monitored. If the temperature has an undesired characteristic (e.g., too high), then the therapy is controlled by ceasing, at least temporarily.

Abstract: A method for cement bond logging and targeted intervention, including lowering a cylindrical n×m array of ultrasound (US) transducers into a well, firing the US transducers to transmit US signals into a well casing, converting reflected US signals received by the transducers into electronic form and transmit the converted signals to a control unit, analyzing the converted signals to detect holidays, if a holiday is detected, determining a position and angle of the holiday with respect to the transducers, and applying a high intensity focused ultrasound (HIFU) signal to the well casing to fill the holiday.

Abstract: Therapeutic ultrasound applicator is provided for use with magnetic resonance system. An array of many elements, such as a multi-dimensional array, is used. To avoid cabling, the transmitters are positioned at the array. The array and transmitters are shielded to reduce interference. To avoid large inductors for the many elements, an acoustic matching layer may be sized to provide a desired phase angle or electrical impedance matching.

Abstract: An acoustic array is helical or twisted about or around an azimuth axis. For example, one end of the array has an emitting face at 0 degrees, but the other end has an emitting face at 20 degrees. The elements in between gradually transition between the different rotations. Different apertures of the twisted array may be used to scan different generally radial diverging planes for three-dimensional imaging. The different amount of relative rotation associated with each aperture cause angular elevation spacing of the planes. For use in a catheter, a single row of elements may be used to scan electrically a volume.

Abstract: Using configurable arrays, synthetic aperture processes may be used along an elevation dimension for increasing resolution. The increased resolution is used for two-dimensional or three-dimensional imaging. Alternatively or additionally, wide band synthetic elevation aperture focusing processes, such as beamformation, are provided along the elevation dimension to increase resolution. In yet another alternative or additional embodiment, a transducer is rotated about a center of the transducer within the elevation and azimuth plane. An aperture associated with the transducer is mechanically or electronically rotated, and ultrasound data acquired associated with a plurality of different positions. The ultrasound data is then used for synthetic elevation aperture processing. In yet another alternative or additional embodiment, multiple scanning modes are provided. In a survey mode, imaging is provided without synthetic elevation aperture processing.

Abstract: CMUT elements are formed on a substrate. Electrical conductors are formed to interconnect between different portions of the substrate. The substrate is then separated into pieces while maintaining the electrical connections across the separation. Since the conductors are flexible, the separated substrate slabs may be positioned on a curved surface while maintaining the electrical interconnection between the slabs. Large curvatures may be provided, such as associated with forming a multidimensional transducer array for use in a catheter. The electrical interconnections between the different slabs and elements may allow for a walking aperture arrangement for three dimensional imaging.

Abstract: Multiple scanning modes are provided. In a survey mode, imaging is provided without synthetic elevation aperture processing. For greater detailed imaging, imaging is responsive to synthetic elevation aperture processes with different elevation focusing and scanning.

Abstract: A position of an imaging plane relative to a catheter or other probe is aligned with tissue of interest. Ultrasound tissue images may be registered to the catheter position with minimal rotational ambiguity. The spatial position of an ablation catheter or other device with respect to the imaging plane is more accurately determined, allowing a physician to identify specific anatomy in the relative location of a catheter or catheters. Another alternative or additional approach to determining the position of an imaging plane is to determine the relative position of two or more catheters. A catheter associated with imaging is then moved or bent in a direction having a known spatial relationship with the imaging plane. The position of the catheter is relative to each is then determined again to determine the angle or position of the imaging plane.

Abstract: A switching system includes at least one packet processing circuit interfacing with at least one packet transmission link. The switching system further includes a switch fabric coupled to the at least one packet processing circuit, whereby the switch fabric is operable to switch between channels receiving and transmitting data over the at least one packet transmission link and channels receiving and transmitting data over at least one non-packet transmission link interfaced by the switch fabric.

Abstract: CMUT elements are formed on a substrate. Electrical conductors are formed to interconnect between different portions of the substrate. The substrate is then separated into pieces while maintaining the electrical connections across the separation. Since the conductors are flexible, the separated substrate slabs may be positioned on a curved surface while maintaining the electrical interconnection between the slabs. Large curvatures may be provided, such as associated with forming a multidimensional transducer array for use in a catheter. The electrical interconnections between the different slabs and elements may allow for a walking aperture arrangement for three dimensional imaging.

Abstract: CMUT elements are formed on a substrate. Electrical conductors are formed to interconnect between different portions of the substrate. The substrate is then separated into pieces while maintaining the electrical connections across the separation. Since the conductors are flexible, the separated substrate slabs may be positioned on a curved surface while maintaining the electrical interconnection between the slabs. Large curvatures may be provided, such as associated with forming a multidimensional transducer array for use in a catheter. The electrical interconnections between the different slabs and elements may allow for a walking aperture arrangement for three dimensional imaging.

Abstract: Electrical interconnects are provided for CMUTs. For example, electrodes within the silicon substrate, such as the electrodes at the bottom of the void below membranes, are interconnected together within the substrate. The interconnected electrode may then be used as the grounding electrode. By providing interconnection within the substrate and below the membranes, space for vias and the associated connection between the electrodes on an exposed surface of the substrate is minimized. As another example, an electrical conductor is formed on the side of the silicon substrate rather than the top of the substrate. Conductors on the side may allow routing signals from a top surface to a bottom surface without large wire bonding pads. Alternatively, conductors on the edge provide additional space for wire bonding pads. As yet another example, polymer material used as a matching or protection layer is formed on the top surface of the CMUT with electrical traces routed within the polymer.

Abstract: A memory alloy is used during manufacture of a transducer. The memory of the alloy may correct for deviations or bending during manufacture, such as a superelastic alloy returning an array to a flat state after being twisted during handling. The memory of the alloy may cause a desired change in array geometry during manufacture, such as a shape memory alloy twisting an array into a curved or helix due to applied heat. The array may be fixed in place by the memory alloy or bonding after positioning by the memory alloy, preventing further substantial alteration.

Abstract: An acoustic array is helical or twisted about or around an azimuth axis. For example, one end of the array has an emitting face at 0 degrees, but the other end has an emitting face at 20 degrees. The elements in between gradually transition between the different rotations. Different apertures of the twisted array may be used to scan different generally radial diverging planes for three-dimensional imaging. The different amount of relative rotation associated with each aperture cause angular elevation spacing of the planes. For use in a catheter, a single row of elements may be used to scan electrically a volume.

Abstract: Methods and systems for obtaining ultrasound and sensing other patient characteristics are provided from summary. One or more sensors are provided in a same transducer probe as an array of elements. For example, sensors are formed on a same semiconductor substrate, such as a silicon substrate, as microelectromechanical devices or a capacitive membrane ultrasonic transducer (CMUT). As another example, a sensor is provided separate from or attached to transducer materials. Possible sensors include temperature, pressure, microphone, chemical and/or other sensors.

Abstract: Using configurable arrays, synthetic aperture processes may be used along an elevation dimension for increasing resolution. The increased resolution is used for two-dimensional or three-dimensional imaging. Alternatively or additionally, wide band synthetic elevation aperture focusing processes, such as beamformation, are provided along the elevation dimension to increase resolution. In yet another alternative or additional embodiment, a transducer is rotated about a center of the transducer within the elevation and azimuth plane. An aperture associated with the transducer is mechanically or electronically rotated, and ultrasound data acquired associated with a plurality of different positions. The ultrasound data is then used for synthetic elevation aperture processing. In yet another alternative or additional embodiment, multiple scanning modes are provided. In a survey mode, imaging is provided without synthetic elevation aperture processing.

Abstract: A switching system includes at least one packet processing circuit interfacing with at least one packet transmission link. The switching system further includes a switch fabric coupled to the at least one packet processing circuit, whereby the switch fabric is operable to switch between channels receiving and transmitting data over the at least one packet transmission link and channels receiving and transmitting data over at least one non-packet transmission link interfaced by the switch fabric.

Abstract: Methods and systems for obtaining ultrasound and sensing other patient charactristics are provided from summary. One or more sensors are provided in a same transducer probe as an array of elements. For example, sensors are formed on a same semiconductor substrate, such as a silicon substrate, as microelectromechanical devices or a capacitive membrane ultrasonic transducer (CMUT). As another example, a sensor is provided separate from or attached to transducer materials. Possible sensors include temperature, pressure, microphone, chemical and/or other sensors.

Abstract: A switching system includes at least one packet processing circuit interfacing with at least one packet transmission link. The switching system further includes a switch fabric coupled to the at least one packet processing circuit, whereby the switch fabric is operable to switch between channels receiving and transmitting data over the at least one packet transmission link and channels receiving and transmitting data over at least one non-packet transmission link interfaced by the switch fabric.