Abstract: A method of producing a circuit die where the method includes applying a pre-patterned backing tape to a first surface of a semiconductor substrate that includes the first surface and a second surface, the second surface including one or more circuits; coating the second surface with an encapsulant; removing a patterned portion of the pre-patterned backing tape to expose one or more contact pads on the first surface; applying one of an electrically conductive adhesive (ECA) or solder to the one or more contact pads on the first surface; and coupling an electrical component to the contact pads using the ECA or solder.

Abstract: An alignment recess formed in a cover substrate such as a cover for a MEMS device allows a second substrate to be bonded to the cover substrate. The alignment recess is larger than the second substrate and has two corner regions diagonally opposite each other where a wall of the recess protrudes to form a notch. The notch is dimensioned such that when the second substrate is disposed within the recess with two opposing corners surrounded by respective notches of the recess, the angular position of the second substrate relative to the cover substrate can be controlled to within a desired amount of rotation.

Abstract: A semiconductor device apparatus is provided. The apparatus includes a packaged semiconductor device mounted on a substrate. The packaged semiconductor device includes a semiconductor die having a controller configured to obtain a measured capacitance of a sensor capacitor, an encapsulant encapsulating the semiconductor die, and a first plate of the sensor capacitor formed at a bottom side of the packaged semiconductor device. A second plate of the sensor capacitor is formed at a top side of the substrate.

Abstract: Alignment features formed on a cover substrate allow for a second substrate to be bonded to the cover substrate while ensuring that the second substrate is not titled with respect to a plane defined by the alignment features. Die attachment material is patterned such that it deforms or flows underneath the second substrate while allowing corners of the second substrate to rest on landing areas that are elevated above the top surface of the cover substrate. Some of the landing areas may include additional features that are elevated above the landing areas to form notches which constrain the rotational position of the second in addition to its tilt.

Abstract: An electronic device has a molded package (e.g., a quad flat no leads package) with attached connectors. The molded package includes one or more semiconductor dies and is pretested prior to attachment of the connectors. Along these lines, such molded packages may be pretested in parallel at high volume due to their relatively small form factor (e.g., at numbers several times greater than those for testing leaded socket assemblies). Following such pretesting, the connectors are attached to the pretested molded package (e.g., by directly fusing the connectors to metallic pads on surfaces of the packaged integrated circuit via laser welding or soldering). Such electronic devices may be further tested if desired (e.g., opens/shorts tested) and encased within housings to form larger modules (e.g., accelerometers, pressure sensors, etc.).

Abstract: A method of manufacturing a semiconductor device with an attached battery is provided. The method includes affixing a semiconductor die to a die pad region of a first battery lead of a leadframe. The first battery lead of the leadframe is separated from a second battery lead of the leadframe. An encapsulant encapsulates the semiconductor die and portions of the first and second battery leads of the leadframe. The battery is affixed to an exposed portion of the first battery lead of the leadframe such that a first terminal of the battery is conductively connected to the first battery lead. An exposed portion of the second battery lead of the leadframe is bent to overlap a top surface portion of the battery such that a second terminal of the battery conductively connected to the second battery lead.

Abstract: A method of manufacturing a semiconductor device with an attached battery is provided. The method includes affixing a semiconductor die to a die pad region of a first battery lead of a leadframe. The first battery lead of the leadframe is separated from a second battery lead of the leadframe. An encapsulant encapsulates the semiconductor die and portions of the first and second battery leads of the leadframe. The battery is affixed to an exposed portion of the first battery lead of the leadframe such that a first terminal of the battery is conductively connected to the first battery lead. An exposed portion of the second battery lead of the leadframe is bent to overlap a top surface portion of the battery such that a second terminal of the battery conductively connected to the second battery lead.

Abstract: A method of manufacturing a packaged semiconductor device is provided. The method includes affixing a sensor system to a die pad portion of a leadframe. A battery is affixed to the lead frame including a first terminal of the battery affixed to a first leg of the leadframe and a second terminal of the battery affixed to a second leg of the leadframe. An encapsulant encapsulates the sensor system, battery, and leadframe.

Abstract: A method of manufacturing a packaged semiconductor device is provided. The method includes affixing a sensor system to a die pad portion of a leadframe. A battery is affixed to the lead frame including a first terminal of the battery affixed to a first leg of the leadframe and a second terminal of the battery affixed to a second leg of the leadframe. An encapsulant encapsulates the sensor system, battery, and leadframe.

Abstract: A self-powered microelectronic semiconductor device includes low temperature interconnection and encapsulation materials to enable integration of a battery with the microelectronics package during manufacture. The package includes a partially exposed leadframe or leads of a substrate for connecting the battery. The battery includes one or more terminal connectors that can either be manufactured by the battery vendor or externally attached using spot/laser or resistance welding. The steps of connecting the battery to the package are performed after the microelectronic package assembly to ensure the battery does not experience any high temperatures from the package assembly process. Cavities are formed in an overmolded molding compound to expose the leadframe or battery pads for electronic connection. A low temperature electrically conductive bonding agent is used to create the electrical and mechanical bond of the battery tabs to the leadframe.

Abstract: An electronic package with a battery and method for producing the electronic package uses a bent leadframe having flanged ends that are physically and electrically connected to a substrate so that the battery is encircled by the bent leadframe and the substrate, and the substrate is positioned between the battery and an electronic component. A first terminal of the battery is physically and electrically connected to the substrate and a second terminal of the battery is physically and electrically connected to the bent leadframe, which provides an electrical connection between the battery and the electronic component.

Abstract: One or more sensor devices are encapsulated on a top surface of a carrier substrate within an elastomer material. The carrier substrate includes one or more recessed channels adjacent to each sensor device which are filled by a portion of the elastomer material to create flanged areas that are level with the top surface of the carrier substrate. A cover which can include a liquid or gas input port or other related structures can be placed over each sensor device and bonded to the carrier substrate at the flanged areas, creating a seal between the cover and the carrier substrate that surrounds each sensor device.

Abstract: Vibration isolation can be provided for a vibration sensitive component to be bonded to electronic circuit boards or other surfaces by an assembly that includes two substrates with rigid portions that are electrically coupled to each other via a flexible interconnect. The rigid portions of the two substrates are bonded together via an elastic structure in a stacked arrangement with the first substrate above the second substrate. The flexible interconnect electrically couples the first substrate to the second substrate and the second substrate is configured to be bonded and electrically coupled to an electronic circuit board or other larger substrate via contacts on a surface of the rigid portion of the second substrate. The vibration sensitive component can be bonded to the rigid portion of the first substrate and couped to the flexible interconnect via the first substrate, thereby coupling it to the second substrate and the larger substrate.

Abstract: Alignment features formed on a cover substrate allow for a second substrate to be bonded to the cover substrate while ensuring that the second substrate is not titled with respect to a plane defined by the alignment features. Die attachment material is patterned such that it deforms or flows underneath the second substrate while allowing corners of the second substrate to rest on landing areas that are elevated above the top surface of the cover substrate. Some of the landing areas may include additional features that are elevated above the landing areas to form notches which constrain the rotational position of the second in addition to its tilt.

Abstract: An alignment recess formed in a cover substrate such as a cover for a MEMS device allows a second substrate to be bonded to the cover substrate. The alignment recess is larger than the second substrate and has two corner regions diagonally opposite each other where a wall of the recess protrudes to form a notch. The notch is dimensioned such that when the second substrate is disposed within the recess with two opposing corners surrounded by respective notches of the recess, the angular position of the second substrate relative to the cover substrate can be controlled to within a desired amount of rotation.

Abstract: A multidevice package includes upper and lower surfaces with the lower surface disposed beneath a first die forming part of the package. The lower surface includes a first a set of electrical contacts and a recessed region with a second set of electrical contacts configured to allow a second die to be coupled to the lower surface and electrically coupled to the first die via the second set of contacts. The recessed region is sufficiently recessed to allow the package to be coupled to a mounting surface such as a printed circuit board via the first set of contacts while the second die remains suspended above the mounting surface.

Abstract: A device package includes a die that includes a substrate having first and second surfaces. A sensor is formed at a sensor region of the first surface. A trench extends entirely through the substrate between the first and second surfaces, in which the trench at least partially surrounds the sensor region. An isolation material, formed at the first surface, may extend across the trench A ring structure is coupled to the first surface of the substrate to create a first cavity in which the sensor is contained, the ring structure being laterally displaced away from and surrounding the sensor region and the trench. A molded compound body may abut an outer wall of the ring structure. The molded compound body has a second cavity that is concentric with the first cavity to enable fluid communication between the sensor and an environment external to the device package.

Abstract: A method of manufacturing a semiconductor device with an attached battery is provided. The method includes affixing a semiconductor die to a die pad region of a first battery lead of a leadframe. The first battery lead of the leadframe is separated from a second battery lead of the leadframe. An encapsulant encapsulates the semiconductor die and portions of the first and second battery leads of the leadframe. The battery is affixed to an exposed portion of the first battery lead of the leadframe such that a first terminal of the battery is conductively connected to the first battery lead. An exposed portion of the second battery lead of the leadframe is bent to overlap a top surface portion of the battery such that a second terminal of the battery conductively connected to the second battery lead.

Abstract: A semiconductor device package having stress isolation is provided. The semiconductor device package includes a package substrate and a sensor attached to the package substrate. A first isolation material is formed around a perimeter of the sensor. An encapsulant encapsulates at least a portion of the first isolation material and the package substrate.

Abstract: A method of manufacturing a packaged semiconductor device is provided. The method includes affixing a sensor system to a die pad portion of a leadframe. A battery is affixed to the lead frame including a first terminal of the battery affixed to a first leg of the leadframe and a second terminal of the battery affixed to a second leg of the leadframe. An encapsulant encapsulates the sensor system, battery, and leadframe.