Abstract: A packaged semiconductor device includes: a substrate; an semiconductor die attached to a top surface of the substrate; a mold body surrounding the semiconductor die; a tiered through mold via (TMV) comprising: a first recess having a recessed surface within the mold body at a first depth, and a second recess from the recessed surface to a second depth that exposes a ground contact area on a bonding area on the top surface of the substrate, wherein the first depth is greater than the second depth; and a metal shielding layer formed on a top surface of the mold body to form a shielded mold body, wherein the metal shielding layer makes direct contact with at least one sidewall of the first recess, with at least a portion of the recessed surface, with at least one sidewall of the second recess, and with the ground contact area.

Abstract: A press-fit semiconductor device includes a lead frame having a die pad, leads with inner and outer lead ends, and a press-fit lead. The press-fit lead has a circular section between an outer lead end and an inner lead end, and the circular section has a central hole that is sized and shaped to receive a press-fit connection pin. A die is attached to the die pad and electrically connected to the inner lead ends of the leads and the inner lead end of the press-fit lead. The die, electrical connections and inner lead ends are covered with an encapsulant that forms a housing. The outer lead ends of the leads extend beyond the housing. The housing has a hole extending therethrough that is aligned with the center hole of the press-fit lead, so that a press-fit connection pin can be pushed through the hole to connect the device to a circuit board.

Abstract: A sensor module, such as an acceleration sensor module, includes a leaded socket assembly covered by a housing. The leaded socket assembly includes a dual gauge lead frame, a sensor die, and various passive devices. The sensor die and the passive devices are mounted on the lead frame, and then the lead frame, sensor die, and passive devices are over-molded to form the leaded socket assembly. Neither the sensor module nor the socket assembly includes a printed circuit board, so many conventional sensor module assembly steps are bypassed.

Abstract: A method of testing includes attaching a first and second die to first and second die sites of a lead frame and forming a plurality of wire bonds coupling a plurality of pins of the first die site to the first die and a plurality of pins of the second die site to the second die. The first and second die are encapsulated. An isolation cut is performed to isolate the plurality of pins of the first die site from the plurality of pins of the second die site, while maintaining electrical connection between the first tie bar of the first die site and the first tie bar of the second die site. The first and second die are tested while providing a first power supply source to the first and second die via the first tie bars. After testing, the dies sites are fully singulated to result in packaged IC device.

Abstract: A method and structure that protects interior electrical components of a pressure sensor (4) from corrosive particles using a sacrificial gel dome (30) to form a vent (34) in a protective gel (32) that covers electrical components that can be corroded such as wires (16), bond pads (18), and electrical leads (14). Sacrificial gel dome (30) is dispensed over a diaphragm (28) of pressure sensor (4) to form vent (34) enabling diaphragm (28) to sense pressure variations without the influence of protective gel (32). Sacrificial gel dome (30) is removed through a water rinsing process (42) to expose vent (34).

Abstract: A method and structure that protects interior electrical components of a pressure sensor (4) from corrosive particles using a sacrificial gel dome (30) to form a vent (34) in a protective gel (32) that covers electrical components that can be corroded such as wires (16), bond pads (18), and electrical leads (14). Sacrificial gel dome (30) is dispensed over a diaphragm (28) of pressure sensor (4) to form vent (34) enabling diaphragm (28) to sense pressure variations without the influence of protective gel (32). Sacrificial gel dome (30) is removed through a water rinsing process (42) to expose vent (34).